TW555722B - A method of manufacturing high-temperature sensor with metal/ceramic joint - Google Patents

Abstract

This invention proposes a method of manufacturing high-temperature sensor with metal/ceramic joint. The joint is featured with long-time resistance to high temperature, high cycle fatigue, thermal cycles and high reliability. The steps include a hole formed in the joint location on the ceramic substrate, making the bonding layer at least formed on both the inner surface and circumferential portion of the hole on the ceramic substrate, depositing the supportive metal into the hole of above substrate, making the conductive layer on the above surface of the joint, the joint covered by the metal signal conduction wire, and finally welding spots formed in the joint by welding process. High temperature sensors made by this method can be used in the environment of high temperatures, vibrations and thermal cycles.

Description

Field of the invention: Ming: About-a kind of metal for making high-temperature sensors, especially for is', which is used to make high-temperature sensing elements, has resistance to south temperature, resists long-term high-cycle fatigue, and can withstand the evening. " Features such as cycle and high reliability. Background of the Invention: In the manufacture of high-temperature sensing elements (using temperatures higher than 800 ° C), they will encounter the exposure of metals and ceramic materials = Degree) process "material has good oxidation resistance and said,

When comparing the ceramic material θ φ to the base material, the base of the extremely large # A temperature sensing element is reversed. To ^ In the production of high-quality ceramic materials, high-temperature sensing elements are often encountered when joining ceramic and metal materials. Or the covalent bond is d. The material is a brittle material. The ionic bonding method is mainly metal: type, and the metal material is a tough material. The two types are complete and their thermal expansion coefficient is much higher than that of the ceramic material. I: After joining the materials of the structure, the stress at the joint interface, the bond diffusion reaction at the interface, and the ί contact caused by the difference in thermal expansion are in use; It is possible that the high-temperature sensing element is also :: the degree is reduced or even damaged. In addition to the myth, when the temperature is high, the second offense is used in the state of heat cycle. For example, 4 or more are used in cars. When the engine is running, the engine is running

Page 5 1 ^ ^ yrzz V. Description of the invention (2) Cheng Xiangwen; conversely, when the engine is stopped and restarted, day after day-long time; day: will return to room 1. In this way, the location of the contact point between porcelain and metal materials is one of the key technologies of ceramic sensing elements in this temperature sensing element. The reliability of this is to make such a long-term endurance. Due to the engine operation, this high-temperature sensing element must also be able to cycle fatigue): no high cycle fatigue (high development is extremely technically difficult) ': Therefore, in general, the technical person between this type of element metal and ceramic materials-' that is, after the main problem and the process of use, the thermal expansion due to The coefficient is different, because of the joint: the cause of thermal stress. In the process, the local material is caused by local heating. = = = The braking force. This thermal stress is even in the same material Ϊ = heat; due to the difference in thermal expansion coefficient itself, Even if there is no temperature gradient in the joining material, the difference between the shrinkage (or expansion) of the material is different from that of the material, and there will be: There is thermal stress inside the back. This kind of 丄 2 χ Λτ thermal expansion Coupling interface and its adjacent area. Α10 is two. Some commonly used metal materials and structural ceramic materials such as: Quantitative factors ^ Most metals and ceramics have a large amount of thermal stress on the δ face of the eight joints. ... and this If stress

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5. Description of the invention (3) Inducing tensile stress inside the ceramic material may cause damage to the ceramic material itself or the joint interface. In the current technology, there are many ways that can be used to reduce the thermal stress of this bonding interface. First, the multilayer structure is used to reduce thermal stress. For example, the use of an appropriate intermediate layer for plastic deformation to eliminate part of the thermal stress is a feasible solution. This intermediate layer should have Nanwei cutting edge, low yield strength and moderate thermal expansion coefficient. The disadvantage of this method is that its combination of materials', especially the choice of the material of the intermediate layer, is met but not required. This method is not feasible if no suitable interlayer material is available. Another question worth pondering is if this bonding material is applied

