TW435059B - Electronic component package with decoupling capacitors completely within die receiving cavity of substrate - Google Patents
Electronic component package with decoupling capacitors completely within die receiving cavity of substrate Download PDFInfo
- Publication number
- TW435059B TW435059B TW86103390A TW86103390A TW435059B TW 435059 B TW435059 B TW 435059B TW 86103390 A TW86103390 A TW 86103390A TW 86103390 A TW86103390 A TW 86103390A TW 435059 B TW435059 B TW 435059B
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- TW
- Taiwan
- Prior art keywords
- substrate
- cavity
- die
- capacitor
- electronic component
- Prior art date
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4 3505 9 A7 B7 五、發明説明(1 ) 發明背景 1 .發明領域 本發明通常與在基底上之諸解耦合電容器的安置有關。 2 .要解決的問 電子零件包裝一般皆使用基底:將諸多積體電路晶片黏裝 到基底。某些積體電路晶片皆需求比較大量的解耦合電容 °諸如:微處理器的—些積體電路晶片可能需求約丨〇 〇 n f( 毫微法拉)的解耦合電容。—般說來,這些晶片皆被黏裝到 基底’其中將晶片加以定位在:已形成在基底中之一空腔内 。這種基底通科爲11空腔基底"(CaVjty 。在空腔基底 中’一種用來提供解耦合電容的傳統式技術需要·使用已嵌 入基底中的諸多電容器層。在技藝上,這些層通稱爲I,薄帶 M(thin-tape)層。當這些層皆在"未加工、green)狀態,即:雖 已形成但未每燒(fired)中時;這些層一般就會有約1 . 〇與 經濟部中央標準局員工消費合作社印裝 (請先Μ讀背面之注意事項再填寫本頁) 3 . 0密耳(mil)之間的厚度,在每一邊上,這些層皆需要厚重 金屬鍍層(metalization)。於是,導因於極端細薄的各層, 以及在每—邊上皆需要大量的金屬以作諸多電極用;而以 既困難又昴貴的方式製造"薄帶"層。另—種傳統式技術則 疋.使用表面黏裝電容器。表面黏裝電容器遠不及"薄帶層" 昴貴。然而,一般説來,表面黏裝電容器與諸多基底輪廓 限制不相符。例如,在某些配置中,諸多表面黏裝電容器 可能突出於表面之上;在基底與晶片幾何形狀之間,藉以 產生一顯著的幾何形狀差異。這樣的結果就會要求_晶片適 合於一些較長的插銷或一特殊插座的座位備置平面(seating -4 - 本纸張尺度適用中國國家標準(CNS ) Α4規格(210X297公釐) 4 3 5 0 5 9 A7 B7 五、發明説明(2 ) plane) 3 一種傳統式電子零件包裝係披露於美國專利第5,2ι〇,683 號(簡稱:第68;5號專利)中,第6S3號專利敎導在一基底内 的諸多個別空腔中之諸電容器的安置。將每一空腔明確地 形成在基底中,用來只接收一個電容器。然而,如第6 8 3 號專利所敎導的,製造一種具有許多空腔之一基底是挺昴 貴的。而共同擁有的美國專利第5,〇81,563號則敎導在諸多 基底空腔内側安置一些晶片。然後,將諸多薄膜結構安置 在頂如之上,用來貫現晶片與其它零件的連接。然而,導 因於需求邊多薄膜結構,也會以昴貴的方式建構這種技術a 當在諸多空腔基底上併入解耦合電容時,就得考慮其它 重要因素。