JP5638605B2 - 生体適合性パッケージング - Google Patents
生体適合性パッケージング Download PDFInfo
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- JP5638605B2 JP5638605B2 JP2012516759A JP2012516759A JP5638605B2 JP 5638605 B2 JP5638605 B2 JP 5638605B2 JP 2012516759 A JP2012516759 A JP 2012516759A JP 2012516759 A JP2012516759 A JP 2012516759A JP 5638605 B2 JP5638605 B2 JP 5638605B2
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- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
- A61B5/00—Measuring for diagnostic purposes; Identification of persons
- A61B5/68—Arrangements of detecting, measuring or recording means, e.g. sensors, in relation to patient
- A61B5/6846—Arrangements of detecting, measuring or recording means, e.g. sensors, in relation to patient specially adapted to be brought in contact with an internal body part, i.e. invasive
- A61B5/6847—Arrangements of detecting, measuring or recording means, e.g. sensors, in relation to patient specially adapted to be brought in contact with an internal body part, i.e. invasive mounted on an invasive device
- A61B5/686—Permanently implanted devices, e.g. pacemakers, other stimulators, biochips
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- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61M—DEVICES FOR INTRODUCING MEDIA INTO, OR ONTO, THE BODY; DEVICES FOR TRANSDUCING BODY MEDIA OR FOR TAKING MEDIA FROM THE BODY; DEVICES FOR PRODUCING OR ENDING SLEEP OR STUPOR
- A61M5/00—Devices for bringing media into the body in a subcutaneous, intra-vascular or intramuscular way; Accessories therefor, e.g. filling or cleaning devices, arm-rests
- A61M5/14—Infusion devices, e.g. infusing by gravity; Blood infusion; Accessories therefor
- A61M5/142—Pressure infusion, e.g. using pumps
- A61M5/14244—Pressure infusion, e.g. using pumps adapted to be carried by the patient, e.g. portable on the body
- A61M5/14276—Pressure infusion, e.g. using pumps adapted to be carried by the patient, e.g. portable on the body specially adapted for implantation
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- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61N—ELECTROTHERAPY; MAGNETOTHERAPY; RADIATION THERAPY; ULTRASOUND THERAPY
- A61N1/00—Electrotherapy; Circuits therefor
- A61N1/18—Applying electric currents by contact electrodes
- A61N1/32—Applying electric currents by contact electrodes alternating or intermittent currents
- A61N1/36—Applying electric currents by contact electrodes alternating or intermittent currents for stimulation
- A61N1/372—Arrangements in connection with the implantation of stimulators
- A61N1/37205—Microstimulators, e.g. implantable through a cannula
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- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61N—ELECTROTHERAPY; MAGNETOTHERAPY; RADIATION THERAPY; ULTRASOUND THERAPY
- A61N1/00—Electrotherapy; Circuits therefor
- A61N1/18—Applying electric currents by contact electrodes
- A61N1/32—Applying electric currents by contact electrodes alternating or intermittent currents
- A61N1/36—Applying electric currents by contact electrodes alternating or intermittent currents for stimulation
- A61N1/372—Arrangements in connection with the implantation of stimulators
- A61N1/375—Constructional arrangements, e.g. casings
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
- H01L23/3114—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed the device being a chip scale package, e.g. CSP
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- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
- A61B2562/00—Details of sensors; Constructional details of sensor housings or probes; Accessories for sensors
- A61B2562/02—Details of sensors specially adapted for in-vivo measurements
