TW332926B - Multi-bank memory device - Google Patents

Multi-bank memory device

Info

Publication number
TW332926B
TW332926B TW086109768A TW86109768A TW332926B TW 332926 B TW332926 B TW 332926B TW 086109768 A TW086109768 A TW 086109768A TW 86109768 A TW86109768 A TW 86109768A TW 332926 B TW332926 B TW 332926B
Authority
TW
Taiwan
Prior art keywords
selection line
bank
column selection
local column
memory device
Prior art date
Application number
TW086109768A
Other languages
English (en)
Inventor
Sung-Min Yim
Original Assignee
Samsung Electronics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Samsung Electronics Co Ltd filed Critical Samsung Electronics Co Ltd
Application granted granted Critical
Publication of TW332926B publication Critical patent/TW332926B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
    • H01L27/04—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body
    • H01L27/10—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including a plurality of individual components in a repetitive configuration
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11C—STATIC STORES
    • G11C7/00—Arrangements for writing information into, or reading information out from, a digital store
    • G11C7/10—Input/output [I/O] data interface arrangements, e.g. I/O data control circuits, I/O data buffers
    • G11C7/1048—Data bus control circuits, e.g. precharging, presetting, equalising
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11C—STATIC STORES
    • G11C8/00—Arrangements for selecting an address in a digital store
    • G11C8/12—Group selection circuits, e.g. for memory block selection, chip selection, array selection

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Dram (AREA)
  • Static Random-Access Memory (AREA)
TW086109768A 1996-07-18 1997-07-11 Multi-bank memory device TW332926B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1019960029038A KR100227268B1 (ko) 1996-07-18 1996-07-18 멀티 뱅크 메모리장치

Publications (1)

Publication Number Publication Date
TW332926B true TW332926B (en) 1998-06-01

Family

ID=19466679

Family Applications (1)

Application Number Title Priority Date Filing Date
TW086109768A TW332926B (en) 1996-07-18 1997-07-11 Multi-bank memory device

Country Status (4)

Country Link
US (1) US5930196A (zh)
JP (1) JP4309483B2 (zh)
KR (1) KR100227268B1 (zh)
TW (1) TW332926B (zh)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3252895B2 (ja) * 1997-11-07 2002-02-04 日本電気株式会社 半導体記憶装置及びその駆動方法
US5959929A (en) * 1997-12-29 1999-09-28 Micron Technology, Inc. Method for writing to multiple banks of a memory device
KR100512933B1 (ko) * 2002-01-09 2005-09-07 삼성전자주식회사 반도체 메모리 장치 및 이 장치의 블록 선택신호 발생방법
KR100533384B1 (ko) * 2004-04-12 2005-12-06 주식회사 하이닉스반도체 저진폭 전압구동 글로벌 입출력 라인을 갖는 반도체메모리 장치
KR100609039B1 (ko) * 2004-06-30 2006-08-10 주식회사 하이닉스반도체 입출력 라인 회로
US7489585B2 (en) 2005-09-29 2009-02-10 Hynix Semiconductor Inc. Global signal driver for individually adjusting driving strength of each memory bank
WO2009145320A1 (ja) 2008-05-30 2009-12-03 東ソー株式会社 ヒドロキシアルキルトリエチレンジアミン類の製造方法、及びそれを用いたポリウレタン樹脂製造用の触媒組成物
JP2010257552A (ja) * 2009-04-28 2010-11-11 Elpida Memory Inc 半導体記憶装置
US8649239B2 (en) 2012-05-24 2014-02-11 International Business Machines Corporation Multi-bank random access memory structure with global and local signal buffering for improved performance
KR20130132044A (ko) * 2012-05-25 2013-12-04 에스케이하이닉스 주식회사 컬럼 선택 신호 생성 회로
KR102398663B1 (ko) 2015-07-09 2022-05-16 삼성전자주식회사 칩 패드, 재배선 테스트 패드 및 재배선 접속 패드를 포함하는 반도체 칩

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2725570B2 (ja) * 1993-11-02 1998-03-11 日本電気株式会社 半導体メモリ装置
KR960011206B1 (ko) * 1993-11-09 1996-08-21 삼성전자 주식회사 반도체메모리장치의 워드라인구동회로

Also Published As

Publication number Publication date
KR980012445A (ko) 1998-04-30
JP4309483B2 (ja) 2009-08-05
JPH1040683A (ja) 1998-02-13
US5930196A (en) 1999-07-27
KR100227268B1 (ko) 1999-11-01

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees