ATE160238T1 - Vielfache elektrode elektrostatische haltevorrichtung - Google Patents

Vielfache elektrode elektrostatische haltevorrichtung

Info

Publication number
ATE160238T1
ATE160238T1 AT95111186T AT95111186T ATE160238T1 AT E160238 T1 ATE160238 T1 AT E160238T1 AT 95111186 T AT95111186 T AT 95111186T AT 95111186 T AT95111186 T AT 95111186T AT E160238 T1 ATE160238 T1 AT E160238T1
Authority
AT
Austria
Prior art keywords
chuck
electrode
substrate
support
insulator
Prior art date
Application number
AT95111186T
Other languages
English (en)
Inventor
Shamouil Shamouilian
Samuel Broydo
Manoocher Birang
Original Assignee
Applied Materials Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Applied Materials Inc filed Critical Applied Materials Inc
Application granted granted Critical
Publication of ATE160238T1 publication Critical patent/ATE160238T1/de

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/6875—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of individual support members, e.g. support posts or protrusions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
    • H01L21/6833—Details of electrostatic chucks
AT95111186T 1994-07-15 1995-07-17 Vielfache elektrode elektrostatische haltevorrichtung ATE160238T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US08/276,010 US5646814A (en) 1994-07-15 1994-07-15 Multi-electrode electrostatic chuck

Publications (1)

Publication Number Publication Date
ATE160238T1 true ATE160238T1 (de) 1997-11-15

Family

ID=23054769

Family Applications (1)

Application Number Title Priority Date Filing Date
AT95111186T ATE160238T1 (de) 1994-07-15 1995-07-17 Vielfache elektrode elektrostatische haltevorrichtung

Country Status (6)

Country Link
US (1) US5646814A (de)
EP (1) EP0692814B1 (de)
JP (1) JPH08203991A (de)
KR (1) KR960005930A (de)
AT (1) ATE160238T1 (de)
DE (1) DE69501018T2 (de)

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JP4302428B2 (ja) * 2003-05-09 2009-07-29 信越化学工業株式会社 静電吸着機能を有するウエーハ加熱装置
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JP4588653B2 (ja) * 2005-03-16 2010-12-01 東京エレクトロン株式会社 基板加熱機能を有する基板載置機構および基板処理装置
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KR100898793B1 (ko) * 2005-12-29 2009-05-20 엘지디스플레이 주식회사 액정표시소자용 기판 합착 장치
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JP2009246325A (ja) * 2008-03-28 2009-10-22 Creative Technology:Kk 静電チャック
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US20120037068A1 (en) * 2010-08-11 2012-02-16 Applied Materials, Inc. Composite substrates for direct heating and increased temperature uniformity
US8840754B2 (en) * 2010-09-17 2014-09-23 Lam Research Corporation Polar regions for electrostatic de-chucking with lift pins
CN103415812B (zh) * 2011-03-17 2015-10-21 Asml荷兰有限公司 静电夹具、光刻设备和器件制造方法
CN103165381B (zh) * 2011-12-15 2016-08-24 中微半导体设备(上海)有限公司 一种控制所负载基板温度的静电卡盘及等离子体处理装置
US9472444B2 (en) * 2012-08-23 2016-10-18 Taiwan Semiconductor Manufacturing Co., Ltd. Wafer support device
KR101413898B1 (ko) * 2012-11-06 2014-06-30 엔지케이 인슐레이터 엘티디 서셉터
JP6441927B2 (ja) 2013-08-06 2018-12-19 アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ 局部的に加熱されるマルチゾーン式の基板支持体
US20160230269A1 (en) * 2015-02-06 2016-08-11 Applied Materials, Inc. Radially outward pad design for electrostatic chuck surface
US20170069518A1 (en) * 2015-09-04 2017-03-09 Globalfoundries Inc. Electrostatic substrate holder with non-planar surface and method of etching
US10029328B2 (en) * 2016-03-29 2018-07-24 Ngk Insulators, Ltd. Metal wiring bonding structure and production method therefor
KR102155512B1 (ko) * 2017-05-22 2020-09-14 (주)코미코 반도체 제조용 정전척의 아킹 현상 개선방법
JP6811144B2 (ja) * 2017-05-30 2021-01-13 東京エレクトロン株式会社 プラズマ処理装置の静電チャックを運用する方法
JP6924618B2 (ja) * 2017-05-30 2021-08-25 東京エレクトロン株式会社 静電チャック及びプラズマ処理装置
JP2019057531A (ja) * 2017-09-19 2019-04-11 モメンティブ・パフォーマンス・マテリアルズ・ジャパン合同会社 ウエハ支持装置
CN111326468A (zh) * 2018-12-14 2020-06-23 夏泰鑫半导体(青岛)有限公司 静电吸盘装置
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Also Published As

Publication number Publication date
EP0692814A1 (de) 1996-01-17
US5646814A (en) 1997-07-08
EP0692814B1 (de) 1997-11-12
DE69501018T2 (de) 1998-05-20
JPH08203991A (ja) 1996-08-09
DE69501018D1 (de) 1997-12-18
KR960005930A (ko) 1996-02-23

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