TW348322B - Power semiconductor device - Google Patents

Power semiconductor device

Info

Publication number
TW348322B
TW348322B TW086115106A TW86115106A TW348322B TW 348322 B TW348322 B TW 348322B TW 086115106 A TW086115106 A TW 086115106A TW 86115106 A TW86115106 A TW 86115106A TW 348322 B TW348322 B TW 348322B
Authority
TW
Taiwan
Prior art keywords
semiconductor region
semiconductor
conductive type
layer
region
Prior art date
Application number
TW086115106A
Other languages
English (en)
Inventor
Tae-Hoon Kim
Original Assignee
Samsung Electronics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Samsung Electronics Co Ltd filed Critical Samsung Electronics Co Ltd
Application granted granted Critical
Publication of TW348322B publication Critical patent/TW348322B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
    • H01L29/70—Bipolar devices
    • H01L29/72—Transistor-type devices, i.e. able to continuously respond to applied control signals
    • H01L29/739—Transistor-type devices, i.e. able to continuously respond to applied control signals controlled by field-effect, e.g. bipolar static induction transistors [BSIT]
    • H01L29/7393—Insulated gate bipolar mode transistors, i.e. IGBT; IGT; COMFET
    • H01L29/7395—Vertical transistors, e.g. vertical IGBT
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
    • H01L29/06—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions
    • H01L29/0684—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by the shape, relative sizes or dispositions of the semiconductor regions or junctions between the regions
    • H01L29/0692—Surface layout
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
    • H01L29/06—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions
    • H01L29/08—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions with semiconductor regions connected to an electrode carrying current to be rectified, amplified or switched and such electrode being part of a semiconductor device which comprises three or more electrodes
    • H01L29/083—Anode or cathode regions of thyristors or gated bipolar-mode devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Ceramic Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
  • Thyristors (AREA)
  • Insulated Gate Type Field-Effect Transistor (AREA)
  • Bipolar Transistors (AREA)
TW086115106A 1997-05-07 1997-10-15 Power semiconductor device TW348322B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1019970017353A KR100256109B1 (ko) 1997-05-07 1997-05-07 전력 반도체 장치

Publications (1)

Publication Number Publication Date
TW348322B true TW348322B (en) 1998-12-21

Family

ID=19504974

Family Applications (1)

Application Number Title Priority Date Filing Date
TW086115106A TW348322B (en) 1997-05-07 1997-10-15 Power semiconductor device

Country Status (6)

Country Link
US (1) US6111278A (zh)
JP (1) JPH10321859A (zh)
KR (1) KR100256109B1 (zh)
DE (1) DE19810338B4 (zh)
FR (1) FR2763175B1 (zh)
TW (1) TW348322B (zh)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100455363B1 (ko) * 1997-10-22 2005-06-07 페어차일드코리아반도체 주식회사 절연게이트 구조의 바이폴라 트랜지스터(igbt) 및 그 제조방법
KR100284746B1 (ko) * 1999-01-15 2001-03-15 김덕중 소스 영역 하부의 바디 저항이 감소된 전력용 디모스 트랜지스터
EP1915782A1 (en) * 2005-08-10 2008-04-30 Freescale Semiconductor, Inc. Field-effect semiconductor device and method of forming the same
JP2007115943A (ja) * 2005-10-21 2007-05-10 Toyota Central Res & Dev Lab Inc 半導体装置
JP4938307B2 (ja) 2005-12-28 2012-05-23 パナソニック株式会社 スイッチ回路、ダイオード
CN101887912A (zh) * 2009-05-12 2010-11-17 商海涵 绝缘栅型双极晶体管及其制作方法
CN102157551A (zh) * 2011-03-10 2011-08-17 电子科技大学 一种具有载流子存储层和额外空穴通路的igbt
CN102856353B (zh) * 2011-06-27 2015-08-26 中国科学院微电子研究所 微穿通型igbt器件及其制作方法
CN106033773A (zh) * 2015-03-19 2016-10-19 国家电网公司 一种具有空穴旁路结构的igbt器件及其制造方法
US11569371B2 (en) * 2017-05-25 2023-01-31 Dynex Semiconductor Limited Semiconductor device

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US4639754A (en) * 1985-02-25 1987-01-27 Rca Corporation Vertical MOSFET with diminished bipolar effects
US4809045A (en) * 1985-09-30 1989-02-28 General Electric Company Insulated gate device
JPH0734474B2 (ja) * 1988-03-03 1995-04-12 富士電機株式会社 伝導度変調型ｍｏｓｆｅｔの製造方法
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JP2787921B2 (ja) * 1989-01-06 1998-08-20 三菱電機株式会社 絶縁ゲート型バイポーラトランジスタ
US4980740A (en) * 1989-03-27 1990-12-25 General Electric Company MOS-pilot structure for an insulated gate transistor
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JP2946750B2 (ja) * 1990-08-16 1999-09-06 富士電機株式会社 半導体装置
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DE4216810C2 (de) * 1991-05-31 1999-09-16 Fuji Electric Co Ltd Steuerschaltung für einen Leitfähigkeitsänderungs-MISFET
US5428228A (en) * 1991-06-10 1995-06-27 Kabushiki Kaisha Toshiba Method of operating thyristor with insulated gates
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US5258638A (en) * 1992-08-13 1993-11-02 Xerox Corporation Thermal ink jet power MOS device design/layout
US5396087A (en) * 1992-12-14 1995-03-07 North Carolina State University Insulated gate bipolar transistor with reduced susceptibility to parasitic latch-up
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JP3085037B2 (ja) * 1993-08-18 2000-09-04 富士電機株式会社 絶縁ゲートバイポーラトランジスタ
DE4335298C1 (de) * 1993-10-15 1995-03-23 Siemens Ag Schaltungsstruktur mit mindestens einem bipolaren Leistungsbauelement und Verfahren zu deren Betrieb
US5399892A (en) * 1993-11-29 1995-03-21 Harris Corporation Mesh geometry for MOS-gated semiconductor devices
US5488236A (en) * 1994-05-26 1996-01-30 North Carolina State University Latch-up resistant bipolar transistor with trench IGFET and buried collector
US5548133A (en) * 1994-09-19 1996-08-20 International Rectifier Corporation IGBT with increased ruggedness

Also Published As

Publication number Publication date
FR2763175B1 (fr) 2001-11-30
DE19810338B4 (de) 2005-03-03
JPH10321859A (ja) 1998-12-04
US6111278A (en) 2000-08-29
KR19980082437A (ko) 1998-12-05
FR2763175A1 (fr) 1998-11-13
DE19810338A1 (de) 1998-11-12
KR100256109B1 (ko) 2000-05-01

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees