ATE160238T1 - Vielfache elektrode elektrostatische haltevorrichtung - Google Patents

Vielfache elektrode elektrostatische haltevorrichtung

Info

Publication number
ATE160238T1
ATE160238T1 AT95111186T AT95111186T ATE160238T1 AT E160238 T1 ATE160238 T1 AT E160238T1 AT 95111186 T AT95111186 T AT 95111186T AT 95111186 T AT95111186 T AT 95111186T AT E160238 T1 ATE160238 T1 AT E160238T1
Authority
AT
Austria
Prior art keywords
chuck
electrode
substrate
support
insulator
Prior art date
Application number
AT95111186T
Other languages
English (en)
Inventor
Shamouil Shamouilian
Samuel Broydo
Manoocher Birang
Original Assignee
Applied Materials Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Applied Materials Inc filed Critical Applied Materials Inc
Application granted granted Critical
Publication of ATE160238T1 publication Critical patent/ATE160238T1/de

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/6875—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of individual support members, e.g. support posts or protrusions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
    • H01L21/6833—Details of electrostatic chucks

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Electrical Discharge Machining, Electrochemical Machining, And Combined Machining (AREA)
  • Micromachines (AREA)
  • Electron Tubes For Measurement (AREA)
  • Jigs For Machine Tools (AREA)
AT95111186T 1994-07-15 1995-07-17 Vielfache elektrode elektrostatische haltevorrichtung ATE160238T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US08/276,010 US5646814A (en) 1994-07-15 1994-07-15 Multi-electrode electrostatic chuck

Publications (1)

Publication Number Publication Date
ATE160238T1 true ATE160238T1 (de) 1997-11-15

Family

ID=23054769

Family Applications (1)

Application Number Title Priority Date Filing Date
AT95111186T ATE160238T1 (de) 1994-07-15 1995-07-17 Vielfache elektrode elektrostatische haltevorrichtung

Country Status (6)

Country Link
US (1) US5646814A (de)
EP (1) EP0692814B1 (de)
JP (1) JPH08203991A (de)
KR (1) KR960005930A (de)
AT (1) ATE160238T1 (de)
DE (1) DE69501018T2 (de)

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US6117246A (en) * 1997-01-31 2000-09-12 Applied Materials, Inc. Conductive polymer pad for supporting a workpiece upon a workpiece support surface of an electrostatic chuck
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US5880924A (en) * 1997-12-01 1999-03-09 Applied Materials, Inc. Electrostatic chuck capable of rapidly dechucking a substrate
US5969934A (en) * 1998-04-10 1999-10-19 Varian Semiconductor Equipment Associats, Inc. Electrostatic wafer clamp having low particulate contamination of wafers
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US6259592B1 (en) 1998-11-19 2001-07-10 Applied Materials, Inc. Apparatus for retaining a workpiece upon a workpiece support and method of manufacturing same
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US6488820B1 (en) * 1999-08-23 2002-12-03 Applied Materials, Inc. Method and apparatus for reducing migration of conductive material on a component
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US20120037068A1 (en) * 2010-08-11 2012-02-16 Applied Materials, Inc. Composite substrates for direct heating and increased temperature uniformity
US8840754B2 (en) * 2010-09-17 2014-09-23 Lam Research Corporation Polar regions for electrostatic de-chucking with lift pins
KR101872886B1 (ko) * 2011-03-17 2018-06-29 에이에스엠엘 네델란즈 비.브이. 정전기 클램프, 리소그래피 장치, 및 디바이스 제조 방법
CN103165381B (zh) * 2011-12-15 2016-08-24 中微半导体设备(上海)有限公司 一种控制所负载基板温度的静电卡盘及等离子体处理装置
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KR101413898B1 (ko) * 2012-11-06 2014-06-30 엔지케이 인슐레이터 엘티디 서셉터
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US20160230269A1 (en) * 2015-02-06 2016-08-11 Applied Materials, Inc. Radially outward pad design for electrostatic chuck surface
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US10029328B2 (en) * 2016-03-29 2018-07-24 Ngk Insulators, Ltd. Metal wiring bonding structure and production method therefor
KR102155512B1 (ko) * 2017-05-22 2020-09-14 (주)코미코 반도체 제조용 정전척의 아킹 현상 개선방법
JP6924618B2 (ja) * 2017-05-30 2021-08-25 東京エレクトロン株式会社 静電チャック及びプラズマ処理装置
JP6811144B2 (ja) * 2017-05-30 2021-01-13 東京エレクトロン株式会社 プラズマ処理装置の静電チャックを運用する方法
JP2019057531A (ja) * 2017-09-19 2019-04-11 モメンティブ・パフォーマンス・マテリアルズ・ジャパン合同会社 ウエハ支持装置
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Also Published As

Publication number Publication date
DE69501018T2 (de) 1998-05-20
DE69501018D1 (de) 1997-12-18
EP0692814B1 (de) 1997-11-12
KR960005930A (ko) 1996-02-23
EP0692814A1 (de) 1996-01-17
US5646814A (en) 1997-07-08
JPH08203991A (ja) 1996-08-09

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