一個這種因素是:諸多電容器相對於晶片的位置 。譬如説,當儘可能接近晶片來安置一些電容器時,就會 獲得最佳效能。另一個因素是:最終基底設計與打算黏裝到 基底的實際晶片之幾何形狀的相容性。另一個因素是:在基 底上可用的空間,用於諸多電容器的安置。一般説來,當 將一些大尺寸積體電路晶片黏裝到基底時,就會限制這種 可用的空間3 經濟部中央榡準局員工消費合作社印裝 ---------^-----—ir (請先聞讀背面之注意事項存填寫本貢) 將先前技藝的諸多問題及缺陷加以牢記在心,因此,本 發明之一目的是:用來提供一種既新又已改良的電子零件包 裝,它具有已併入其中的解耦合電容。 本發明之另一目的是:用來提供一種既新又已改良的電子 零件包裝,它使用一種具有解耦合電容的基底;而且,它 係以不及傳統式電子零件包裝複雜的方式來製造的。 本纸張尺度適用中國國家標準(CNS ) A4規格(210X297公釐) 經濟部中央橾準局員工消费合作社印袋 435059 A7 B7 五、發明説明(3 ) 本發明之又一目的是:用來提供一種既新又已改良的電子 零件包裝’它利用一種具有解耦合電容的基底;而且,它 會提供最大量的2間’用來承接諸多積體電路晶片。 本發明之再一目的是:用來提供一種既新又已改良的電予 零件包裝,它使用一種具有解耦合電容的基底;而且,它 係以少於傳統式電子零件包裝花費的方式來製造的。 本發明還有的其它目的及優點,—部份將是顯然的;而 根據詳細説明書,一部份將是顯而易見的。 發明概要 在本發明中,會獲得:對熟習於此技藝者而言,將是顯而 易見的上述者及其它目的:在第一觀點方面,將本發明指 引到包括一基底的一種電子零件包裝,該基底具有:在其中 形成的至少一個晶粒承接腔;該空腔係由一晶粒承接表面 及具有一種台階式輪廓之一内側壁所界定的;基底具有與 二腔周圍接壤之一外表面,而内側壁則延伸在晶粒承接表 面與基底外表面之間;並且,完全在空腔内,將至少—個 電容器加以定位及黏裝到基底。 在另一觀點方面,本發明與—種電子零件包裝有關,該 包裝包括: 一基底,Έ:具有在其中形成的至少—個晶粒承接腔,該 i腔係由一晶粒承接表面及具有—種台階式輪廓之一内側 壁所界定的,基底具有與空腔周圍接壤之—外表面,而内 側壁則延伸在晶粒承接表面與基底外表面之間; 至少一個電容器,完全在空腔内,將它加以定位及黏裝 -6- ϋ及通用中國國家^ (CNS) A4規格(石0>< 2“釐-) -I —^^1 ^^^1 ............ h I- J- - I (請先閱讀背面之注意事項再填寫本頁) 'π 經濟部中央標準局員工消費合作社印袈 435059 五、發明说明(4 ) 到内侧壁之諸台階中的—個;以及 一封罩(lid),它附著於内侧壁之諸台階中的另一個,並 加以定位完全在空腔内,封罩被定位在電容器與晶粒承接 表面之間,並且延伸於晶粒承接表面之上。 在又一觀點方面,本發明涉及—種電子零件包裝,該包 裝包括: ~ 一基底,Η具有在其中形成的至少—個晶粒承接腔,該 空腔係由一晶粒承接表面及具有一種台階式輪廓之—内側 壁所界定的,基底具有與空腔周圍接壤之—外表面,而内 側壁則延伸在晶粒承接表面與基底外表面之間; 至少一個電容器,將它加以定位完全在空腔内,並黏裝 到晶粒承接表面;以及 一封罩,它附著於基底,並加以定位完全在空腔内,封 罩延伸於晶粒承接表面與電容器之上。 在又觀點方面,將本發明涉及到一種電子零件包裝, 該包裝包括 基底,它具有在其中形成的至少一個晶粒承接腔,該 仝腔係由一晶粒承接表面及具有一種台階式輪廓之一内側 壁所界定的,基底具有與空腔周圍接壤之一外表面,而内 側壁則延伸在晶粒承接表面與基底外表面之間; 土少一個電容器,完全在空腔内,將它加以定位及黏裝 到内側壁之諸台階中的—個;以及 封罩,將Έ:加以定位完全在空腔内,並附著於諸多台 階中的另一個,電容器係在封罩與晶粒承接表面之間, 本紙張尺度適用_家標^7^7^;格( (請先閲讀背面之注意事項再填寫本頁) 訂 4 3 5 0 5 9 經濟部中央橾準局員工消費合作社印裝 A7 B7 五、發明説明(5 ) 封罩-、] L伸於晶粒承接表面與電容器之上。 觀點方面,本發明涉及一種電子零件包裝,該包 裝包括: 一基屐,具有在其中形成的至少—晶粒承接腔,該空腔 係由—晶粒承接表面及具有—台階式輪廓之一内側壁所界 足,基底具有與空腔周圍接壤之一外表面,而内侧壁則延 伸在晶粒承接表面與基底外表面之間; 土>一電容器,完全位於空腔内且安裝於内侧壁諸台階 中之一台階;以及 罩,完全位於空腔内且黏接至諸台階中之另—台階 %谷器係在封罩與晶粒承接表面之間,而封罩則延伸於 晶粒承接表面與電容器之上。 附圖概述_ 本發月的諸多特點相信都是新奇的,並將本發明之特性 的諸少要素特別g示於所附的申請專利範圍中。兩個附圖 只供圖解説明之用,而且皆未按比例繪製。然而,本發明 本身,不但是關於組織,而且是操作方法,都將會因參考 遵循諸多附圖所採取的闡述而徹底瞭解。 圖1是:本發明的一種基底之一俯視平面圖。 圖2疋:沿著圖1的直線2 - 2所採取之一視圖。 諸多較佳實施例的描述 在描述本發明的較佳實施例中’此處將會參考諸多附圖 中的圖1和2,其中:同樣的數値指示本發明同樣的特點。 參考圖1和2,本發明的電子零件包裝1〇包括多層式基底 本紙浪尺度速用中關家標準(CNS) M規格(210><297公楚) ttn ^^^1 In— ^^^1 f m^i ^^^1 1· ^i ·, ' (請先閲讀背面之注意事項再填寫本頁) 435059 A7 B7 經濟部中央樣準局員工消费合作社印裳 五、發明説明(6 ) 1 2 ’它具有:在其中形成的空腔1 4。空腔丨4係由晶粒承接 表面1 6及内側壁丨8所界定的。表面]6會承接晶粒2〇,而 且其邊界立即與實質上垂直壁19接壤。如此處所使用的,,, 晶粒"(die)這名詞,指示:像從一片已精製加工晶圓 中所切割或切丁(dlced)之一積體電路晶片。基底12還包括: 圍繞著空腔1 4之周圍23或與它接壤的外表面22。 内側壁18具有一種台階式或,,階梯狀"(staircase)輪廓,並 且界定許多棚架(shelf),步階(step)或台階:24,26及28 ; 它們延伸在晶粒承接表面丨6與基底外表面2 2之間。每一台 階24,26及28實質上都是平整的,並且分別接近垂直壁區 段3 0,32及34。每一台階都包括:基底〗2之諸層中的一層 之一部份。將對此詳加討論於下。 諸多金屬佈線插銷(wiring pins)36皆以垂直方式延伸自外 表面22,並且皆被插入在一電路板(未示出)中的一些對應 開孔中。雖然使用了佈線插銷3 6 ;但是,可能會使用其它 型式的輸入/輸出(I/O)附著法’諸如:圓球,圓柱,焊接等 。將諸多引線接合整(wire bonding pads):38a,c,e,g和 38b ’ d,f,h分別附著於兩個台階24和26。引線21將晶粒20 連接到諸多引線接合塾:3 8 a到h 3諸多接合塾3 8 a到h可能 被連接到一些:插銷3 6,接地平面或電壓平面。而晶粒2 〇 也可能是一種倒裝晶片(flip chip),其中應該不需要一些引 線接合墊。 參考圖2,基底1 2包括:許多以水平方式堆疊的絕緣,信 號及參考電餐層。然而,各層的功能可能和這些的不同3 -9 - 本紙張尺度適用中國國家橾隼(CNS ) A4規格(210X297公釐〉 ---- n U ----- I. 尤衣---n -- -------訂 {請先閔讀背面之注意事項再填寫本育) 435059 A7 B7 〜 - -— - . -五、發明説明(7 ) 信號層皆包括佈線金屬鍍層。而諸如鄰接的信號層則皆由 一個或更多絕緣層加以隔開。三層:4 0,4 2及5 0皆爲已鍍 金屬重新分佈層(metalized redistribution layers)。兩層 ‘44 和5 2皆爲電接地層°而兩層:4 8和5 4則皆爲供給電壓層。 層56包括:以電方式接觸諸多預定重新分佈層的一些垂直導 電性直通管道(through-via)圓柱(未示出)。每—層都可能是 用氧化鋁(alumina),玻璃陶瓷或氮化鋁製成的。在層58中 的直通管道也以電方式接觸插銷36。