TW352461B - Method of cleaning wafer after partial saw - Google Patents

Method of cleaning wafer after partial saw

Info

Publication number
TW352461B
TW352461B TW086104754A TW86104754A TW352461B TW 352461 B TW352461 B TW 352461B TW 086104754 A TW086104754 A TW 086104754A TW 86104754 A TW86104754 A TW 86104754A TW 352461 B TW352461 B TW 352461B
Authority
TW
Taiwan
Prior art keywords
wafer
cleaning wafer
saw
partial saw
cleaning
Prior art date
Application number
TW086104754A
Other languages
English (en)
Inventor
Toshiyuki Kaeriyama
Takashi Harada
Original Assignee
Texas Instruments Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Texas Instruments Inc filed Critical Texas Instruments Inc
Application granted granted Critical
Publication of TW352461B publication Critical patent/TW352461B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041—Cleaning
    • H01L21/02043—Cleaning before device manufacture, i.e. Begin-Of-Line process
    • H01L21/02052—Wet cleaning only
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Micromachines (AREA)
  • Dicing (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
TW086104754A 1996-04-10 1997-04-10 Method of cleaning wafer after partial saw TW352461B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US1510796P 1996-04-10 1996-04-10

Publications (1)

Publication Number Publication Date
TW352461B true TW352461B (en) 1999-02-11

Family

ID=21769579

Family Applications (1)

Application Number Title Priority Date Filing Date
TW086104754A TW352461B (en) 1996-04-10 1997-04-10 Method of cleaning wafer after partial saw

Country Status (6)

Country Link
US (1) US5872046A (zh)
EP (1) EP0818808B1 (zh)
JP (1) JP3803451B2 (zh)
KR (1) KR100459058B1 (zh)
DE (1) DE69734542T2 (zh)
TW (1) TW352461B (zh)

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US7314377B2 (en) * 1998-04-17 2008-01-01 Fci Americas Technology, Inc. Electrical power connector
KR100268426B1 (ko) * 1998-05-07 2000-11-01 윤종용 반도체 장치의 제조 방법
US6413839B1 (en) * 1998-10-23 2002-07-02 Emcore Corporation Semiconductor device separation using a patterned laser projection
US6024106A (en) * 1998-11-19 2000-02-15 United Microelectronics Corp. Post-CMP wafer clean process
TW420845B (en) * 1999-08-11 2001-02-01 Siliconware Precision Industries Co Ltd Die sawing and grinding process
US6335224B1 (en) * 2000-05-16 2002-01-01 Sandia Corporation Protection of microelectronic devices during packaging
US6995034B2 (en) * 2000-12-07 2006-02-07 Reflectivity, Inc Methods for depositing, releasing and packaging micro-electromechanical devices on wafer substrates
US7307775B2 (en) * 2000-12-07 2007-12-11 Texas Instruments Incorporated Methods for depositing, releasing and packaging micro-electromechanical devices on wafer substrates
US20020122881A1 (en) * 2000-12-29 2002-09-05 Toshiyuki Kaeriyama Micromechanical device recoat methods
EP1220010A3 (en) * 2000-12-29 2004-10-27 Texas Instruments Incorporated Micromechanical device recoat methods
ATE370920T1 (de) * 2001-03-09 2007-09-15 Datec Coating Corp Im sol-gel-verfahren hergestellte widerstands- und leitfähige beschichtung
US6566886B1 (en) 2001-03-28 2003-05-20 Advanced Micro Devices, Inc. Method of detecting crystalline defects using sound waves
US20020142594A1 (en) * 2001-03-28 2002-10-03 Advanced Micro Devices, Inc. Sacrificial films to provide structural integrity to critical dimension structures
JP4565804B2 (ja) * 2002-06-03 2010-10-20 スリーエム イノベイティブ プロパティズ カンパニー 被研削基材を含む積層体、その製造方法並びに積層体を用いた極薄基材の製造方法及びそのための装置
US7534498B2 (en) * 2002-06-03 2009-05-19 3M Innovative Properties Company Laminate body, method, and apparatus for manufacturing ultrathin substrate using the laminate body
US6700173B1 (en) 2002-08-20 2004-03-02 Memx, Inc. Electrically isolated support for overlying MEM structure
US20040036378A1 (en) * 2002-08-20 2004-02-26 Rodgers Murray Steven Dust cover for MEM components
US6875257B2 (en) * 2002-08-20 2005-04-05 Memx, Inc. Particle filter for microelectromechanical systems
US6703675B1 (en) 2002-08-20 2004-03-09 Memx, Inc. Particle filter for partially enclosed microelectromechanical systems
US7405860B2 (en) * 2002-11-26 2008-07-29 Texas Instruments Incorporated Spatial light modulators with light blocking/absorbing areas
US20040147169A1 (en) * 2003-01-28 2004-07-29 Allison Jeffrey W. Power connector with safety feature
TWI248244B (en) 2003-02-19 2006-01-21 J P Sercel Associates Inc System and method for cutting using a variable astigmatic focal beam spot
US20040232535A1 (en) * 2003-05-22 2004-11-25 Terry Tarn Microelectromechanical device packages with integral heaters
US20050093134A1 (en) * 2003-10-30 2005-05-05 Terry Tarn Device packages with low stress assembly process
US7247579B2 (en) * 2004-12-23 2007-07-24 Lam Research Corporation Cleaning methods for silicon electrode assembly surface contamination removal
JP4543970B2 (ja) * 2005-03-04 2010-09-15 株式会社デンソー 半導体装置の製造方法
US7408250B2 (en) * 2005-04-05 2008-08-05 Texas Instruments Incorporated Micromirror array device with compliant adhesive
US7508063B2 (en) * 2005-04-05 2009-03-24 Texas Instruments Incorporated Low cost hermetically sealed package
US7682937B2 (en) * 2005-11-25 2010-03-23 Advanced Laser Separation International B.V. Method of treating a substrate, method of processing a substrate using a laser beam, and arrangement
US7376215B2 (en) * 2005-12-27 2008-05-20 Honeywell International Inc. Measurement of ash composition using scanning high voltage X-ray sensor
US20080014532A1 (en) * 2006-07-14 2008-01-17 3M Innovative Properties Company Laminate body, and method for manufacturing thin substrate using the laminate body
JP4985291B2 (ja) * 2007-10-01 2012-07-25 株式会社デンソー ウェハの加工方法
JP2009176793A (ja) * 2008-01-22 2009-08-06 Disco Abrasive Syst Ltd ウエーハの分割方法
USD619099S1 (en) 2009-01-30 2010-07-06 Fci Americas Technology, Inc. Electrical connector
US8323049B2 (en) * 2009-01-30 2012-12-04 Fci Americas Technology Llc Electrical connector having power contacts
US8609512B2 (en) * 2009-03-27 2013-12-17 Electro Scientific Industries, Inc. Method for laser singulation of chip scale packages on glass substrates
JP5638605B2 (ja) 2009-06-25 2014-12-10 アイメックＩｍｅｃ 生体適合性パッケージング
US20130256286A1 (en) * 2009-12-07 2013-10-03 Ipg Microsystems Llc Laser processing using an astigmatic elongated beam spot and using ultrashort pulses and/or longer wavelengths
JP5734734B2 (ja) 2010-05-18 2015-06-17 ローム アンド ハース エレクトロニック マテリアルズ エルエルシーＲｏｈｍ ａｎｄ Ｈａａｓ Ｅｌｅｃｔｒｏｎｉｃ Ｍａｔｅｒｉａｌｓ ＬＬＣ 半導体上に電流トラックを形成する方法
JP6111335B2 (ja) * 2013-08-08 2017-04-05 シャープ株式会社 半導体素子基板およびその製造方法
US10329142B2 (en) * 2015-12-18 2019-06-25 Samsung Electro-Mechanics Co., Ltd. Wafer level package and method of manufacturing the same
US10879212B2 (en) * 2017-05-11 2020-12-29 Invensas Bonding Technologies, Inc. Processed stacked dies
CN111892013A (zh) * 2020-06-28 2020-11-06 深圳清华大学研究院 一种硅基底薄膜的制备方法