In an environment with repeated thermal cycles, the intermediate layer will accumulate a huge plastic shape and eventually cause its destruction. Therefore, when the joint is applied in an environment with thermal cycling, this method can only delay the destruction of the joint, but it is not absolutely effective. Another material that is currently receiving considerable attention is called functionally graded materials (FGM) ). This material

It is expected that the difference in the thermal expansion coefficient of the bonding material can be changed by configuring the composition gradient change of the bonding material at both ends. If the difference in the thermal expansion coefficient of the bonding material can be reduced, it should be possible to obtain a slow thermal expansion coefficient change in the region of the bonding interface, thereby In order to reduce the thermal stress caused by the temperature change near the contact area. In this method, the functional gradient material can be prepared by sintering the powders of different ingredients. However, the application of this method must use appropriate materials, without suitable intermediate filling can not make iljb functional gradient pine. One line makes high-temperature sensing elements, partly in a printed mine ^^ pattern,

Page 7 555722 V. Description of the invention (4) The substrate is made of ^ platinum film with a thin ^ on the substrate, and a voltage signal of thunder resistance i on the porcelain substrate is obtained. !! ^^ · ,, ‘must be = Fan Fan bond Jin Chen, Wei Wei is pregnant and can control M-ϋ.咼 Temperature sensing element 侔 xiquan μΙΓΤ, ~ I Γ. Τ ^ ΓΤ ~ .. J ^: The maximum degree of a knot is generally only a few 丄 7Γ ^ ·· 二 ', j Lou Yuhou is a Together! 4. Earth t # rabbit ^ and the thin layer on the substrate, if the Gula, 隹 ～~~~ ^-^ ---- in the control and # lose function 7 ^ " *-~--see And · Α ^ _ substrate peeling

, Μλ ^ α ^ μλ welding process ^ Drum A ^ · contact, with lj1j branch operation without the support of the metal spot ceramic material joint square Α · Α · has a high degree of automation _ two speed

