JP2001502123A - 複数の電子部品の製造方法 - Google Patents

複数の電子部品の製造方法

Info

Publication number
JP2001502123A
JP2001502123A JP11511887A JP51188799A JP2001502123A JP 2001502123 A JP2001502123 A JP 2001502123A JP 11511887 A JP11511887 A JP 11511887A JP 51188799 A JP51188799 A JP 51188799A JP 2001502123 A JP2001502123 A JP 2001502123A
Authority
JP
Japan
Prior art keywords
segment
substrate
layer
strip
wall
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
JP11511887A
Other languages
English (en)
Japanese (ja)
Other versions
JP2001502123A5 (enExample
Inventor
アントニウス ヨハネス マリア ネリセン
フルンスフェン エリク コルネリス エフベルタス ファン
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Koninklijke Philips NV
Original Assignee
Philips Electronics NV
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Philips Electronics NV filed Critical Philips Electronics NV
Publication of JP2001502123A publication Critical patent/JP2001502123A/ja
Publication of JP2001502123A5 publication Critical patent/JP2001502123A5/ja
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G13/00—Apparatus specially adapted for manufacturing capacitors; Processes specially adapted for manufacturing capacitors not provided for in groups H01G4/00 - H01G11/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/40—Structural combinations of fixed capacitors with other electric elements, the structure mainly consisting of a capacitor, e.g. RC combinations
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/403—Edge contacts; Windows or holes in the substrate having plural connections on the walls thereof
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0302—Properties and characteristics in general
    • H05K2201/0317—Thin film conductor layer; Thin film passive component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
    • H05K3/0052—Depaneling, i.e. dividing a panel into circuit boards; Working of the edges of circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0073—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces
    • H05K3/0082—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces characterised by the exposure method of radiation-sensitive masks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0097—Processing two or more printed circuits simultaneously, e.g. made from a common substrate, or temporarily stacked circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/108—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by semi-additive methods; masks therefor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3431—Leadless components
    • H05K3/3442—Leadless components having edge contacts, e.g. leadless chip capacitors, chip carriers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/388—Improvement of the adhesion between the insulating substrate and the metal by the use of a metallic or inorganic thin film adhesion layer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/43—Electric condenser making
    • Y10T29/435—Solid dielectric type
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49004—Electrical device making including measuring or testing of device or component part
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/4902—Electromagnet, transformer or inductor

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
  • Apparatuses And Processes For Manufacturing Resistors (AREA)
JP11511887A 1997-08-05 1998-06-11 複数の電子部品の製造方法 Ceased JP2001502123A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
EP97202432 1997-08-05
EP97202432.7 1997-08-05
PCT/IB1998/000916 WO1999008297A2 (en) 1997-08-05 1998-06-11 Method of manufacturing a plurality of electronic components

Publications (2)

Publication Number Publication Date
JP2001502123A true JP2001502123A (ja) 2001-02-13
JP2001502123A5 JP2001502123A5 (enExample) 2006-01-05

Family

ID=8228622

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11511887A Ceased JP2001502123A (ja) 1997-08-05 1998-06-11 複数の電子部品の製造方法

Country Status (8)

Country Link
US (1) US6240621B1 (enExample)
EP (1) EP0941545B1 (enExample)
JP (1) JP2001502123A (enExample)
KR (1) KR100561792B1 (enExample)
CN (1) CN1179381C (enExample)
DE (1) DE69833193T2 (enExample)
TW (1) TW412763B (enExample)
WO (1) WO1999008297A2 (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009267323A (ja) * 2008-03-31 2009-11-12 Tdk Corp 端子電極形成方法
JP2014207407A (ja) * 2013-04-16 2014-10-30 Tdk株式会社 積層コンデンサアレイ

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US9054094B2 (en) 1997-04-08 2015-06-09 X2Y Attenuators, Llc Energy conditioning circuit arrangement for integrated circuit
US7336468B2 (en) 1997-04-08 2008-02-26 X2Y Attenuators, Llc Arrangement for energy conditioning
US6603646B2 (en) 1997-04-08 2003-08-05 X2Y Attenuators, Llc Multi-functional energy conditioner
US7274549B2 (en) 2000-12-15 2007-09-25 X2Y Attenuators, Llc Energy pathway arrangements for energy conditioning
US6650525B2 (en) 1997-04-08 2003-11-18 X2Y Attenuators, Llc Component carrier
US6606011B2 (en) 1998-04-07 2003-08-12 X2Y Attenuators, Llc Energy conditioning circuit assembly
US7110235B2 (en) 1997-04-08 2006-09-19 Xzy Altenuators, Llc Arrangement for energy conditioning
US7301748B2 (en) 1997-04-08 2007-11-27 Anthony Anthony A Universal energy conditioning interposer with circuit architecture
US7321485B2 (en) 1997-04-08 2008-01-22 X2Y Attenuators, Llc Arrangement for energy conditioning
US6894884B2 (en) 1997-04-08 2005-05-17 Xzy Attenuators, Llc Offset pathway arrangements for energy conditioning
US7042703B2 (en) 2000-03-22 2006-05-09 X2Y Attenuators, Llc Energy conditioning structure
US7106570B2 (en) 1997-04-08 2006-09-12 Xzy Altenuators, Llc Pathway arrangement
US6018448A (en) * 1997-04-08 2000-01-25 X2Y Attenuators, L.L.C. Paired multi-layered dielectric independent passive component architecture resulting in differential and common mode filtering with surge protection in one integrated package
US7110227B2 (en) 1997-04-08 2006-09-19 X2Y Attenuators, Llc Universial energy conditioning interposer with circuit architecture
US7427816B2 (en) 1998-04-07 2008-09-23 X2Y Attenuators, Llc Component carrier
EP1070389B1 (en) 1998-04-07 2007-12-05 X2Y Attenuators, L.L.C. Component carrier
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US6891461B2 (en) * 1999-11-23 2005-05-10 Intel Corporation Integrated transformer
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US6870456B2 (en) * 1999-11-23 2005-03-22 Intel Corporation Integrated transformer
US6856228B2 (en) 1999-11-23 2005-02-15 Intel Corporation Integrated inductor
US7113383B2 (en) 2000-04-28 2006-09-26 X2Y Attenuators, Llc Predetermined symmetrically balanced amalgam with complementary paired portions comprising shielding electrodes and shielded electrodes and other predetermined element portions for symmetrically balanced and complementary energy portion conditioning
US6549389B2 (en) 2000-08-15 2003-04-15 X2Y Attenuators, Llc Electrode arrangement for circuit energy conditioning
US7193831B2 (en) 2000-10-17 2007-03-20 X2Y Attenuators, Llc Energy pathway arrangement
AU2002213356B2 (en) 2000-10-17 2005-03-10 X2Y Attenuators, Llc Amalgam of shielding and shielded energy pathways and other elements for single or multiple circuitries with common reference node
JP3955241B2 (ja) * 2002-06-21 2007-08-08 東京エレクトロン株式会社 Ｍｅｍｓアレイとその製造方法及びそれに基づくｍｅｍｓデバイスの製造方法
KR100678496B1 (ko) * 2002-09-10 2007-02-06 티디케이가부시기가이샤 적층 콘덴서
KR20050048644A (ko) * 2002-09-27 2005-05-24 코닌클리케 필립스 일렉트로닉스 엔.브이. 회로기판의 측면을 배선하기 위한 리소그래픽 방법
US7180718B2 (en) 2003-01-31 2007-02-20 X2Y Attenuators, Llc Shielded energy conditioner
US7852185B2 (en) * 2003-05-05 2010-12-14 Intel Corporation On-die micro-transformer structures with magnetic materials
US7440252B2 (en) 2003-05-29 2008-10-21 X2Y Attenuators, Llc Connector related structures including an energy conditioner
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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009267323A (ja) * 2008-03-31 2009-11-12 Tdk Corp 端子電極形成方法
JP2014207407A (ja) * 2013-04-16 2014-10-30 Tdk株式会社 積層コンデンサアレイ

Also Published As

Publication number Publication date
EP0941545A2 (en) 1999-09-15
DE69833193T2 (de) 2006-09-21
DE69833193D1 (de) 2006-04-06
CN1179381C (zh) 2004-12-08
KR20000068710A (ko) 2000-11-25
US6240621B1 (en) 2001-06-05
WO1999008297A3 (en) 1999-04-15
KR100561792B1 (ko) 2006-03-21
TW412763B (en) 2000-11-21
WO1999008297A2 (en) 1999-02-18
CN1241285A (zh) 2000-01-12
EP0941545B1 (en) 2006-01-11

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