TW324881B - Improvements in or relating to connecting board for connection between base plate and mounting board - Google Patents
Improvements in or relating to connecting board for connection between base plate and mounting boardInfo
- Publication number
- TW324881B TW324881B TW086105482A TW86105482A TW324881B TW 324881 B TW324881 B TW 324881B TW 086105482 A TW086105482 A TW 086105482A TW 86105482 A TW86105482 A TW 86105482A TW 324881 B TW324881 B TW 324881B
- Authority
- TW
- Taiwan
- Prior art keywords
- protruded
- base plate
- board
- mounting
- bonding pads
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
- H01R43/02—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for soldered or welded connections
- H01R43/0235—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for soldered or welded connections for applying solder
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/50—Fixed connections
- H01R12/51—Fixed connections for rigid printed circuits or like structures
- H01R12/52—Fixed connections for rigid printed circuits or like structures connecting to other rigid printed circuits or like structures
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3431—Leadless components
- H05K3/3436—Leadless components having an array of bottom contacts, e.g. pad grid array or ball grid array components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
- H05K3/3478—Applying solder preforms; Transferring prefabricated solder patterns
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0335—Layered conductors or foils
- H05K2201/035—Paste overlayer, i.e. conductive paste or solder paste over conductive layer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10378—Interposers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10424—Frame holders
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10954—Other details of electrical connections
- H05K2201/10992—Using different connection materials, e.g. different solders, for the same connection
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
- H05K2203/0113—Female die used for patterning or transferring, e.g. temporary substrate having recessed pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/03—Metal processing
- H05K2203/0338—Transferring metal or conductive material other than a circuit pattern, e.g. bump, solder, printed component
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/04—Soldering or other types of metallurgic bonding
- H05K2203/041—Solder preforms in the shape of solder balls
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/04—Soldering or other types of metallurgic bonding
- H05K2203/043—Reflowing of solder coated conductors, not during connection of components, e.g. reflowing solder paste
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Combinations Of Printed Boards (AREA)
- Multi-Conductor Connections (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP13065896 | 1996-04-26 | ||
JP09082123A JP3116273B2 (ja) | 1996-04-26 | 1997-03-13 | 中継基板、その製造方法、基板と中継基板と取付基板とからなる構造体、基板と中継基板の接続体 |
Publications (1)
Publication Number | Publication Date |
---|---|
TW324881B true TW324881B (en) | 1998-01-11 |
Family
ID=26423141
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW086105482A TW324881B (en) | 1996-04-26 | 1997-04-26 | Improvements in or relating to connecting board for connection between base plate and mounting board |
Country Status (6)
Country | Link |
---|---|
US (2) | US6080936A (zh) |
EP (1) | EP0804057A3 (zh) |
JP (1) | JP3116273B2 (zh) |
KR (1) | KR100275431B1 (zh) |
MY (1) | MY119609A (zh) |
TW (1) | TW324881B (zh) |
Families Citing this family (49)
