TW417150B - Substrate moving device and the operating method thereof - Google Patents

Substrate moving device and the operating method thereof Download PDF

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Publication number
TW417150B
TW417150B TW088111149A TW88111149A TW417150B TW 417150 B TW417150 B TW 417150B TW 088111149 A TW088111149 A TW 088111149A TW 88111149 A TW88111149 A TW 88111149A TW 417150 B TW417150 B TW 417150B
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substrate
cassette
arm
airflow
air
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Masayuki Toda
Masaki Kusuhara
Masaru Umeda
Michio Yagai
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Watanabe M & Co Ltd
Masayuki Toda
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
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    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691Handling of masks or workpieces
    • G03F7/70733Handling masks and workpieces, e.g. exchange of workpiece or mask, transport of workpiece or mask
    • G03F7/7075Handling workpieces outside exposure position, e.g. SMIF box
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
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    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67784Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations using air tracks
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10STECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00Material or article handling
    • Y10S414/135Associated with semiconductor wafer handling
    • Y10S414/137Associated with semiconductor wafer handling including means for charging or discharging wafer cassette
    • Y10S414/138Wafers positioned vertically within cassette

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Description

41 7 1 50 ------------ 五、發明^^"^ -----— 1 發明所屬技術領域 ’ 本發明係關於基體之搬移裝置及其操作方法。更詳細 義明之’係將在半導體產業或液晶產業等使用之薄板狀之 ^體搬入收藏該基體之卡匣及自卡匣搬出時使用之裝置, 雜關於可邊用氣體令該基體浮起邊將基體搬入、搬出之基 體之搬移裴置及其操作方法。 習知技術 習知在半導體等之製程,為了令基體(例如半導體晶 片)在各製程使用之製造裝置間移動,使用基體之搬運裝 置°在這種搬運裝置上例如有將裝入了基體之卡匣治具堆 放在搬運車後搬運之搬運裝置、用機械臂逐片地搬運基體 之搬運裝置。可是’目前在這些搬運裝置處理基體之空間 之氣體係大氣中’未成為充分之高潔淨氣體空間。最近也 利用將裝入了基體之卡匣治具裝入密閉容器後搬運之方 法,但是,未解決對於基體之來自容器材質、氣密用氣密 墊等之污染之問題。 在解決此問題之方法上,例如提議利用氣流(空氣軸 承)在搬運路線内搬運基體之氣流搬運裝置。因這氣流搬 運裝置可使得搬運路線内變成密閉型式(密閉系),可使得 基體之周圍變成充分高潔淨之氣體空間。這種習知之氣流 搬運裝置雖然在長短距離之搬運及分支路線搬運、利用懸 浮之浮起停止、依據左右徒轉之結晶輛方向之決定等功能 完備’但疋因本來係逐片搬運,收藏於卡匿之基體(例如
第4頁 發明說明(2) :導體晶片)之逐片取出以例如機械手臂^ ^ ^ 表’::不利用和基體直接接觸之 义曰)等為代 在使用了上述之移動裝置之情 1 I面之方法或自下側用附1形手用真空吸附基體 f。可是,在前者之情沉,基體之手/面支樓,體周邊之方 又,在後者之情π 2 現在無法說是最任 牡俊者之情况,有基體之 弋取佳。 樓移動裝置之基體之部分之粒子之附著等問^或维積於支 發明要解決之課題 本,明係在將薄板狀之基體搬 時,不使用和基體直接接觸之移動 ^自卡!搬出 可將基體搬入卡匣及自卡匣搬 利用氣流搬運 作方法,,目的在於提供最裝置及其操 解決課題之手段 '片式乳流搬運裝置的。 本發明之基體之搬移裝置,其 之基體搬入收藏該基體之卡梗 '上 ;’在將薄板狀 之搬移裝置由在和基體之背面相 2使用之基體 具有使基體浮起或著地、捕捉或發射自具有複數 之功能之氣體之喷射口之氣流搬運手;和罝ί將基體對心 後令卡£相對於氣流搬運手臂水平 ^有放置該卡匡 台座以及和按照指定之間距升/後、之骏置之卡匣 造之卡匿放置台構成。 降卡匿台座之裝置成一體構 使用 上述之基體之搬移裝 置令該基體自該卡 匣往該氣
第5頁 417150 五、發明說明(3) ' — ---- 流搬運手臂之方向移動之操作方法至少包括:將該卡匣放 f該卡S台座之製程;藉著令該卡匣台座向該氣流搬運手 臂之剛進將該氣流搬運手臂配置於該卡匣内’令該氡流搬 運手臂之搬運面接近收藏於該卡匣内之槽之任意之該基體 之下面之製程:以及藉著自設於該氣流搬運手臂之搬運面 之指定之噴射口向該基體喷射指定之氣體,令該基體浮起 而且自該卡匣向該氣流搬運手臂之方向搬出該基體 程。 ,使用上 搬運手臂 該卡匣台 之指定之 向保持該 搬運手臂 設於該氣 止喷射指 程;以及 退,自該 上述構造 之搬運面 令該基體 臂可和基 因此,可 堆積於支 又 該氣流 匣玫在 搬運面 匣台座 該氣流 程;自 基體停 槽之製 方向後 由 運手臂 體,因 搬運手 搬出。 屑、或 述之基 之方向 座之製 喷射口 基體浮 配置成 流搬運 定之氣 藉著令 卡匣内 構成之 之指定 浮起並 體不直 得到可 撐移動 體之搬 移動之 程;藉 向該基 起之該 收藏於 手臂之 體,將 該卡匣 拔出該 基體之 之噴射 保持, 接接觸 解決基 裝置之 m η ^ ^ 著自設於 體喷射指 氣流搬運 該卡匣内 搬運面之 該基體搬 台座朝和 氣流搬運 搬移裝置 口向該基 係令基體 地將基體 體之背面 基體之部 上7 W ·將該卡 该氣流搬運手臂之 定之氣體,令該卡 手臂方向前進,_ 之4日疋之槽之製 指定之噴射口向詔 入卡匣内之指定之 該氣流搬運手臂反 手臂之製程。 ,自設於該氣流抱 體喷射指定之氣 :動之裝置之氣流 搬入卡匿及自卡g 污染、基體之碎 分之粒子之附 50 五、發明說明(4) 問題之基體之搬移裝置。又 用本發明之基體之搬移裝置 搬出。
,若利用上述之操作方法, ,可將基體搬入卡匠及自卡^ 發明之實施形態 以下和本發明之作用等一起說明本發明之會 〜貝苑形綠。 圖1係表示本發明之基體之搬移裝置之—例之模〜 之剖面圖。圖2係表示圖1所示裝置之立體圖。圖上 圖1所示氣流搬運手臂1之平面圖(a)和剖面圖(13) /'又,不 4係表示本發明之基體之搬移裝置之別例之楔’圖 圖。 〈4面 在圖1〜4 ’ 1係氣流搬運手臂,2係卡匣放置台,3係按 照指定之間距升降卡匣台座之裝置,4係卡匣台座,5係令 卡S相對於氣流搬運手臂水平前進後退之裝置,6係收藏^ 基體之卡匣’ 7係薄板狀基體,8係槽,9係浮起用喷射 口 ’10係發射用喷射口,Η係其他氣流搬運裝置,12係氣 流搬運手臂之凸緣部,丨3及丨4係導引件,丨5係配管。 如圖1所示’本發明之基體之搬移裝置由放置收藏基 體7之卡之卡!£放置台2和係令基體7移動之裝置之氣流 搬運手臂1構成。 卡匠放置台2具有按照指定之間距升降卡匣台座之裝 置3(圖上未示)’在其最上部和令放置於卡匣台座4上之卡 IE6相對於氣流搬運手臂水平前進後退之裝置5(圖上未示) 設置成一體。因此’藉著將卡匣6放置於卡匣台座*,卡匣