將金屬鍍層6〇加以佈 署於層4 0之上,並充當作一種熱擴散器,雖然所顯示的包 裝10具有11層(10個基底層和層60),但要瞭解的是.包裝 ]〇可能具有像2層那樣少和像2 0 〇層那樣多的層。 再手考圖2 ’ £腔1 4係由形成基底1 2之諸層的部份所界 定的。晶粒承接表面1 6包括電接地層4 4的一部份。以這樣 一種方式形成空腔I4:三台階或棚架24,26及28分別由三 層48,52及54的邵份所形成。藉著:先將諸層46,48 , 5〇 ’ 5 2,5 4 ’ 5 6及5 8加以切割到預定長度,然後再將它們 附著在一起以形成基底12及空腔μ ;就可達成此目的。 經濟部中央標準局員工消费合作社印製 d^i ^^—^1 · I-Jci^, ---- ----- 1---1 V Jm. (請先閲讀背面之注意事項再填寫本頁) 在一較佳實施例中,將封蓋(cap)或封罩62(參看圖2)以 封缄方式附著於台階或棚架2 8,並佈署於晶粒2 〇之上,以 便產生一種密封式或非密封式封緘。如圖2中所示,封首 6 2係在分開的解耦合電容器6 4與晶粒2 〇之間。最好是,封 蓋62係由已電鍍KovarTM(科伐,一種鐵鎳鈷合金)’或氧化 鋁陶瓷所製造的。也可能將一些解耦合電容器㈧安置在封 蓋62内側,以及在諸多引線接合墊之間。也可以將電容器 -10- 本紙張^度i用中國國家標隼(CNs7a4規格(2I0‘X 297公瘦)~ --- 435059^ A7 _______ B7_ 五、發明説明(8 ) ό 4黏裝到鄰接晶粒2 〇的表面1 6。根據本發明,將諸多分立 解耦合電容器6 4附著於空腔内側壁丨8的台階或棚架2 8。這 樣一種配置允許:將解耦合電容器安置在非常接近於晶粒2 〇 處。再者,如圖2中所示的這樣—種配置會防止電容器64 突出超過基底12的外表面22 °於是,諸多電容器64與在一 電路板或卡上安置包裝I 〇相抵觸是不可能的。此外,經由 —些陶瓷基底層,將諸多電容器6 4連接到晶粒2 〇,藉以消 除薄膜結構的需要。 於是,本發明的電子零件包裝10之所以會達成諸多前述 目的,是因爲: a)包裝1 〇係以不及傳統式電子零件包裝複雜的方式來製 造的’因爲:只需求一個基底空腔來承接晶粒及一些解耦合 電容器; b )導因於包裝1 〇的設計簡單,而可能以比傳統式_電子零 件包裝良率(yields)還高的方式來製造包裝]^ ; c )就以上陳述的諸多理由而言,包裝I 0係以比較不昂貴 的方式來製造的; d) 包裝1 〇提供一比較大量的可用空間,用來承接諸多積 體電路晶片以及 經濟部中央標率局員工消費合作社印製 I m ....... : ^^^1 I— i IJR, I— -- -:-. n^i J *v'<, (诗先聞讀背面之注意事項再填寫本育) e) 包裝1 〇實質上消除了與一些電路板或卡相抵觸的可能 性,因爲:所有的解耦合電容器都在基底外表面22之下。 雖然已經特別地描述本發明以及一特定較佳實施例;可 是,顯然地,根據前述,對那些熟習於此技藝者而言,許 多替換方法,修改及變化都將是顯而易見的。因此而設想 -11 - 本紙張尺度適用中國圉家樣準(CNS)A4規格(210x297公趁) 4350 5 A7 B7五、發明説明(9 )的是:所附的申請專利範園將包含落入本發明之眞實範圍及 精神内的任何這種替換方法,修改及變化。於是,已經描述本發明,而申請專利範圍則是: ^—n - - ^^^1 -_-* ^^^1 I - —' \* ,"、V5 - · (請先閱讀背面之注意事項再填寫本頁) 經濟部中央標準局員工消費合作社印裳 -12- 本紙浪尺度適用中國國家標準(CNS ) A4規格(210X297公釐)
Claims (1)
