TW370701B - Monopolar electrostatic chuck having an electrode in contact with a workpiece - Google Patents

Monopolar electrostatic chuck having an electrode in contact with a workpiece

Info

Publication number
TW370701B
TW370701B TW085105762A TW85105762A TW370701B TW 370701 B TW370701 B TW 370701B TW 085105762 A TW085105762 A TW 085105762A TW 85105762 A TW85105762 A TW 85105762A TW 370701 B TW370701 B TW 370701B
Authority
TW
Taiwan
Prior art keywords
workpiece
electrostatic chuck
dielectric layer
support members
electrode
Prior art date
Application number
TW085105762A
Other languages
English (en)
Inventor
Vincent E Burkhart
Stefanie E Harvey
Original Assignee
Applied Materials Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Applied Materials Inc filed Critical Applied Materials Inc
Application granted granted Critical
Publication of TW370701B publication Critical patent/TW370701B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
    • H01L21/6833—Details of electrostatic chucks
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T279/00—Chucks or sockets
    • Y10T279/23—Chucks or sockets with magnetic or electrostatic means

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Jigs For Machine Tools (AREA)
  • Drying Of Semiconductors (AREA)
TW085105762A 1996-05-08 1996-05-15 Monopolar electrostatic chuck having an electrode in contact with a workpiece TW370701B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US08/639,842 US5745332A (en) 1996-05-08 1996-05-08 Monopolar electrostatic chuck having an electrode in contact with a workpiece

Publications (1)

Publication Number Publication Date
TW370701B true TW370701B (en) 1999-09-21

Family

ID=24565782

Family Applications (1)

Application Number Title Priority Date Filing Date
TW085105762A TW370701B (en) 1996-05-08 1996-05-15 Monopolar electrostatic chuck having an electrode in contact with a workpiece

Country Status (5)

Country Link
US (2) US5745332A (zh)
EP (1) EP0806797A3 (zh)
JP (1) JPH1098093A (zh)
KR (1) KR970077473A (zh)
TW (1) TW370701B (zh)

Families Citing this family (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6370007B2 (en) * 1995-09-20 2002-04-09 Hitachi, Ltd. Electrostatic chuck
US6217655B1 (en) 1997-01-31 2001-04-17 Applied Materials, Inc. Stand-off pad for supporting a wafer on a substrate support chuck
US5841624A (en) * 1997-06-09 1998-11-24 Applied Materials, Inc. Cover layer for a substrate support chuck and method of fabricating same
USD406852S (en) * 1997-11-14 1999-03-16 Applied Materials, Inc. Electrostatic chuck with improved spacing mask and workpiece detection device
US6572814B2 (en) 1998-09-08 2003-06-03 Applied Materials Inc. Method of fabricating a semiconductor wafer support chuck apparatus having small diameter gas distribution ports for distributing a heat transfer gas
US6219219B1 (en) * 1998-09-30 2001-04-17 Applied Materials, Inc. Cathode assembly containing an electrostatic chuck for retaining a wafer in a semiconductor wafer processing system
US6259592B1 (en) 1998-11-19 2001-07-10 Applied Materials, Inc. Apparatus for retaining a workpiece upon a workpiece support and method of manufacturing same
US6115232A (en) * 1998-12-03 2000-09-05 Lsi Logic Corporation Method for forming an ion implanted electrostatic chuck
USD420023S (en) * 1999-01-09 2000-02-01 Applied Materials, Inc. Electrostatic chuck with improved spacing mask and workpiece detection device
JP3805134B2 (ja) * 1999-05-25 2006-08-02 東陶機器株式会社 絶縁性基板吸着用静電チャック
TW517265B (en) * 2000-06-23 2003-01-11 Applied Materials Inc Apparatus for supporting a substrate and method of fabricating same
JP4312394B2 (ja) * 2001-01-29 2009-08-12 日本碍子株式会社 静電チャックおよび基板処理装置
JP4204964B2 (ja) 2002-12-23 2009-01-07 エーエスエムエル ネザーランズ ビー．ブイ． リソグラフィ装置
KR100666039B1 (ko) * 2003-12-05 2007-01-10 동경 엘렉트론 주식회사 정전척
US8139340B2 (en) * 2009-01-20 2012-03-20 Plasma-Therm Llc Conductive seal ring electrostatic chuck
US10388493B2 (en) * 2011-09-16 2019-08-20 Lam Research Corporation Component of a substrate support assembly producing localized magnetic fields
KR102139682B1 (ko) 2013-08-05 2020-07-30 어플라이드 머티어리얼스, 인코포레이티드 얇은 기판 취급을 위한 정전 캐리어
JP6358856B2 (ja) * 2014-05-29 2018-07-18 東京エレクトロン株式会社 静電吸着装置及び冷却処理装置
US10832936B2 (en) * 2016-07-27 2020-11-10 Lam Research Corporation Substrate support with increasing areal density and corresponding method of fabricating
TWI827502B (zh) 2017-06-19 2023-12-21 美商應用材料股份有限公司 用於高溫處理腔室的靜電吸座及其形成方法
JP2022060859A (ja) * 2020-10-05 2022-04-15 キオクシア株式会社 静電チャック装置及び半導体製造装置

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS468385Y1 (zh) * 1967-09-04 1971-03-24
DD143131A1 (de) * 1979-04-26 1980-07-30 Ute Bergner Vorrichtung zum elektrostatischen halten von werkstuecken,insbesondere halbleiterscheiben
GB2106325A (en) * 1981-09-14 1983-04-07 Philips Electronic Associated Electrostatic chuck
GB2147459A (en) * 1983-09-30 1985-05-09 Philips Electronic Associated Electrostatic chuck for semiconductor wafers
GB2154365A (en) * 1984-02-10 1985-09-04 Philips Electronic Associated Loading semiconductor wafers on an electrostatic chuck
JPH0697676B2 (ja) * 1985-11-26 1994-11-30 忠弘 大見 ウエハサセプタ装置
JPH0652758B2 (ja) * 1987-02-09 1994-07-06 日本電信電話株式会社 静電チヤツク
WO1988009054A1 (en) * 1987-05-06 1988-11-17 Labtam Limited Electrostatic chuck using ac field excitation
US5001594A (en) * 1989-09-06 1991-03-19 Mcnc Electrostatic handling device
US5452177A (en) * 1990-06-08 1995-09-19 Varian Associates, Inc. Electrostatic wafer clamp
US5191506A (en) * 1991-05-02 1993-03-02 International Business Machines Corporation Ceramic electrostatic chuck
US5646814A (en) * 1994-07-15 1997-07-08 Applied Materials, Inc. Multi-electrode electrostatic chuck
US5656093A (en) * 1996-03-08 1997-08-12 Applied Materials, Inc. Wafer spacing mask for a substrate support chuck and method of fabricating same
US5825607A (en) * 1996-05-08 1998-10-20 Applied Materials, Inc. Insulated wafer spacing mask for a substrate support chuck and method of fabricating same
US5764471A (en) * 1996-05-08 1998-06-09 Applied Materials, Inc. Method and apparatus for balancing an electrostatic force produced by an electrostatic chuck

Also Published As

Publication number Publication date
US5982607A (en) 1999-11-09
EP0806797A2 (en) 1997-11-12
KR970077473A (ko) 1997-12-12
US5745332A (en) 1998-04-28
EP0806797A3 (en) 1999-10-27
JPH1098093A (ja) 1998-04-14

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