TW350863B - Liquid, radiation-curable composition, especially for stereolithography - Google Patents
Liquid, radiation-curable composition, especially for stereolithographyInfo
- Publication number
- TW350863B TW350863B TW086110701A TW86110701A TW350863B TW 350863 B TW350863 B TW 350863B TW 086110701 A TW086110701 A TW 086110701A TW 86110701 A TW86110701 A TW 86110701A TW 350863 B TW350863 B TW 350863B
- Authority
- TW
- Taiwan
- Prior art keywords
- weight
- methyl
- formula
- liquid
- hydrogen atom
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B33—ADDITIVE MANUFACTURING TECHNOLOGY
- B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
- B33Y70/00—Materials specially adapted for additive manufacturing
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/02—Polycondensates containing more than one epoxy group per molecule
- C08G59/022—Polycondensates containing more than one epoxy group per molecule characterised by the preparation process or apparatus used
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/62—Alcohols or phenols
- C08G59/621—Phenols
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/0037—Production of three-dimensional images
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
- C08L2205/025—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group containing two or more polymers of the same hierarchy C08L, and differing only in parameters such as density, comonomer content, molecular weight, structure
Landscapes
- Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- General Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Health & Medical Sciences (AREA)
- Materials Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Epoxy Resins (AREA)
- Polymerisation Methods In General (AREA)
- Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
- Materials For Photolithography (AREA)
- Heating, Cooling, Or Curing Plastics Or The Like In General (AREA)
- Paints Or Removers (AREA)
- Macromonomer-Based Addition Polymer (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CH188596 | 1996-07-29 | ||
CH220196 | 1996-09-05 |
Publications (1)
Publication Number | Publication Date |
---|---|
TW350863B true TW350863B (en) | 1999-01-21 |
Family
ID=25688916
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW086110701A TW350863B (en) | 1996-07-29 | 1997-07-28 | Liquid, radiation-curable composition, especially for stereolithography |
Country Status (10)
Country | Link |
---|---|
US (1) | US5972563A (zh) |
EP (1) | EP0822445B2 (zh) |
JP (1) | JP3564650B2 (zh) |
KR (1) | KR100491736B1 (zh) |
AT (1) | ATE191090T1 (zh) |
AU (1) | AU716984B2 (zh) |
CA (1) | CA2211628C (zh) |
DE (1) | DE59701299D1 (zh) |
ES (1) | ES2144836T3 (zh) |
TW (1) | TW350863B (zh) |
Families Citing this family (71)
Publication number | Priority date | Publication date | Assignee | Title |
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EP0938026B1 (en) * | 1998-02-18 | 2009-05-27 | DSM IP Assets B.V. | Photocurable liquid resin composition |
US6136497A (en) * | 1998-03-30 | 2000-10-24 | Vantico, Inc. | Liquid, radiation-curable composition, especially for producing flexible cured articles by stereolithography |
US6100007A (en) * | 1998-04-06 | 2000-08-08 | Ciba Specialty Chemicals Corp. | Liquid radiation-curable composition especially for producing cured articles by stereolithography having high heat deflection temperatures |
US6762002B2 (en) | 1998-07-10 | 2004-07-13 | Dsm Desotech, Inc. | Solid imaging compositions for preparing polypropylene-like articles |
US6379866B2 (en) * | 2000-03-31 | 2002-04-30 | Dsm Desotech Inc | Solid imaging compositions for preparing polypropylene-like articles |
US6287748B1 (en) | 1998-07-10 | 2001-09-11 | Dsm N.V. | Solid imaging compositions for preparing polyethylene-like articles |
US20060154175A9 (en) * | 1998-07-10 | 2006-07-13 | Lawton John A | Solid imaging compositions for preparing polypropylene-like articles |
EP1256032B1 (en) * | 2000-02-08 | 2010-04-21 | Huntsman Advanced Materials (Switzerland) GmbH | Liquid, radiation-curable composition, especially for stereolithography |
JP4837187B2 (ja) * | 2001-06-06 | 2011-12-14 | 株式会社クラレ | 活性エネルギー線硬化性樹脂組成物 |
US6811937B2 (en) * | 2001-06-21 | 2004-11-02 | Dsm Desotech, Inc. | Radiation-curable resin composition and rapid prototyping process using the same |
US20030149124A1 (en) * | 2001-11-27 | 2003-08-07 | Thommes Glen A. | Radiation curable resin composition for making colored three dimensional objects |
US20030198824A1 (en) * | 2002-04-19 | 2003-10-23 | Fong John W. | Photocurable compositions containing reactive polysiloxane particles |
CN100576069C (zh) * | 2002-05-03 | 2009-12-30 | Dsm;Ip财产有限公司 | 可辐射固化树脂组合物及利用该组合物的快速成型方法 |
GB0212977D0 (en) * | 2002-06-06 | 2002-07-17 | Vantico Ag | Actinic radiation curable compositions and their use |
US20040054025A1 (en) * | 2002-06-20 | 2004-03-18 | Lawton John A. | Compositions comprising a benzophenone photoinitiator |
US6989225B2 (en) * | 2002-07-18 | 2006-01-24 | 3D Systems, Inc. | Stereolithographic resins with high temperature and high impact resistance |
US6833231B2 (en) * | 2002-07-31 | 2004-12-21 | 3D Systems, Inc. | Toughened stereolithographic resin compositions |
US20040077745A1 (en) * | 2002-10-18 | 2004-04-22 | Jigeng Xu | Curable compositions and rapid prototyping process using the same |
US20040087687A1 (en) * | 2002-10-30 | 2004-05-06 | Vantico A&T Us Inc. | Photocurable compositions with phosphite viscosity stabilizers |
US20040137368A1 (en) * | 2003-01-13 | 2004-07-15 | 3D Systems, Inc. | Stereolithographic resins containing selected oxetane compounds |
US20040170923A1 (en) * | 2003-02-27 | 2004-09-02 | 3D Systems, Inc. | Colored stereolithographic resins |
US6856283B2 (en) * | 2003-02-28 | 2005-02-15 | Raytheon Company | Method and apparatus for a power system for phased-array radar |
DE10328302A1 (de) * | 2003-06-23 | 2005-01-27 | Dreve Otoplastik Gmbh | Niedrigviskose, strahlungshärtbare Formulierung, insbesondere für die Stereolithographie, zum Einsatz in der Medizintechnik, insbesondere zur Herstellung von Ohrstücken |
US20050040562A1 (en) * | 2003-08-19 | 2005-02-24 | 3D Systems Inc. | Nanoparticle-filled stereolithographic resins |
US7244793B2 (en) * | 2003-09-26 | 2007-07-17 | Illinois Tool Works Inc. | Adhesive compositions |
US7232850B2 (en) * | 2003-10-03 | 2007-06-19 | Huntsman Advanced Materials Americas Inc. | Photocurable compositions for articles having stable tensile properties |
US20070149667A1 (en) * | 2003-10-16 | 2007-06-28 | Dsm Ip Assets B.V. | Curable compositions and rapid prototyping process using the same |
US20050101684A1 (en) * | 2003-11-06 | 2005-05-12 | Xiaorong You | Curable compositions and rapid prototyping process using the same |
US20050165127A1 (en) * | 2003-12-31 | 2005-07-28 | Dsm Desotech, Inc. | Solid imaging compositions for preparing polyethylene-like articles |