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US4033027A (en) * 1975-09-26 1977-07-05 Bell Telephone Laboratories, Incorporated Dividing metal plated semiconductor wafers
US5061049A (en) * 1984-08-31 1991-10-29 Texas Instruments Incorporated Spatial light modulator and method
US4729971A (en) * 1987-03-31 1988-03-08 Microwave Semiconductor Corporation Semiconductor wafer dicing techniques
US5079544A (en) * 1989-02-27 1992-01-07 Texas Instruments Incorporated Standard independent digitized video system
US5179035A (en) * 1989-09-15 1993-01-12 U.S. Philips Corporation Method of fabricating two-terminal non-linear devices
US5105369A (en) * 1989-12-21 1992-04-14 Texas Instruments Incorporated Printing system exposure module alignment method and apparatus of manufacture
JPH07120646B2 (ja) * 1990-05-16 1995-12-20 株式会社東芝 メサ型半導体ペレットの製造方法
CA2063744C (en) * 1991-04-01 2002-10-08 Paul M. Urbanus Digital micromirror device architecture and timing for use in a pulse-width modulated display system
US5393706A (en) * 1993-01-07 1995-02-28 Texas Instruments Incorporated Integrated partial sawing process
US5435876A (en) * 1993-03-29 1995-07-25 Texas Instruments Incorporated Grid array masking tape process
US5445559A (en) * 1993-06-24 1995-08-29 Texas Instruments Incorporated Wafer-like processing after sawing DMDs
US5389182A (en) * 1993-08-02 1995-02-14 Texas Instruments Incorporated Use of a saw frame with tape as a substrate carrier for wafer level backend processing
US5597767A (en) * 1995-01-06 1997-01-28 Texas Instruments Incorporated Separation of wafer into die with wafer-level processing

Also Published As

Publication number Publication date
EP0818808B1 (en) 2005-11-09
EP0818808A3 (en) 1998-06-03
DE69734542T2 (de) 2006-07-20
DE69734542D1 (de) 2005-12-15
EP0818808A2 (en) 1998-01-14
JPH1032180A (ja) 1998-02-03
KR100459058B1 (ko) 2005-02-05
KR970072154A (ko) 1997-11-07
JP3803451B2 (ja) 2006-08-02
US5872046A (en) 1999-02-16

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees