WO2009013803A1 - 静電チャックの表面電位制御方法 - Google Patents
静電チャックの表面電位制御方法 Download PDFInfo
- Publication number
- WO2009013803A1 WO2009013803A1 PCT/JP2007/064429 JP2007064429W WO2009013803A1 WO 2009013803 A1 WO2009013803 A1 WO 2009013803A1 JP 2007064429 W JP2007064429 W JP 2007064429W WO 2009013803 A1 WO2009013803 A1 WO 2009013803A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- surface potential
- electrode
- electrostatic chuck
- potential
- controlling surface
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
- B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
- B65G49/06—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
- B65G49/061—Lifting, gripping, or carrying means, for one or more sheets forming independent means of transport, e.g. suction cups, transport frames
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G2249/00—Aspects relating to conveying systems for the manufacture of fragile sheets
- B65G2249/02—Controlled or contamination-free environments or clean space conditions
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Jigs For Machine Tools (AREA)
Abstract
ワーク吸着面の表面電位を安全レベルまで抑制する。 第一電極部(1)及び第二電極部(2)に異なる極性の電圧の組を印加して、これら両電極部(1),(2)の面積の非対称による表面電位のアンバランスを打ち消すことにより、静電吸着力に必要な両電極(1),(2)の電位差を確保しながらワーク吸着面(4)がそれに近い電極の電位に偏ることがない。
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007540441A JP4126084B1 (ja) | 2007-07-23 | 2007-07-23 | 静電チャックの表面電位制御方法 |
PCT/JP2007/064429 WO2009013803A1 (ja) | 2007-07-23 | 2007-07-23 | 静電チャックの表面電位制御方法 |
TW097126087A TW200913124A (en) | 2007-07-23 | 2008-07-10 | Method of controlling surface potential of electrostatic chuck |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/JP2007/064429 WO2009013803A1 (ja) | 2007-07-23 | 2007-07-23 | 静電チャックの表面電位制御方法 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2009013803A1 true WO2009013803A1 (ja) | 2009-01-29 |
Family
ID=39704941
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2007/064429 WO2009013803A1 (ja) | 2007-07-23 | 2007-07-23 | 静電チャックの表面電位制御方法 |
Country Status (3)
Country | Link |
---|---|
JP (1) | JP4126084B1 (ja) |
TW (1) | TW200913124A (ja) |
WO (1) | WO2009013803A1 (ja) |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP2430654A2 (en) * | 2009-05-15 | 2012-03-21 | Entegris, Inc. | Electrostatic chuck with polymer protrusions |
WO2014157014A1 (ja) * | 2013-03-29 | 2014-10-02 | 株式会社クリエイティブ テクノロジー | チャック装置 |
US8861170B2 (en) | 2009-05-15 | 2014-10-14 | Entegris, Inc. | Electrostatic chuck with photo-patternable soft protrusion contact surface |
US9025305B2 (en) | 2010-05-28 | 2015-05-05 | Entegris, Inc. | High surface resistivity electrostatic chuck |
KR20160133353A (ko) | 2015-05-12 | 2016-11-22 | 가부시키가이샤 히다치 하이테크놀로지즈 | 플라즈마 처리 장치 및 플라즈마 처리 방법 |
US9543187B2 (en) | 2008-05-19 | 2017-01-10 | Entegris, Inc. | Electrostatic chuck |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
SG11201503454QA (en) * | 2012-11-02 | 2015-06-29 | Entegris Inc | Electrostatic chuck with photo-patternable soft protrusion contact surface |
CN114347457A (zh) * | 2021-12-28 | 2022-04-15 | 广州国显科技有限公司 | 贴附系统及贴附方法 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH08203991A (ja) * | 1994-07-15 | 1996-08-09 | Applied Materials Inc | 多電極静電チャック |
JP2005064105A (ja) * | 2003-08-08 | 2005-03-10 | Tomoegawa Paper Co Ltd | 静電チャック装置用電極シート、静電チャック装置および吸着方法 |
-
2007
- 2007-07-23 WO PCT/JP2007/064429 patent/WO2009013803A1/ja active Application Filing
- 2007-07-23 JP JP2007540441A patent/JP4126084B1/ja not_active Expired - Fee Related
-
2008
- 2008-07-10 TW TW097126087A patent/TW200913124A/zh not_active IP Right Cessation
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH08203991A (ja) * | 1994-07-15 | 1996-08-09 | Applied Materials Inc | 多電極静電チャック |
JP2005064105A (ja) * | 2003-08-08 | 2005-03-10 | Tomoegawa Paper Co Ltd | 静電チャック装置用電極シート、静電チャック装置および吸着方法 |
Cited By (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9543187B2 (en) | 2008-05-19 | 2017-01-10 | Entegris, Inc. | Electrostatic chuck |
US10395963B2 (en) | 2008-05-19 | 2019-08-27 | Entegris, Inc. | Electrostatic chuck |
US8861170B2 (en) | 2009-05-15 | 2014-10-14 | Entegris, Inc. | Electrostatic chuck with photo-patternable soft protrusion contact surface |
US9721821B2 (en) | 2009-05-15 | 2017-08-01 | Entegris, Inc. | Electrostatic chuck with photo-patternable soft protrusion contact surface |
EP2430654A2 (en) * | 2009-05-15 | 2012-03-21 | Entegris, Inc. | Electrostatic chuck with polymer protrusions |
US8879233B2 (en) | 2009-05-15 | 2014-11-04 | Entegris, Inc. | Electrostatic chuck with polymer protrusions |
CN102449754A (zh) * | 2009-05-15 | 2012-05-09 | 恩特格林斯公司 | 具有聚合物突出物的静电吸盘 |
EP2430654A4 (en) * | 2009-05-15 | 2013-12-04 | Entegris Inc | ELECTROSTATIC LINING WITH POLYMER PROPUTS |
US9025305B2 (en) | 2010-05-28 | 2015-05-05 | Entegris, Inc. | High surface resistivity electrostatic chuck |
JPWO2014157014A1 (ja) * | 2013-03-29 | 2017-02-16 | 株式会社クリエイティブテクノロジー | チャック装置 |
WO2014157014A1 (ja) * | 2013-03-29 | 2014-10-02 | 株式会社クリエイティブ テクノロジー | チャック装置 |
KR20180001536A (ko) | 2015-05-12 | 2018-01-04 | 가부시키가이샤 히다치 하이테크놀로지즈 | 플라즈마 처리 장치 및 플라즈마 처리 방법 |
US9941133B2 (en) | 2015-05-12 | 2018-04-10 | Hitachi High-Technologies Corporation | Plasma processing apparatus and plasma processing method |
US10395935B2 (en) | 2015-05-12 | 2019-08-27 | Hitachi High-Technologies Corporation | Plasma processing apparatus and plasma processing method |
KR20160133353A (ko) | 2015-05-12 | 2016-11-22 | 가부시키가이샤 히다치 하이테크놀로지즈 | 플라즈마 처리 장치 및 플라즈마 처리 방법 |
US11315792B2 (en) | 2015-05-12 | 2022-04-26 | Hitachi High-Tech Corporation | Plasma processing apparatus and plasma processing method |
Also Published As
Publication number | Publication date |
---|---|
TWI352401B (ja) | 2011-11-11 |
JP4126084B1 (ja) | 2008-07-30 |
TW200913124A (en) | 2009-03-16 |
JPWO2009013803A1 (ja) | 2010-09-24 |
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