- A61B2562/0247—Pressure sensors
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- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
- A61B2562/00—Details of sensors; Constructional details of sensor housings or probes; Accessories for sensors
- A61B2562/02—Details of sensors specially adapted for in-vivo measurements
- A61B2562/028—Microscale sensors, e.g. electromechanical sensors [MEMS]
-
- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
- A61B5/00—Measuring for diagnostic purposes; Identification of persons
- A61B5/68—Arrangements of detecting, measuring or recording means, e.g. sensors, in relation to patient
- A61B5/6846—Arrangements of detecting, measuring or recording means, e.g. sensors, in relation to patient specially adapted to be brought in contact with an internal body part, i.e. invasive
- A61B5/6847—Arrangements of detecting, measuring or recording means, e.g. sensors, in relation to patient specially adapted to be brought in contact with an internal body part, i.e. invasive mounted on an invasive device
- A61B5/6861—Capsules, e.g. for swallowing or implanting
-
- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61M—DEVICES FOR INTRODUCING MEDIA INTO, OR ONTO, THE BODY; DEVICES FOR TRANSDUCING BODY MEDIA OR FOR TAKING MEDIA FROM THE BODY; DEVICES FOR PRODUCING OR ENDING SLEEP OR STUPOR
- A61M2205/00—General characteristics of the apparatus
- A61M2205/02—General characteristics of the apparatus characterised by a particular materials
- A61M2205/0244—Micromachined materials, e.g. made from silicon wafers, microelectromechanical systems [MEMS] or comprising nanotechnology
-
- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61M—DEVICES FOR INTRODUCING MEDIA INTO, OR ONTO, THE BODY; DEVICES FOR TRANSDUCING BODY MEDIA OR FOR TAKING MEDIA FROM THE BODY; DEVICES FOR PRODUCING OR ENDING SLEEP OR STUPOR
- A61M2205/00—General characteristics of the apparatus
- A61M2205/82—Internal energy supply devices
- A61M2205/8206—Internal energy supply devices battery-operated
-
- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61N—ELECTROTHERAPY; MAGNETOTHERAPY; RADIATION THERAPY; ULTRASOUND THERAPY
- A61N1/00—Electrotherapy; Circuits therefor
- A61N1/18—Applying electric currents by contact electrodes
- A61N1/32—Applying electric currents by contact electrodes alternating or intermittent currents
- A61N1/36—Applying electric currents by contact electrodes alternating or intermittent currents for stimulation
- A61N1/372—Arrangements in connection with the implantation of stimulators
- A61N1/375—Constructional arrangements, e.g. casings
- A61N1/3756—Casings with electrodes thereon, e.g. leadless stimulators
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/102—Material of the semiconductor or solid state bodies
- H01L2924/1025—Semiconducting materials
- H01L2924/10251—Elemental semiconductors, i.e. Group IV
- H01L2924/10253—Silicon [Si]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/14—Integrated circuits
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/146—Mixed devices
- H01L2924/1461—MEMS
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
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- Biomedical Technology (AREA)
- Animal Behavior & Ethology (AREA)
- General Health & Medical Sciences (AREA)
- Public Health (AREA)
- Heart & Thoracic Surgery (AREA)
- Physics & Mathematics (AREA)
- Radiology & Medical Imaging (AREA)
- Nuclear Medicine, Radiotherapy & Molecular Imaging (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Vascular Medicine (AREA)
- Anesthesiology (AREA)
- Hematology (AREA)
- Molecular Biology (AREA)
- Medical Informatics (AREA)
- Pathology (AREA)
- Surgery (AREA)