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US5952716A (en) * | 1997-04-16 | 1999-09-14 | International Business Machines Corporation | Pin attach structure for an electronic package |
US6059173A (en) * | 1998-03-05 | 2000-05-09 | International Business Machines Corporation | Micro grid array solder interconnection structure for second level packaging joining a module and printed circuit board |
TW396462B (en) * | 1998-12-17 | 2000-07-01 | Eriston Technologies Pte Ltd | Bumpless flip chip assembly with solder via |
US6259039B1 (en) * | 1998-12-29 | 2001-07-10 | Intel Corporation | Surface mount connector with pins in vias |
US6258627B1 (en) * | 1999-01-19 | 2001-07-10 | International Business Machines Corporation | Underfill preform interposer for joining chip to substrate |
US6221693B1 (en) * | 1999-06-14 | 2001-04-24 | Thin Film Module, Inc. | High density flip chip BGA |
US6242279B1 (en) * | 1999-06-14 | 2001-06-05 | Thin Film Module, Inc. | High density wire bond BGA |
KR100298829B1 (ko) * | 1999-07-21 | 2001-11-01 | 윤종용 | 칩 사이즈 패키지의 솔더 접합 구조 및 방법 |
US6900393B1 (en) * | 1999-09-20 | 2005-05-31 | Teka Interconnections Systems, Inc. | Solder-bearing wafer for use in soldering operations |
US7754979B2 (en) * | 1999-09-20 | 2010-07-13 | Teka Interconnections Systems, Inc. | Solder-bearing wafer for use in soldering operations |
JP3973340B2 (ja) * | 1999-10-05 | 2007-09-12 | Necエレクトロニクス株式会社 | 半導体装置、配線基板、及び、それらの製造方法 |
US20020064931A1 (en) * | 2000-07-03 | 2002-05-30 | E. C. Ong | Method and apparatus for applying a protective over-coating to a ball-grid-array (BGA) structure |
US6486409B1 (en) * | 2000-11-02 | 2002-11-26 | Seiko Epson Corporation | Flexible wiring substrate |
US6982387B2 (en) | 2001-06-19 | 2006-01-03 | International Business Machines Corporation | Method and apparatus to establish circuit layers interconnections |
US6848914B2 (en) | 2001-10-11 | 2005-02-01 | International Business Machines Corporation | Electrical coupling of substrates by conductive buttons |
US6830463B2 (en) * | 2002-01-29 | 2004-12-14 | Fci Americas Technology, Inc. | Ball grid array connection device |
TW555722B (en) * | 2002-01-30 | 2003-10-01 | Leu-Wen Tsay | A method of manufacturing high-temperature sensor with metal/ceramic joint |
US6791035B2 (en) * | 2002-02-21 | 2004-09-14 | Intel Corporation | Interposer to couple a microelectronic device package to a circuit board |
US20030215476A1 (en) * | 2002-04-12 | 2003-11-20 | L'oreal | Multiple emulsion containing a tensioning agent |
US6798667B2 (en) * | 2002-08-23 | 2004-09-28 | Ati Technologies, Inc. | Solder ball collapse control apparatus and method thereof |
JP2004356618A (ja) * | 2003-03-19 | 2004-12-16 | Ngk Spark Plug Co Ltd | 中継基板、半導体素子付き中継基板、中継基板付き基板、半導体素子と中継基板と基板とからなる構造体、中継基板の製造方法 |
EP1677349A4 (en) | 2004-02-24 | 2010-12-01 | Ibiden Co Ltd | SUBSTRATE FOR MOUNTING A SEMICONDUCTOR |
US6976849B2 (en) * | 2004-04-12 | 2005-12-20 | Cardiac Pacemakers, Inc. | Pinless solder joint for coupling circuit boards |
US7105918B2 (en) * | 2004-07-29 | 2006-09-12 | Micron Technology, Inc. | Interposer with flexible solder pad elements and methods of manufacturing the same |
AU2005289431B2 (en) | 2004-09-28 | 2010-07-22 | Laitram, Llc | Apparatus and methods for high speed conveyor switching |
MY136179A (en) * | 2004-10-23 | 2008-08-29 | Freescale Semiconductor Inc | Packaged device and method of forming same |
WO2006047028A2 (en) * | 2004-10-23 | 2006-05-04 | Freescale Semiconductor, Inc. | Packaged device and method of forming same |
US7160755B2 (en) * | 2005-04-18 | 2007-01-09 | Freescale Semiconductor, Inc. | Method of forming a substrateless semiconductor package |