五、發明說明(5) 6向朝向氣流搬運手臂〗之方向或反方向(箭號方向)前 退,而且利用卡匣放置台2之升降裝置3可按照指定後 升降卡E6。 疋之間靼 在氣流搬運手臂1,如圖2所示,在和基體7之背面 向之搬運面各自具有複數具有使基體浮起或著地、捕相 發射基體、或將基體對心之功能之氣體之喷射口。這=或 射口具有利用噴出氣流令收藏於卡匣6内之槽8之基體7、^嘴 起2〜〇. 5mm之功能。在此,9係基體之浮起或著地用夺 口 ’10係基體之捕捉或發射用喷射口。在圖面,自各貫射 口延伸之箭號表示自各喷射口噴出氣體之方向。又,$射 板狀基體7上例如適合使用晶片基板。 在薄 基體之捕捉或發射用喷射口 1〇設置成複數列平行 有利用該喷出氣流之水平分力賦與浮起之基體7推進仃’具 功能。在圖1表示氣流搬運手臂1和其他氣流搬運 1 < 接固定之情況。 ' 褒置11連 如圖3所示,經由設於氣流搬運手臂之凸緣部丨2之 官15供給各喷射口氣體’嘴射口9、1〇具有控制在各喷备 口之氣體之喷射時間、氣體流量以及噴射氣體之時程f 置(圖上未示)。 裝 以下依照圖1、圖2以及圖4詳細說明本發明之基體之 搬移裝置之操作方法。 1 (1)令基體自卡E往軋流搬運手臂方向移動之操 法。 首先,如圖2所示,將收藏著基體7之卡匣6放置於卡
I 417159
五、發明說明(6) 一 ^台』3 。利用位置偵測裝置(圖上未示)判 令卡㈣朝氣流搬運手臂卡座1平移動, 手臂1到達卡㈣内之圖4式^向月進。然後,在氣流搬運 4停止。 圖4或圖1所示位置之時刻令卡匣台座 而且h氣ίΐίΐΐ,2升降至所要之卡£槽位置為止 J Ilf臂1之浮起用喷射口 9喷射氣體。 之某體f氣流搬運裝置11到達氣流搬運手臂1上 之基體’利用自氣流搬 免丁 ^上 口 1〇所嘴射氣流之水發射用)嘴射 空卡S6内,利用自淳/田力,邊將進入速度減速,邊進入 浮。在此情況如圖 用喷Γ9所喷射之氣流停止而懸 臂1進入卡匣6内之側丁卡匣台座4藉者在氣流搬運手 引件13、14,作為使得容易:= 樣之材質之導 藉著停止自浮= 射 基體放在槽8之下棚架(圏上未示)。铁 :: :: ί 3微上升,擴大她之槽8内之基體下面:氣流: 2减。然後’藉著重複進行和上述 要片數之基體收藏於卡匣6内。 水<探忭將所 馬上操作,若收藏片數達到所要片數, 昆。停止氣流搬運手h,變成等待狀態,更換空的卡 -般之氣流搬運裝置(例如圏i所示j i )使用超高純
第9頁 五、發明說明(7) ^吞I Ϊ淨4體(视需要使用氮等超搞純度惰性氣體),變 發明I I潔淨氣體之密閉搬運空間。》了令與其對應*本 後,和ΐ置.1藉著將裝置整體或裝置之一部分密閉後排氣 之搬^ =淨氣體置換,可變成在高潔淨氣體空間之基體 氣漭=π在上述之說明,表示了將氣流搬運手臂1和其他 1和Υ運裝置11連接並固定之例子,但是在氣流搬運手臂 f他氣流搬運裝置Η之間設置載入上鎖室等,使得 ^體之置換也可。 移動2外,在上述之說明,表示了相對於氣流搬運手臂1 臂1之之例子,但是採用相對於卡®δ移動氣流搬運手 1之構造當然也可。 咬卞 聲明之效果 臂將ϊ =上說明所*,若利用本發明,藉著用氣流搬運手 概‘ΐϊίΐΐΐ:出碎Γ和基體之表裡都非接觸地 Ί ?基體之,可染碎屑粒子之附著等激減。 令容ί ’因可用氣流搬運手臂將基體搬入卡匣或搬出,可 令易地將氣流搬運裝置及廊用了翁、.Α、Λ 板處理裝箸知此益了 A Μ 予起之各種薄板基 里裝置和收藏了基體之卡匣直接連結。 圈式簡單說明 係表不本發明之基體之撫蘇键罢 之刮面圖。 土菔之搬移裝置之一例之模式上
第10頁 417150 五、發明說明(8) 圖2係表示圖1所示裝置之立體圖。 圖3係表示圖1所示氣流搬運手臂1之平面圖(a)和剖面 圖(b)。 圖4係表示本發明之基體之搬移裝置之別例之模式上 之剖面圖。 符號說明 1氣流搬運手臂 2 卡匣放置台 3按照指定之間距升降卡匣台座之裝置 4卡匣台座 5 令卡匣相對於氣流搬運手臂水平前進後退之裝置 6收藏基體之卡匣 7薄板狀基體 8槽 9 浮起用喷射口 10發射用喷射口 11其他氣流搬運裝置 1 2 氣流搬運手臂之凸緣部 13、14 導引件 15配管

Claims (1)

  1. aa 111149 六、申請專利範圍 1. 一種基體之搬移裝置,在將薄板狀之基體搬入收藏 該基體之卡匣及自卡匣搬出時使用, 其特徵在於包括: 氣流搬運手臂,在和基體之背面相向之搬運面各自具 有複數具有使基體浮起或著地、捕捉或發射基體、或將基 體對心之功能之氣體之喷射口; 卡匣台座,具有放置該卡匣後令卡匣相對於氣流搬運 手臂水平前進後退之裝置;以及 卡匣放置台,按照指定之間距升降卡匣台座之裝置成 一體構造。 2. —種基體之搬移裝置之操作方法,使用如申請專利 範圍第1項之基體之搬移裝置令該基體自該卡匣往該氣流 搬運手臂之方向移動, 其特徵在於至少包括: 將該卡匣放在該卡匣台座之製程; 藉著令該卡匣台座向該氣流搬運手臂之前進將該氣流搬運 手臂配置於該卡匣内,令該氣流搬運手臂之搬運面接近收 藏於該卡匣内之槽之任意之該基體之下面之製程;以及 藉著自設於該氣流搬運手臂之搬運面之指定之喷射口向該 基體噴射指定之氣體,令該基體浮起而且自該卡匣向該氣 流搬運手臂之方向搬出該基體之製程。 3. —種基體之搬移裝置之操作方法,使用如申請專利 範圍第1項之基體之搬移裝置令該基體自該卡匣往該氣流 搬運手臂之方向移動,
    第12頁 417150 六、申請專利範圍 其特徵在於至 將該卡匣 藉著自設 向該基體噴射 起之該氣流搬 收藏於該卡匣 自設於該 基體停止噴射 槽之製程;以 藉著令該 自該卡匣内拔 4. 如申請 於該氣流搬運 功能之複數氣 孔,該角度之 心,而且在該 射口群。 5. 如申請 於該氣流搬運 複數氣體喷射 度之傾斜方向 該基體之外周 6. 如申請 於該氣流搬運 少包括: 放在該卡 於該氣流 指定之氣 運手臂方 内之指定 氣流搬運 指定之氣 及 卡匣台座 出該氣流 專利範圍 手臂之搬 體喷射口 傾斜方向 搬運面至 專利範圍 手臂之搬 口以相對 指向該氣 對應之位 專利範圍 手臂之搬 S台座之製程; 微運手臂之搬運面之指定之喷射口 體i令該卡匣台座向保持該基體浮 向則進’將該氣流搬運手臂配置成 之槽之製程; 手’之搬運面之指定之喷射口向該 體’將該基體搬入卡匣内之指定之 朝和該氣流搬運手臂反方向後退, 搬運手臂之製程。 第1項之基體之搬移裝置,其中設 運面之具有使該基體浮起或著地之 以相對於該搬運面固定之角度鑽 指向該氣流搬運手臂之搬運面之中 少形成區分成3象限分割以上之喷 第1項之基體之搬移裝置,其中設 運面之具有將該基體對心之功能之 於該搬運面固定之角度鑽孔’該角 流搬運手臂之搬運面之中心’在和 置配置複數列。 第1項之基體之搬移裝置’其中設 運面之具有捕捉或發射該基體之功
    第13頁 417150 六、申請專利範圍 能之氣體喷射口以相對於該搬運面固定之角度鑽孔,該角 度之傾斜方向係自該卡匣在該氣流搬運手臂之方向直線排 列的及自該氣流搬運手臂在該卡匣之方向直線排列的2 種,各直線排列都形成2列以上之複數列。 7. 如申請專利範圍第1項之基體之搬移裝置,其中該 氣流搬運手臂之外形尺寸係在配置於該卡匣内之槽之任意 之該基體之下可非接觸地插入之尺寸。 8. 如申請專利範圍第1項之基體之搬移裝置,其中該 卡匣台座在該氣流搬運手臂進入該卡匣内之侧之兩側具有 和該卡匣一樣之材質之導引件。 9. 如申請專利範圍第1項之基體之搬移裝置,其中設 於該氣流搬運手臂之複數氣體喷射口具有控制在各喷射口 之氣體之噴射時間、氣體流量以及噴射氣體之時程之裝
    第14頁
TW088111149A 1998-07-08 1999-07-01 Substrate moving device and the operating method thereof TW417150B (en)

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