DE69501018D1 - Vielfache Elektrode elektrostatische Haltevorrichtung - Google Patents

Vielfache Elektrode elektrostatische Haltevorrichtung

Info

Publication number
DE69501018D1
DE69501018D1 DE69501018T DE69501018T DE69501018D1 DE 69501018 D1 DE69501018 D1 DE 69501018D1 DE 69501018 T DE69501018 T DE 69501018T DE 69501018 T DE69501018 T DE 69501018T DE 69501018 D1 DE69501018 D1 DE 69501018D1
Authority
DE
Germany
Prior art keywords
chuck
electrode
substrate
support
insulator
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69501018T
Other languages
English (en)
Other versions
DE69501018T2 (de
Inventor
Shamouil Shamouilian
Samuel Broydo
Manoocher Birang
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Applied Materials Inc
Original Assignee
Applied Materials Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Applied Materials Inc filed Critical Applied Materials Inc
Publication of DE69501018D1 publication Critical patent/DE69501018D1/de
Application granted granted Critical
Publication of DE69501018T2 publication Critical patent/DE69501018T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/6875—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of individual support members, e.g. support posts or protrusions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
    • H01L21/6833—Details of electrostatic chucks

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Jigs For Machine Tools (AREA)
  • Electron Tubes For Measurement (AREA)
  • Electrical Discharge Machining, Electrochemical Machining, And Combined Machining (AREA)
  • Micromachines (AREA)
DE69501018T 1994-07-15 1995-07-17 Vielfache Elektrode elektrostatische Haltevorrichtung Expired - Fee Related DE69501018T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US08/276,010 US5646814A (en) 1994-07-15 1994-07-15 Multi-electrode electrostatic chuck

Publications (2)

Publication Number Publication Date
DE69501018D1 true DE69501018D1 (de) 1997-12-18
DE69501018T2 DE69501018T2 (de) 1998-05-20

Family

ID=23054769

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69501018T Expired - Fee Related DE69501018T2 (de) 1994-07-15 1995-07-17 Vielfache Elektrode elektrostatische Haltevorrichtung

Country Status (6)

Country Link
US (1) US5646814A (de)
EP (1) EP0692814B1 (de)
JP (1) JPH08203991A (de)
KR (1) KR960005930A (de)
AT (1) ATE160238T1 (de)
DE (1) DE69501018T2 (de)