GB0413366D0 (en) | 2004-06-15 | 2004-07-21 | Heeschen Andreas | Binder-free photopolymerizable compositions |
DE102004030019A1 (de) * | 2004-06-22 | 2006-01-19 | Xetos Ag | Photopolymerisierbare Zusammensetzung |
US20060078638A1 (en) * | 2004-10-08 | 2006-04-13 | 3D Systems, Inc. | Stereolithographic apparatus |
JP4753601B2 (ja) * | 2005-03-23 | 2011-08-24 | 旭化成イーマテリアルズ株式会社 | 感光性組成物 |
CN103809377B (zh) * | 2005-09-13 | 2019-09-24 | 亨斯迈先进材料(瑞士)有限公司 | 用于制备类似abs的制品的可光固化组合物 |
US7621733B2 (en) * | 2005-09-30 | 2009-11-24 | 3D Systems, Inc. | Rapid prototyping and manufacturing system and method |
US20070075461A1 (en) * | 2005-09-30 | 2007-04-05 | 3D Systems, Inc. | Rapid prototyping and manufacturing system and method |
US7585450B2 (en) * | 2005-09-30 | 2009-09-08 | 3D Systems, Inc. | Rapid prototyping and manufacturing system and method |
US20070077323A1 (en) * | 2005-09-30 | 2007-04-05 | 3D Systems, Inc. | Rapid prototyping and manufacturing system and method |
US7690909B2 (en) * | 2005-09-30 | 2010-04-06 | 3D Systems, Inc. | Rapid prototyping and manufacturing system and method |
US7520740B2 (en) * | 2005-09-30 | 2009-04-21 | 3D Systems, Inc. | Rapid prototyping and manufacturing system and method |
US20070092733A1 (en) * | 2005-10-26 | 2007-04-26 | 3M Innovative Properties Company | Concurrently curable hybrid adhesive composition |
JP5084461B2 (ja) * | 2007-11-16 | 2012-11-28 | 東邦化学工業株式会社 | 光重合性不飽和化合物 |
US8377623B2 (en) * | 2007-11-27 | 2013-02-19 | 3D Systems, Inc. | Photocurable resin composition for producing three dimensional articles having high clarity |
RU2478393C2 (ru) * | 2008-07-31 | 2013-04-10 | Сони Корпорейшн | Адсорбент, моющее средство, лекарственное средство при почечной недостаточности и функциональное питание |
US20100190881A1 (en) | 2009-01-28 | 2010-07-29 | 3D Systems, Incorporated | Radiation Curable Compositions Useful in Solid Freeform Fabrication Systems |
KR101714798B1 (ko) | 2009-03-13 | 2017-03-09 | 디에스엠 아이피 어셋츠 비.브이. | 방사선-경화성 수지 조성물 및 이를 이용한 쾌속 3차원 이미지화 방법 |
WO2011079125A1 (en) * | 2009-12-22 | 2011-06-30 | Huntsman Petrochemical Llc | Etheramines containing flexible and rigid segments and their use as intermediates for polymer synthesis |
US9067865B2 (en) | 2009-12-22 | 2015-06-30 | Huntsman Petrochemical Llc | Etheramines and their use as intermediates for polymer synthesis |
CN102668152A (zh) | 2009-12-23 | 2012-09-12 | 默克专利有限公司 | 包括聚合粘结剂的组合物 |
EP2468789A1 (de) | 2010-12-24 | 2012-06-27 | Sika Technology AG | Klebstoff für Rotorblätter für Windkraftanlagen |
WO2013122800A1 (en) | 2012-02-17 | 2013-08-22 | Huntsman Advanced Materials Americas Llc | Mixture of benzoxazine, epoxy and anhydride |
AR098050A1 (es) | 2013-10-18 | 2016-04-27 | Huntsman Petrochemical Llc | Eteraminas con mayor estabilidad térmica y su uso como curativos o intermediarios para la síntesis de polímeros |
KR102240983B1 (ko) | 2013-11-05 | 2021-04-16 | 헌츠만 페트로케미칼 엘엘씨 | 에테르아민, 및 경화제로서의 또는 중합체 합성을 위한 중간체로서의 이의 용도 |
EP2868692B1 (en) | 2013-11-05 | 2017-10-25 | DSM IP Assets B.V. | Stabilized matrix-filled liquid radiation curable resin compositions for additive fabrication |
AU2015259316B2 (en) | 2014-05-14 | 2018-08-02 | Huntsman Advanced Materials Americas Llc | Multifunctional polyamides for protective coatings |
CN106687861B (zh) | 2014-06-23 | 2022-01-11 | 卡本有限公司 | 由具有多重硬化机制的材料制备三维物体的方法 |
KR102627551B1 (ko) | 2016-01-12 | 2024-01-23 | 헌츠만 페트로케미칼 엘엘씨 | 폴리에테르아민과 알킬렌 아민의 공-제조 |
US20190153226A1 (en) | 2016-04-08 | 2019-05-23 | Solvay Specialty Polymers Usa, Llc | Photocurable polymers, photocurable polymer compositions and lithographic processes including the same |
KR102364545B1 (ko) | 2016-06-16 | 2022-02-21 | 헌츠만 페트로케미칼 엘엘씨 | 에폭시 수지 조성물을 경화시키기 위한 배합물 |
EP3479171A1 (en) | 2016-06-30 | 2019-05-08 | 3M Innovative Properties Company | Printable compositions including highly viscous components and methods of creating 3d articles therefrom |
CN109715728B (zh) | 2016-08-19 | 2021-11-30 | 亨斯迈先进材料美国有限责任公司 | 加合物及其用途 |
JP7065088B2 (ja) | 2017-02-06 | 2022-05-11 | ハンツマン ペトロケミカル エルエルシー | エポキシ樹脂のための硬化剤 |
US11542364B2 (en) | 2017-02-06 | 2023-01-03 | Huntsman Petrochemical Llc | Curing agent for epoxy resins |
ES2685280B2 (es) | 2017-03-31 | 2019-06-21 | Centro Tecnologico De Nanomateriales Avanzados S L | Composición de resina curable por radiación y procedimiento para su obtención |
US10316213B1 (en) | 2017-05-01 | 2019-06-11 | Formlabs, Inc. | Dual-cure resins and related methods |
EP3758916A4 (en) * | 2018-03-02 | 2021-10-27 | Formlabs, Inc. | LATENT CURING RESINS AND RELATED PROCESSES |
CN108822122A (zh) * | 2018-08-23 | 2018-11-16 | 广州康瑞泰药业有限公司 | 一种高效制备4,4-二甲基-3,5,8-三氧杂双环[5,1,0]辛烷的方法 |
US20230100957A1 (en) | 2020-02-04 | 2023-03-30 | Cabot Corporation | Composition for Liquid-Based Additive Manufacturing |
EP3909748A1 (en) | 2020-05-12 | 2021-11-17 | TIGER Coatings GmbH & Co. KG | Thermosetting material for use in additive manufacturing |
CA3210366A1 (en) | 2021-02-25 | 2022-09-01 | Huntsman Advanced Materials Licensing (Switzerland) Gmbh | One component polymerizable composition for trickle impregnation |
EP4094942A1 (en) | 2021-05-26 | 2022-11-30 | TIGER Coatings GmbH & Co. KG | Radiation curable composition for additive manufacturing suitable for electronic applications |
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US3708296A (en) * | 1968-08-20 | 1973-01-02 | American Can Co | Photopolymerization of epoxy monomers |
US4091223A (en) * | 1976-08-04 | 1978-05-23 | Ciba-Geigy Corporation | Unsaturated hydantoin coagents |
US4156035A (en) * | 1978-05-09 | 1979-05-22 | W. R. Grace & Co. | Photocurable epoxy-acrylate compositions |
US4339567A (en) * | 1980-03-07 | 1982-07-13 | Ciba-Geigy Corporation | Photopolymerization by means of sulphoxonium salts |
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US4398014A (en) * | 1980-11-04 | 1983-08-09 | Ciba-Geigy Corporation | Sulfoxonium salts and their use as polymerization catalysts |
EP0094915B1 (de) * | 1982-05-19 | 1987-01-21 | Ciba-Geigy Ag | Härtbare, Metallocenkomplexe enthaltende Zusammensetzungen, daraus erhältliche aktivierte Vorstufen und deren Verwendung |
DE3366408D1 (en) * | 1982-05-19 | 1986-10-30 | Ciba Geigy Ag | Photopolymerisation with organometal salts |
US4818776A (en) * | 1983-02-07 | 1989-04-04 | Union Carbide Corporation | Photocopolymerizable compositions based on epoxy and hydroxyl-containing organic materials having primary hydroxyl content |
US4874798A (en) * | 1983-02-07 | 1989-10-17 | Union Carbide Corporation | Photocopolymerizable compositions based on epoxy and hydroxyl-containing organic materials and substituted cycloaliphatic monoepoxide reactive diluents |
US4599401A (en) * | 1983-10-27 | 1986-07-08 | Union Carbide Corporation | Low viscosity adducts of poly(active hydrogen) organic compounds and a polyepoxide |