- Biophysics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
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- Apparatus Associated With Microorganisms And Enzymes (AREA)
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Description
Claims (14)
- 基板(420)上でコンポーネント(410)を得ることと、
コンポーネント(410)及び基板(420)の第1部分を、基板(420)の第2部分から分離することと、
コンポーネント(410)のために封入部を設けることとを含む
生物医学用インビボデバイスのパッケージ方法であって、
分離することは、凹部を設けることを含み、
凹部を設けることは、基板上の同じ位置で、少なくとも1つの傾斜壁を有する凹部を誘導する少なくとも1つの物理的プロセス、及び直立壁を有する凹部を誘導する物理的プロセスを使用し、凹部を設けることにより、基板の上面で、底部よりも広い上部を有する凹部を得て、
コンポーネント(410)のために封入部を設けることは、基板(420)の上面及び凹部(414)の少なくとも一部を覆う第1キャップ層(440)を堆積することを含む
方法。 - 少なくとも1つの物理的プロセスを使用することは、傾斜側壁を有する凹部(414)又は切断部を作成するために、少なくとも、充分に傾斜したブレード面を有するブレードを用いてダイシングすることを含む請求項1記載のパッケージ方法。
- 分離することは、基板(420)上でコンポーネント(410)が存在する基板(420)の側面で、基板(420)の第1部分に傾斜面を誘導する物理的プロセスを使用することを含む請求項1又は2に記載の方法。
- 前記基板(420)の上面に凹部(414)を設けることは、
基板上面に実質的に垂直な側壁を切断部に付与するブレードを用いて、上面に第1ダイシングプロセスを施すことと、
基板(420)の表面に実質的に非垂直な傾斜側壁を切断部に付与するブレードを用いて、上面に少なくとも1つの第2ダイシングプロセスを施すこととを含み、
第1ダイシングプロセス及び第2ダイシングプロセスは、基板表面上の実質的に同じ位置で実施される請求項1〜3のいずれか1項に記載のパッケージ方法。 - 分離することは、
基板(420)上でコンポーネントが存在する基板(420)の側面と反対側の基板(420)の側面で、基板(420)の第1部分に傾斜面を誘導する第2物理的プロセスを使用することを含む請求項1〜4のいずれか1項に記載のパッケージ方法。 - 分離すること、及び封入部を設けることは、
基板(420)の上面の凹部(414)と実質的に反対側の位置で、基板(420)の底面を薄厚化し、その結果切断部が形成され、基板(420)の第1部分は基板(420)の第2部分から分離することと、
底面、及び基板(420)の底面で切断部の壁に対応する領域の少なくとも一部を覆う第1キャップ層(440)を堆積することとをさらに含む請求項1〜5のいずれか1項に記載のパッケージ方法。 - 基板(420)の底面を薄厚化した後、底面のエッジが傾斜側壁を有するように少なくとも1つの傾斜側壁を誘導する第2物理的プロセスを使用することを含む請求項6記載の方法。
- 基板(420)の底面を薄厚化するために、
基板(420)は、薄厚化の前に上面でキャリアに固定され、
キャリアは、底面で少なくとも1つの傾斜側壁を誘導した後に除去される請求項7記載の方法。 - 前記分離の後に、更なる封入層(450)を設けることをさらに含む請求項1〜8のいずれか1項に記載の方法。
- 更なる封入層(450)を設ける前に、追加の洗浄ステップを実施する請求項9記載の方法。
- 傾斜面を誘導する少なくとも1つの物理的プロセスを使用する前に、チップを保護するための保護トップコーティング(412)を付加することを含む請求項1〜10のいずれか1項に記載のパッケージ方法。
- 傾斜面を誘導する少なくとも1つの物理的プロセスを使用した後、表面損傷を除去するためのプラズマ処理を施すことを含む請求項1〜11のいずれか1項に記載のパッケージ方法。
- コンポーネント(410)のために封入部を設けることは、
サブ層の、追随して実施する2つの異なる堆積を用いて封入層を堆積することを含み、
サブ層は、封入層を形成する請求項1〜12のいずれか1項に記載のパッケージ方法。 - 基板(420)上に存在するコンポーネント(410)と、
封入部と、
請求項1〜13のいずれか1項に記載のデバイスのパッケージ方法を使用して誘導される少なくとも1つの傾斜側壁とを備えた生物医学用デバイス。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US22052809P | 2009-06-25 | 2009-06-25 | |
US61/220,528 | 2009-06-25 | ||
PCT/EP2010/059055 WO2010149762A2 (en) | 2009-06-25 | 2010-06-25 | Biocompatible packaging |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2012531058A JP2012531058A (ja) | 2012-12-06 |
JP2012531058A5 JP2012531058A5 (ja) | 2013-02-14 |
JP5638605B2 true JP5638605B2 (ja) | 2014-12-10 |
Family
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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JP2012516759A Expired - Fee Related JP5638605B2 (ja) | 2009-06-25 | 2010-06-25 | 生体適合性パッケージング |
Country Status (4)
Country | Link |
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US (2) | US9048198B2 (ja) |
EP (1) | EP2446478B1 (ja) |
JP (1) | JP5638605B2 (ja) |
WO (1) | WO2010149762A2 (ja) |
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JP5638605B2 (ja) | 2009-06-25 | 2014-12-10 | アイメックImec | 生体適合性パッケージング |
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2010
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- 2010-06-25 WO PCT/EP2010/059055 patent/WO2010149762A2/en active Application Filing
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Publication number | Publication date |
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EP2446478B1 (en) | 2018-09-12 |
WO2010149762A3 (en) | 2011-04-21 |
US20120209100A1 (en) | 2012-08-16 |
JP2012531058A (ja) | 2012-12-06 |
EP2446478A2 (en) | 2012-05-02 |
WO2010149762A2 (en) | 2010-12-29 |
US9048198B2 (en) | 2015-06-02 |
US20150297136A1 (en) | 2015-10-22 |
US10271796B2 (en) | 2019-04-30 |
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