TW412763B - Method of manufacturing a plurality of electronic components - Google Patents

Method of manufacturing a plurality of electronic components Download PDF

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Publication number
TW412763B
TW412763B TW087111500A TW87111500A TW412763B TW 412763 B TW412763 B TW 412763B TW 087111500 A TW087111500 A TW 087111500A TW 87111500 A TW87111500 A TW 87111500A TW 412763 B TW412763 B TW 412763B
Authority
TW
Taiwan
Prior art keywords
segment
layer
patent application
slots
electrode structure
Prior art date
Application number
TW087111500A
Other languages
English (en)
Chinese (zh)
Inventor
Antonius J Maria Nellissen
Grunsven Erik Cornelis E Van
Original Assignee
Koninkl Philips Electronics Nv
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Koninkl Philips Electronics Nv filed Critical Koninkl Philips Electronics Nv
Application granted granted Critical
Publication of TW412763B publication Critical patent/TW412763B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/40—Structural combinations of fixed capacitors with other electric elements, the structure mainly consisting of a capacitor, e.g. RC combinations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G13/00—Apparatus specially adapted for manufacturing capacitors; Processes specially adapted for manufacturing capacitors not provided for in groups H01G4/00 - H01G11/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/403—Edge contacts; Windows or holes in the substrate having plural connections on the walls thereof
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0302—Properties and characteristics in general
    • H05K2201/0317—Thin film conductor layer; Thin film passive component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
    • H05K3/0052—Depaneling, i.e. dividing a panel into circuit boards; Working of the edges of circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0073—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces
    • H05K3/0082—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces characterised by the exposure method of radiation-sensitive masks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0097—Processing two or more printed circuits simultaneously, e.g. made from a common substrate, or temporarily stacked circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/108—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by semi-additive methods; masks therefor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3431—Leadless components
    • H05K3/3442—Leadless components having edge contacts, e.g. leadless chip capacitors, chip carriers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/388—Improvement of the adhesion between the insulating substrate and the metal by the use of a metallic or inorganic thin film adhesion layer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/43—Electric condenser making
    • Y10T29/435—Solid dielectric type
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49004—Electrical device making including measuring or testing of device or component part
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/4902—Electromagnet, transformer or inductor

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
  • Apparatuses And Processes For Manufacturing Resistors (AREA)
TW087111500A 1997-08-05 1998-07-15 Method of manufacturing a plurality of electronic components TW412763B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
EP97202432 1997-08-05

Publications (1)

Publication Number Publication Date
TW412763B true TW412763B (en) 2000-11-21

Family

ID=8228622

Family Applications (1)

Application Number Title Priority Date Filing Date
TW087111500A TW412763B (en) 1997-08-05 1998-07-15 Method of manufacturing a plurality of electronic components

Country Status (8)

Country Link
US (1) US6240621B1 (enExample)
EP (1) EP0941545B1 (enExample)
JP (1) JP2001502123A (enExample)
KR (1) KR100561792B1 (enExample)
CN (1) CN1179381C (enExample)
DE (1) DE69833193T2 (enExample)
TW (1) TW412763B (enExample)
WO (1) WO1999008297A2 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI844548B (zh) * 2018-06-25 2024-06-11 德商維雪電子公司 製造複數個電阻器單元之方法及電阻器單元

Families Citing this family (47)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7336467B2 (en) 2000-10-17 2008-02-26 X2Y Attenuators, Llc Energy pathway arrangement
US20030161086A1 (en) 2000-07-18 2003-08-28 X2Y Attenuators, Llc Paired multi-layered dielectric independent passive component architecture resulting in differential and common mode filtering with surge protection in one integrated package
US9054094B2 (en) 1997-04-08 2015-06-09 X2Y Attenuators, Llc Energy conditioning circuit arrangement for integrated circuit
US7336468B2 (en) 1997-04-08 2008-02-26 X2Y Attenuators, Llc Arrangement for energy conditioning
US6603646B2 (en) 1997-04-08 2003-08-05 X2Y Attenuators, Llc Multi-functional energy conditioner
US7274549B2 (en) 2000-12-15 2007-09-25 X2Y Attenuators, Llc Energy pathway arrangements for energy conditioning
US6650525B2 (en) 1997-04-08 2003-11-18 X2Y Attenuators, Llc Component carrier
US6606011B2 (en) 1998-04-07 2003-08-12 X2Y Attenuators, Llc Energy conditioning circuit assembly
US7110235B2 (en) 1997-04-08 2006-09-19 Xzy Altenuators, Llc Arrangement for energy conditioning
US7301748B2 (en) 1997-04-08 2007-11-27 Anthony Anthony A Universal energy conditioning interposer with circuit architecture
US7321485B2 (en) 1997-04-08 2008-01-22 X2Y Attenuators, Llc Arrangement for energy conditioning
US6894884B2 (en) 1997-04-08 2005-05-17 Xzy Attenuators, Llc Offset pathway arrangements for energy conditioning
US7042703B2 (en) 2000-03-22 2006-05-09 X2Y Attenuators, Llc Energy conditioning structure
US7106570B2 (en) 1997-04-08 2006-09-12 Xzy Altenuators, Llc Pathway arrangement
US6018448A (en) * 1997-04-08 2000-01-25 X2Y Attenuators, L.L.C. Paired multi-layered dielectric independent passive component architecture resulting in differential and common mode filtering with surge protection in one integrated package
US7110227B2 (en) 1997-04-08 2006-09-19 X2Y Attenuators, Llc Universial energy conditioning interposer with circuit architecture
US7427816B2 (en) 1998-04-07 2008-09-23 X2Y Attenuators, Llc Component carrier
EP1070389B1 (en) 1998-04-07 2007-12-05 X2Y Attenuators, L.L.C. Component carrier
US6452247B1 (en) * 1999-11-23 2002-09-17 Intel Corporation Inductor for integrated circuit
US6891461B2 (en) * 1999-11-23 2005-05-10 Intel Corporation Integrated transformer
US6815220B2 (en) 1999-11-23 2004-11-09 Intel Corporation Magnetic layer processing
US6870456B2 (en) * 1999-11-23 2005-03-22 Intel Corporation Integrated transformer
US6856228B2 (en) 1999-11-23 2005-02-15 Intel Corporation Integrated inductor
US7113383B2 (en) 2000-04-28 2006-09-26 X2Y Attenuators, Llc Predetermined symmetrically balanced amalgam with complementary paired portions comprising shielding electrodes and shielded electrodes and other predetermined element portions for symmetrically balanced and complementary energy portion conditioning
US6549389B2 (en) 2000-08-15 2003-04-15 X2Y Attenuators, Llc Electrode arrangement for circuit energy conditioning
US7193831B2 (en) 2000-10-17 2007-03-20 X2Y Attenuators, Llc Energy pathway arrangement
AU2002213356B2 (en) 2000-10-17 2005-03-10 X2Y Attenuators, Llc Amalgam of shielding and shielded energy pathways and other elements for single or multiple circuitries with common reference node
JP3955241B2 (ja) * 2002-06-21 2007-08-08 東京エレクトロン株式会社 Ｍｅｍｓアレイとその製造方法及びそれに基づくｍｅｍｓデバイスの製造方法
KR100678496B1 (ko) * 2002-09-10 2007-02-06 티디케이가부시기가이샤 적층 콘덴서
KR20050048644A (ko) * 2002-09-27 2005-05-24 코닌클리케 필립스 일렉트로닉스 엔.브이. 회로기판의 측면을 배선하기 위한 리소그래픽 방법
US7180718B2 (en) 2003-01-31 2007-02-20 X2Y Attenuators, Llc Shielded energy conditioner
US7852185B2 (en) * 2003-05-05 2010-12-14 Intel Corporation On-die micro-transformer structures with magnetic materials
US7440252B2 (en) 2003-05-29 2008-10-21 X2Y Attenuators, Llc Connector related structures including an energy conditioner
WO2005015719A2 (en) 2003-07-21 2005-02-17 X2Y Attenuators, Llc Filter assembly
WO2005065097A2 (en) 2003-12-22 2005-07-21 X2Y Attenuators, Llc Internally shielded energy conditioner
JP2008535207A (ja) 2005-03-01 2008-08-28 エックストゥーワイ アテニュエイターズ，エルエルシー 共平面導体を有する調整器
WO2006093831A2 (en) 2005-03-01 2006-09-08 X2Y Attenuators, Llc Energy conditioner with tied through electrodes
US7586728B2 (en) 2005-03-14 2009-09-08 X2Y Attenuators, Llc Conditioner with coplanar conductors
US8134548B2 (en) * 2005-06-30 2012-03-13 Micron Technology, Inc. DC-DC converter switching transistor current measurement technique
CN101395683A (zh) 2006-03-07 2009-03-25 X2Y衰减器有限公司 能量调节装置结构
JP4872134B2 (ja) * 2008-03-31 2012-02-08 Ｔｄｋ株式会社 端子電極形成方法
JP5233637B2 (ja) * 2008-04-02 2013-07-10 日立金属株式会社 多層セラミック基板、及び電子部品
CN102122553B (zh) * 2010-12-17 2013-03-20 深圳顺络电子股份有限公司 卧式结构的低阻值片式负温度系数热敏电阻及其制造方法
DE102011005658A1 (de) * 2011-03-16 2012-09-20 Sirona Dental Systems Gmbh Träger, vorzugsweise für ein elektronisches Bauteil, eine Baugruppe solcher Träger und ein Verfahren zur Herstellung einer Baugruppe solcher Träger
DE102012109704A1 (de) * 2012-10-11 2014-04-17 Epcos Ag Keramisches Bauelement mit Schutzschicht und Verfahren zu dessen Herstellung
JP6136507B2 (ja) * 2013-04-16 2017-05-31 Tdk株式会社 積層コンデンサアレイ
CN109963409B (zh) * 2019-04-10 2021-02-23 京东方科技集团股份有限公司 基板侧面导线的制造方法和基板结构

Family Cites Families (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3770434A (en) * 1971-10-15 1973-11-06 Rca Corp Method for making an image screen structure for an apertured-mask cathode-ray tube using a mask having temporary apertures
US3809973A (en) * 1973-07-06 1974-05-07 Sprague Electric Co Multilayer ceramic capacitor and method of terminating
US4356529A (en) * 1981-01-21 1982-10-26 Sprague Electric Company Terminated monolithic ceramic chip capacitor
US4486738A (en) * 1982-02-16 1984-12-04 General Electric Ceramics, Inc. High reliability electrical components
US4453199A (en) * 1983-06-17 1984-06-05 Avx Corporation Low cost thin film capacitor
US4788523A (en) * 1987-12-10 1988-11-29 United States Of America Viad chip resistor
US5278012A (en) * 1989-03-29 1994-01-11 Hitachi, Ltd. Method for producing thin film multilayer substrate, and method and apparatus for detecting circuit conductor pattern of the substrate
DE4091418C2 (de) * 1989-08-24 2001-07-05 Murata Manufacturing Co Verfahren zur Herstellung eines Mehrschichtkondensators
US5281769A (en) * 1990-11-05 1994-01-25 Nippon Telegraph And Telephone Corporation Dewall plating technique
US5625220A (en) * 1991-02-19 1997-04-29 Texas Instruments Incorporated Sublithographic antifuse
JP3018645B2 (ja) * 1991-10-03 2000-03-13 株式会社村田製作所 チップ部品の製造方法
US5166656A (en) * 1992-02-28 1992-11-24 Avx Corporation Thin film surface mount fuses
US5517385A (en) * 1992-11-19 1996-05-14 International Business Machines Corporation Decoupling capacitor structure
JP2550852B2 (ja) * 1993-04-12 1996-11-06 日本電気株式会社 薄膜キャパシタの製造方法
US5323520A (en) * 1993-04-29 1994-06-28 Fujitsu Limited Process for fabricating a substrate with thin film capacitor
US5414589A (en) * 1993-06-07 1995-05-09 Rohm Co., Ltd. Capacitor having a changeable dielectric capacity and manufacturing method thereof
JP2870371B2 (ja) * 1993-08-05 1999-03-17 株式会社村田製作所 積層電子部品、その製造方法およびその特性測定方法
JP3027081B2 (ja) * 1993-12-09 2000-03-27 アルプス電気株式会社 薄膜素子
JPH07161223A (ja) * 1993-12-10 1995-06-23 Murata Mfg Co Ltd 導電性ペーストおよび積層セラミックコンデンサ
WO1995030178A1 (en) * 1994-04-28 1995-11-09 Philips Electronics N.V. Method of photolithographically producing a copper pattern on a plate of an electrically insulating material
US5600533A (en) * 1994-06-23 1997-02-04 Murata Manufacturing Co., Ltd. Multilayer ceramic capacitor having an anti-reducing agent
WO1996030916A2 (en) 1995-03-27 1996-10-03 Philips Electronics N.V. Method of manufacturing an electronic multilayer component
US5712759A (en) * 1995-12-22 1998-01-27 International Business Machines Corporation Sidewall capacitor with L-shaped dielectric
US5699607A (en) * 1996-01-22 1997-12-23 Littelfuse, Inc. Process for manufacturing an electrical device comprising a PTC element
KR100326979B1 (ko) * 1996-12-18 2002-05-10 포만 제프리 엘 캐패시터형성방법및그캐패시터구조체
US5880925A (en) * 1997-06-27 1999-03-09 Avx Corporation Surface mount multilayer capacitor

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI844548B (zh) * 2018-06-25 2024-06-11 德商維雪電子公司 製造複數個電阻器單元之方法及電阻器單元

Also Published As

Publication number Publication date
EP0941545A2 (en) 1999-09-15
DE69833193T2 (de) 2006-09-21
DE69833193D1 (de) 2006-04-06
CN1179381C (zh) 2004-12-08
KR20000068710A (ko) 2000-11-25
US6240621B1 (en) 2001-06-05
WO1999008297A3 (en) 1999-04-15
KR100561792B1 (ko) 2006-03-21
WO1999008297A2 (en) 1999-02-18
CN1241285A (zh) 2000-01-12
EP0941545B1 (en) 2006-01-11
JP2001502123A (ja) 2001-02-13

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