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US5745332A (en) * 1996-05-08 1998-04-28 Applied Materials, Inc. Monopolar electrostatic chuck having an electrode in contact with a workpiece
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US6117246A (en) * 1997-01-31 2000-09-12 Applied Materials, Inc. Conductive polymer pad for supporting a workpiece upon a workpiece support surface of an electrostatic chuck
US5880923A (en) * 1997-06-09 1999-03-09 Applied Materials Inc. Method and apparatus for improved retention of a semiconductor wafer within a semiconductor wafer processing system
GB2329515B (en) 1997-09-18 2002-03-13 Trikon Equip Ltd Platen for semiconductor workpieces
JP3847920B2 (ja) * 1997-10-06 2006-11-22 株式会社アルバック 静電吸着ホットプレート、真空処理装置、及び真空処理方法
US5880924A (en) * 1997-12-01 1999-03-09 Applied Materials, Inc. Electrostatic chuck capable of rapidly dechucking a substrate
US5969934A (en) * 1998-04-10 1999-10-19 Varian Semiconductor Equipment Associats, Inc. Electrostatic wafer clamp having low particulate contamination of wafers
KR100404778B1 (ko) * 1998-10-29 2003-11-07 동경 엘렉트론 주식회사 진공 처리 장치
US6259592B1 (en) 1998-11-19 2001-07-10 Applied Materials, Inc. Apparatus for retaining a workpiece upon a workpiece support and method of manufacturing same
DE19853588B4 (de) * 1998-11-20 2005-04-21 Leica Microsystems Lithography Gmbh Halteeinrichtung für ein Substrat
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US6273958B2 (en) 1999-06-09 2001-08-14 Applied Materials, Inc. Substrate support for plasma processing
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JP2004531880A (ja) * 2001-03-13 2004-10-14 アプライド マテリアルズ インコーポレイテッド 二重電極を有する基板の支持体
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JP4302428B2 (ja) * 2003-05-09 2009-07-29 信越化学工業株式会社 静電吸着機能を有するウエーハ加熱装置
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US7300707B2 (en) * 2004-10-25 2007-11-27 Creative Technology Corporation Aluminium composite structure having a channel therein and method of manufacturing the same
JP4588653B2 (ja) * 2005-03-16 2010-12-01 東京エレクトロン株式会社 基板加熱機能を有する基板載置機構および基板処理装置
DE202005011367U1 (de) 2005-07-18 2005-09-29 Retzlaff, Udo, Dr. Transfer-ESC auf Wafer-Basis
KR100898793B1 (ko) * 2005-12-29 2009-05-20 엘지디스플레이 주식회사 액정표시소자용 기판 합착 장치
KR100965407B1 (ko) 2006-03-06 2010-06-24 엘아이지에이디피 주식회사 다중 전극 패턴을 가지는 정전척
JP2008041993A (ja) * 2006-08-08 2008-02-21 Shinko Electric Ind Co Ltd 静電チャック
JP4126084B1 (ja) * 2007-07-23 2008-07-30 信越エンジニアリング株式会社 静電チャックの表面電位制御方法
JP2009246325A (ja) * 2008-03-28 2009-10-22 Creative Technology:Kk 静電チャック
FR2936158A1 (fr) * 2008-09-24 2010-03-26 Plasto Interface chirurgicale pour plaie, sans support
US20120037068A1 (en) * 2010-08-11 2012-02-16 Applied Materials, Inc. Composite substrates for direct heating and increased temperature uniformity
US8840754B2 (en) * 2010-09-17 2014-09-23 Lam Research Corporation Polar regions for electrostatic de-chucking with lift pins
US9360771B2 (en) * 2011-03-17 2016-06-07 Asml Netherlands B.V. Electrostatic clamp, lithographic apparatus, and device manufacturing method
CN103165381B (zh) * 2011-12-15 2016-08-24 中微半导体设备(上海)有限公司 一种控制所负载基板温度的静电卡盘及等离子体处理装置
US9472444B2 (en) * 2012-08-23 2016-10-18 Taiwan Semiconductor Manufacturing Co., Ltd. Wafer support device
KR101413898B1 (ko) * 2012-11-06 2014-06-30 엔지케이 인슐레이터 엘티디 서셉터
JP6441927B2 (ja) 2013-08-06 2018-12-19 アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ 局部的に加熱されるマルチゾーン式の基板支持体
US20160230269A1 (en) * 2015-02-06 2016-08-11 Applied Materials, Inc. Radially outward pad design for electrostatic chuck surface
US20170069518A1 (en) * 2015-09-04 2017-03-09 Globalfoundries Inc. Electrostatic substrate holder with non-planar surface and method of etching
US10668558B2 (en) * 2016-03-29 2020-06-02 Ngk Insulators, Ltd. Metal wiring bonding structure and production method therefor
KR102155512B1 (ko) * 2017-05-22 2020-09-14 (주)코미코 반도체 제조용 정전척의 아킹 현상 개선방법
JP6924618B2 (ja) * 2017-05-30 2021-08-25 東京エレクトロン株式会社 静電チャック及びプラズマ処理装置
JP6811144B2 (ja) * 2017-05-30 2021-01-13 東京エレクトロン株式会社 プラズマ処理装置の静電チャックを運用する方法
JP2019057531A (ja) * 2017-09-19 2019-04-11 モメンティブ・パフォーマンス・マテリアルズ・ジャパン合同会社 ウエハ支持装置
CN111326468A (zh) * 2018-12-14 2020-06-23 夏泰鑫半导体(青岛)有限公司 静电吸盘装置
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JP2022148714A (ja) * 2021-03-24 2022-10-06 新光電気工業株式会社 静電チャック、基板固定装置

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Also Published As

Publication number Publication date
US5646814A (en) 1997-07-08
ATE160238T1 (de) 1997-11-15
EP0692814B1 (de) 1997-11-12
EP0692814A1 (de) 1996-01-17
KR960005930A (ko) 1996-02-23
DE69501018T2 (de) 1998-05-20
JPH08203991A (ja) 1996-08-09

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8339 Ceased/non-payment of the annual fee