JP4923494B2 (ja) * | 2005-09-22 | 2012-04-25 | 富士通株式会社 | 多層回路基板設計支援方法、プログラム、装置及び多層回路基板 |
JP4802679B2 (ja) * | 2005-11-18 | 2011-10-26 | パナソニック株式会社 | 電子回路基板の実装方法 |
WO2007142033A1 (ja) * | 2006-06-02 | 2007-12-13 | Murata Manufacturing Co., Ltd. | 多層セラミック電子部品およびその製造方法 |
FR2910706B1 (fr) * | 2006-12-21 | 2009-03-20 | Commissariat Energie Atomique | Element d'interconnexion a base de nanotubes de carbone |
US20090279275A1 (en) * | 2008-05-09 | 2009-11-12 | Stephen Peter Ayotte | Method of attaching an integrated circuit chip to a module |
US8212156B2 (en) * | 2008-06-26 | 2012-07-03 | International Business Machines Corporation | Plastic land grid array (PLGA) module and printed wiring board (PWB) with enhanced contact metallurgy construction |
US20110216514A1 (en) * | 2010-03-03 | 2011-09-08 | Mutual-Tek Industries Co., Ltd. | Combined multilayer circuit board having embedded components and manufacturing method of the same |
KR101084899B1 (ko) * | 2010-03-26 | 2011-11-17 | 삼성전기주식회사 | 터치스크린 패널의 fpcb 접속구조 |
CN101859749A (zh) * | 2010-06-07 | 2010-10-13 | 中国航天科技集团公司第九研究院第七七一研究所 | 一种球栅阵列器件功能转换模板焊接结构及其制备方法 |
JP5699610B2 (ja) | 2011-01-11 | 2015-04-15 | 富士通株式会社 | 実装構造体及びその製造方法、並びに、電子装置 |
JP2013102035A (ja) * | 2011-11-08 | 2013-05-23 | Ngk Spark Plug Co Ltd | セラミック基板およびその製造方法 |
WO2013096846A1 (en) * | 2011-12-21 | 2013-06-27 | Lawrence Livermore National Security, Llc | Method of fabricating electrical feedthroughs using extruded metal vias |
JP6064705B2 (ja) | 2013-03-18 | 2017-01-25 | 富士通株式会社 | 半導体装置の製造方法および半導体実装基板 |
US8920934B2 (en) * | 2013-03-29 | 2014-12-30 | Intel Corporation | Hybrid solder and filled paste in microelectronic packaging |
US9418953B2 (en) * | 2014-01-13 | 2016-08-16 | Taiwan Semiconductor Manufacturing Company, Ltd. | Packaging through pre-formed metal pins |
JP6419938B2 (ja) * | 2015-03-09 | 2018-11-07 | オリンパス株式会社 | 光ファイバ保持構造体、および光伝送モジュール |
US9706662B2 (en) * | 2015-06-30 | 2017-07-11 | Raytheon Company | Adaptive interposer and electronic apparatus |
CN106363312B (zh) * | 2016-11-23 | 2019-03-08 | 京信通信技术(广州)有限公司 | 焊接基体 |
IT201700073501A1 (it) * | 2017-06-30 | 2018-12-30 | St Microelectronics Srl | Prodotto a semiconduttore e corrispondente procedimento |
JP7141877B2 (ja) | 2018-07-18 | 2022-09-26 | キオクシア株式会社 | 半導体記憶装置 |
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JP3400051B2 (ja) * | 1993-11-10 | 2003-04-28 | ザ ウィタカー コーポレーション | 異方性導電膜、その製造方法及びそれを使用するコネクタ |
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JPH07273438A (ja) * | 1994-03-30 | 1995-10-20 | Ibiden Co Ltd | プリント配線板の製造方法 |
JP3377867B2 (ja) * | 1994-08-12 | 2003-02-17 | 京セラ株式会社 | 半導体素子収納用パッケージ |
US5531021A (en) * | 1994-12-30 | 1996-07-02 | Intel Corporation | Method of making solder shape array package |
-
1997
- 1997-03-13 JP JP09082123A patent/JP3116273B2/ja not_active Expired - Fee Related
- 1997-04-25 MY MYPI97001816A patent/MY119609A/en unknown
- 1997-04-25 EP EP97106928A patent/EP0804057A3/en not_active Ceased
- 1997-04-25 US US08/840,658 patent/US6080936A/en not_active Expired - Lifetime
- 1997-04-26 TW TW086105482A patent/TW324881B/zh not_active IP Right Cessation
- 1997-04-26 KR KR1019970015786A patent/KR100275431B1/ko not_active IP Right Cessation
-
1998
- 1998-10-30 US US09/182,513 patent/US6148900A/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
JPH1012990A (ja) | 1998-01-16 |
MY119609A (en) | 2005-06-30 |
KR100275431B1 (ko) | 2001-01-15 |
EP0804057A2 (en) | 1997-10-29 |
KR970073251A (ko) | 1997-11-07 |
JP3116273B2 (ja) | 2000-12-11 |
EP0804057A3 (en) | 1999-02-10 |
US6148900A (en) | 2000-11-21 |
US6080936A (en) | 2000-06-27 |
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