ATE37242T1 (de) * | 1984-02-10 | 1988-09-15 | Ciba Geigy Ag | Verfahren zur herstellung einer schutzschicht oder einer reliefabbildung. |
GB8414525D0 (en) * | 1984-06-07 | 1984-07-11 | Ciba Geigy Ag | Sulphoxonium salts |
US4694029A (en) * | 1985-04-09 | 1987-09-15 | Cook Paint And Varnish Company | Hybrid photocure system |
US4772541A (en) * | 1985-11-20 | 1988-09-20 | The Mead Corporation | Photohardenable compositions containing a dye borate complex and photosensitive materials employing the same |
DE3677527D1 (de) * | 1985-11-20 | 1991-03-21 | Mead Corp | Ionische farbstoffe als initiatoren enthaltende fotosensitive materialien. |
US4772530A (en) * | 1986-05-06 | 1988-09-20 | The Mead Corporation | Photosensitive materials containing ionic dye compounds as initiators |
US4751102A (en) * | 1987-07-27 | 1988-06-14 | The Mead Corporation | Radiation-curable ink and coating compositions containing ionic dye compounds as initiators |
JPH01110507A (ja) * | 1987-10-22 | 1989-04-27 | Sunstar Giken Kk | 光硬化性組成物 |
JPH07103218B2 (ja) * | 1988-09-13 | 1995-11-08 | 旭電化工業株式会社 | 光学的造形用樹脂組成物 |
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TW269017B (zh) * | 1992-12-21 | 1996-01-21 | Ciba Geigy Ag | |
TW259797B (zh) * | 1992-12-23 | 1995-10-11 | Ciba Geigy | |
JPH07128856A (ja) * | 1993-04-30 | 1995-05-19 | Japan Synthetic Rubber Co Ltd | 感光性樹脂組成物および感光性樹脂レジスト |
DE59409385D1 (de) * | 1993-09-16 | 2000-07-06 | Ciba Sc Holding Ag | Vinyletherverbindungen mit zusätzlichen von Vinylethergruppen verschiedenen funktionellen Gruppen und deren Verwendung zur Formulierung härtbarer Zusammensetzungen |
US5707780A (en) * | 1995-06-07 | 1998-01-13 | E. I. Du Pont De Nemours And Company | Photohardenable epoxy composition |
US5665792A (en) * | 1995-06-07 | 1997-09-09 | E. I. Du Pont De Nemours And Company | Stabilizers for use with photoacid precursor formulations |
JPH09268205A (ja) * | 1996-03-29 | 1997-10-14 | Asahi Denka Kogyo Kk | 光学的立体造形用樹脂組成物および光学的立体造形法 |
-
1997
- 1997-07-21 KR KR1019970033932A patent/KR100491736B1/ko not_active IP Right Cessation
- 1997-07-21 ES ES97810510T patent/ES2144836T3/es not_active Expired - Lifetime
- 1997-07-21 AT AT97810510T patent/ATE191090T1/de not_active IP Right Cessation
- 1997-07-21 EP EP97810510A patent/EP0822445B2/de not_active Expired - Lifetime
- 1997-07-21 DE DE59701299T patent/DE59701299D1/de not_active Expired - Lifetime
- 1997-07-25 CA CA002211628A patent/CA2211628C/en not_active Expired - Lifetime
- 1997-07-28 US US08/901,303 patent/US5972563A/en not_active Expired - Lifetime
- 1997-07-28 AU AU31579/97A patent/AU716984B2/en not_active Ceased
- 1997-07-28 TW TW086110701A patent/TW350863B/zh not_active IP Right Cessation
- 1997-07-29 JP JP21822197A patent/JP3564650B2/ja not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
ATE191090T1 (de) | 2000-04-15 |
EP0822445B1 (de) | 2000-03-22 |
DE59701299D1 (de) | 2000-04-27 |
KR100491736B1 (ko) | 2005-09-09 |
CA2211628A1 (en) | 1998-01-29 |
AU3157997A (en) | 1998-02-05 |
AU716984B2 (en) | 2000-03-16 |
EP0822445A1 (de) | 1998-02-04 |
ES2144836T3 (es) | 2000-06-16 |
CA2211628C (en) | 2007-03-13 |
US5972563A (en) | 1999-10-26 |
JP3564650B2 (ja) | 2004-09-15 |
EP0822445B2 (de) | 2005-02-09 |
KR980009381A (ko) | 1998-04-30 |
JPH1087791A (ja) | 1998-04-07 |
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