- 4 35 0 5 9·. A8 第86103390號專利申請案 B8 中文申請專利範圍修正本(89年月)D8 _:正 ' -1 * ··* 經濟部t央樣隼局貝工洧费合作社印«. 六、申請專利範圍 1. 一種電子零件包裝,包括: 一基底,它具有在其中形成的至少一個晶粒承接腔’ 该S腔係由一晶粒承接表面及具有一種台階式輪廓之一 内側壁所界定的,基底具有與空腔周圍接壤之一外表面 ,而内側壁則延伸在晶粒承接表面與基底外表面之間; 以及 至少一個電容器,完全加以定位在空腔内,且將它黏 裝到位於該晶*装承接表面與該基底外表面之間之該内側 壁上。 2.根據申清專利範圍第1項之電子零件包裝,其中.將電容 器黏裝到内侧壁之台階式輪廓。 根據申請專利範圍第1項之電子零件包裝,還包括一封 罩’將它定位完全在空腔内,並附著於基底;封罩延伸 於晶粒承接表面之上且與該至少—個電容器分開。 4,根據申請專利範圍第3項之電子零件包装,其中:將電容 器黏裝到台階式輪廓,而封罩則是在電容器與晶粒承接 表面之間= 5.根據申清專利範圍第4項之電子零件包装,其中:將封罩 附著於黏裝有至少一電容器之台階式輪廓。 6‘根據申请專利範圍第1項之電子零件包装’其中:基底是 一種多層式陶瓷基底。 7.根據申清專利範園第6項之電子零件包装,其中多層式 陶走基底包括:堆疊成許多實質上平行的信號及絕緣層 ,該等信號層-之每一信號層皆包括一導電圖案。 (請先Μ讀背面之注意事項再填窝本頁) 訂 本紙涑尺度遘用f B國家揉準(CNS ) A4規格(2丨〇><297公釐 A8 B8 C8 D8 經濟部中央橾隼局具工消t合作社印装 六、申請專利範圍 8.根據申請專利範圍第7項之電子零件包裝,其中該平行 信號及絕緣層之每一者皆包含氧化鋁, 9-根據申清專利範圍第7項之電子零件包裝,其中該平行 信號及絕緣層之每一者皆包含氮化鋁。 10. 伴據申請專利範圍第7項之電子零件包裝,其中該平行 "is號及絕緣層之每一者皆包含玻璃陶瓷。 11. 根據申請專利範圍第1項之電子零件包裝,還包括:附著 於基底外表面的許多導電插銷 12‘根據申請專利範圍第1項之電子零件包裝,還包括:黏裝 到台階式輪廓的許多導電引線接合墊。 13. —種電子零件包裝,包括: 一基底’它具有在其中形成的至少—個晶粒承接腔, 遠空腔係由一晶粒承接表面及具有一種台階式輪廓之一 内侧壁所界定的’基底具有與空腔周圍接壤之一外表面 ’而内側壁則延伸在晶粒承接表面與基底外表面之間; 至少一個電容器’完全在空腔内,將它加以定位及黏 裝到内側壁之台階式輪廓;以及 一封罩’它附著於内側壁之台階式輪廓,並加以定位 完全在空腔内,封罩被定位在至少一電容器與晶粒承接 表面之間,並且延伸於晶粒承接表面之上。 14. 一種電子零件包裝,包括: 一基底,它具有在其中形成的至少一個晶粒承接腔, 该空腔係由一晶粒承接表面及具有一種台陪式輪靡之.. 内側壁所界定的,基底具有與空腔周圍接壤之—外表面 (請先B讀背*之注意事項再填寫本育)本紙張尺度逍用中囷«家揉準(CNS ) A4说格(2丨0X297公釐) 經濟部中央#準局男工消费合作社印策 4 35 05 9.. A8 B8 C8 ------ D8 六、申請專利範圍 而内側壁則延伸在晶粒承接表面與基底外表面之間; 至少一個電容器,將它完全加以定位在空腔内,且直 接黏裝到位於該晶粒承接表面與該基底外表面之間之該 内侧壁上;以及 —封罩,Έ附著於基底’並加以定位完全在空腔内, 封罩延伸於晶粒承接表面與該至少一電容器之上。 15. —種電子零件包裝,包括: 基底,它具有在其中形成的至少一個晶粒承接腔, 揼空腔係由一晶粒承接表面及具有一種台階式輪廓之一 内侧壁所界定的,基底具有與空腔周圍接壌之一外表面 ,而内侧壁則延伸在晶粒承接表面與基底外表面之間; 至少一個電容器,完全加以定位在空腔内,且將它黏 裝到位於該晶粒承接表面與該基底外表面之間之内侧壁 之台階式輪廓;以及 一封罩’將它加以定位完全在空腔内,並附著於台階 式輪廓,至少一電容器係在封罩與晶粒承接表面之間而 封罩則延伸於晶粒承接表面與電容器之上。 16. —種電子零件包裝,包括: 一基底,它具有在其中形成的至少一個晶粒承接腔, 該空腔係由一晶粒承接表面及具有一種台階式輪廓之一 内側壁所界定的’基底具有與空腔周圍接壤之一外表面 ’而内侧壁則延伸在晶粒承接表面與基底外表面之間; 至少一個電容器,完全在空腔内,將它加以定位及黏 裝到台階式輪廓;以及 本紙張尺度道用中國國家椹準(CNS ) Μ洗格(210X297公釐) (請先Μ讀背面之注意事項再填寫本頁) 、1Τ Λ8 Β8 C8 D8 申請專利範園 -封罩,被完全定位於至少—電容器與晶粒承接表面 之間且被附著於基底,封罩則延伸於晶粒承接表面之上。 17.根據申請專利範圍第I 6項之電子件包裝,其中封罩被附 著於黏裝有至少一電容器之該台階式輪廓。 I— n·— m In et^ In km ^^^1 ^^^1 ^^^1',J - * 叩 i (請先聞讀背面之注意事項再嗔窝本頁} 經濟部中央標準局貝工消費合作社印f -4 本纸張尺度適用中Β明家揉準(CNS Μ4规格(2丨0Χ297公釐)
Applications Claiming Priority (1)
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US08/701,029 US5831810A (en) | 1996-08-21 | 1996-08-21 | Electronic component package with decoupling capacitors completely within die receiving cavity of substrate |
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TW435059B true TW435059B (en) | 2001-05-16 |
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TW86103390A TW435059B (en) | 1996-08-21 | 1997-03-18 | Electronic component package with decoupling capacitors completely within die receiving cavity of substrate |
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US (1) | US5831810A (zh) |
EP (1) | EP0825648A3 (zh) |
JP (1) | JP3207139B2 (zh) |
KR (1) | KR100272988B1 (zh) |
TW (1) | TW435059B (zh) |
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-
1997
- 1997-03-18 TW TW86103390A patent/TW435059B/zh not_active IP Right Cessation
- 1997-06-25 KR KR1019970027152A patent/KR100272988B1/ko not_active IP Right Cessation
- 1997-07-22 EP EP19970305480 patent/EP0825648A3/en not_active Withdrawn
- 1997-08-04 JP JP20892897A patent/JP3207139B2/ja not_active Expired - Fee Related
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JP3207139B2 (ja) | 2001-09-10 |
KR100272988B1 (ko) | 2000-11-15 |
KR19990003304A (ko) | 1999-01-15 |
EP0825648A3 (en) | 1999-07-28 |
JPH1092966A (ja) | 1998-04-10 |
EP0825648A2 (en) | 1998-02-25 |
US5831810A (en) | 1998-11-03 |
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