Page 8 555722 V. Description of the invention (5) Brief description of the available thumb invention on the technique: The main purpose of the present invention is to provide a brake element connection signal guide 炝 jj: It has high temperature resistance and resistance to long-term high cycle fatigue , ~~ Features of high reliability and reliability. The secondary heating parts used in this method can be used for a long time under high temperature and vibration. And thermal cycling environment In the present invention, the main black connection is completed in the following steps: (1) forming a reserved hole in a contact portion of a ceramic substrate 11) making a bonding layer on the ceramic substrate, the key The surface of the inner wall and surrounding parts of the hole / jong hole; and θ ν formed in (Hj) the hole reserved in the ceramic substrate is filled with support gold 7) on the surface of the contact portion of the ceramic substrate The contact part is sheathed with a metal signal wire; and is used as a conductive layer, and (vi) a welding process is performed at the contact part to form a solder joint. Detailed description of the invention: The combination of the square, the metal, the metal, and the ceramic is used to make a temperature-resistant sensor. The metal and ceramic joints ^ and 抿 ^ 1 use a contact part, and this contact part has resistance to $ : High cycle fatigue, can withstand multiple thermal cycles, and high reliability. Use in high temperature, vibration, and thermal cycle environments. Page 9 555722 5. Description of the invention (6) f. The specific process of the present invention will be described. The first figure is a cross-sectional acoustic diagram of a cross section of a ceramic substrate in a contact portion before welding in the present invention. The first pottery: is the substrate, (2) is a hole reserved on the substrate of Tao Jing, the bonding layer of ⑺, the bonding layer (3) is formed at least on the inner wall surface of the hole (2) and the surrounding part. The ceramic substrate ⑴ is an electrical insulation :::! As for the material used for the bonding layer, at least the following three conditions must be satisfied. The difference between the thermal expansion coefficient of the β material and the thermal expansion coefficient of the ceramic substrate γ is smaller τ The thermal stress generated by the temperature sensing element in use. Second: the 疋 bond layer⑴ must be able to form a good bond with the ceramic substrate. Bonding: (3) itself must be able to withstand high temperatures. In order to satisfy M =, 1 piece, '.Ί at the same time, the most common method is to use a precious metal (Preci ous Metais) powder and a special low melting point ceramic 的 powder according to a certain ratio (V. Tu Er cloth is the most suitable for board i1) After the sintering process, a bonding layer (3) is formed. The most commonly used precious metal powder is platinum powder. Jin Shao once: The holes reserved on the above-mentioned Taoman substrate are filled into the branch building. The thermal expansion coefficient of the substrate and the ceramic substrate must be based on the thermal expansion coefficient, iron, and all :: high temperature properties. For example, base materials, starting B 4. ^ 〇 based composite materials or platinum can be used to make the supporting metal (4). In addition, Guan Xingu Fu and Guang F can be used as supporting metal: t or powder t after pressing or firing. After filling in, connect here: metal 4). When one of the main functions of the bonding layer (3) in the branch metal S in the second picture, page 10 555722 V. Description of the invention (7) is a precious metal powder in the proportion of platinum powder (the most commonly used last, special / The low-competition powder is mixed and sintered. The outer rear lead wire (6) is preset on the conductive layer. Able to: ί = = two gold f signal wire ⑷ The material must be said, nickel two i support metal ⑷ for frontal connection. For example And the material. Welding gold can be used to make metal signal wires (6) welding, plasma welding, and resistance welding. ^ The sub-beam is connected, the mouse is on,?: Ϊ! The cross-sectional schematic diagram after welding is completed. The two upper and lower solder joints (7) connect the three parts of the support metal (4), conduction & M signal wires, and form a conduction layer 5): 2 ftf 7 -t ® H aa ^ At this point, the direct VVA material composition is much higher than that of metal and ceramics. 4 For higher economic benefits, you can also use only one-sided powder coating and sintering before welding. Material ^ welding is not straight. The welding joints provided by the type ^ are mainly formed of metal materials, and the fatigue life of the tight end will be much better than the traditional straight coil welding.

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1 555722 V. Description of the invention (8) Metal and ceramic material joints in the joining process (or brazing process). The specific embodiments described above are used to describe the purpose, features and effects of the present invention in detail. For those skilled in the art, according to the above description, some changes or modifications to the specific embodiments will be made without departing from the essence of the present invention. Divine category. Any modification and modification without departing from the basic essence of this invention should belong to the scope of application of this invention.

Page 12 555722 Brief description of the drawings The first diagram is a schematic cross-sectional view of a cross section of a ceramic substrate in a contact portion before welding in the present invention. The second figure is a schematic cross-sectional view of a hole reserved in the ceramic substrate in the first figure of the present invention after the supporting metal is filled in. The third diagram is a schematic cross-sectional view of the second diagram of the present invention after the support metal is filled after the conductive layer is formed on the upper and lower ends of this contact point. The fourth figure is a schematic cross-sectional view of the cross section of the ceramic substrate after the soldering is completed at the contact portion in the present invention.

Brief description of the figure numbers in the drawing: 1-Taurman substrate 2-Hole 3-Bonding layer 4- Supporting metal 5- Conducting layer 6-Metal signal wire 7- Solder joint

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Claims (1)

555722 /, patent application scope of the joint with ceramic 66 t ,, i # i from Zinmei, # 1, where the material of the metal signal wire includes optional M group of 7 = base and iron-based alloy. Disk ceramic 1 ^ κ Metal for making high temperature sensor Electron beam core Where the welding process can use laser welding, 8 one on: electric welding and resistance welding-one of them. The method for joining metal and ceramics of a _ semi-manufactured _ horse temperature sensor includes the following steps: (i) forming a reserved hole in the contact portion of the ceramic substrate; and (1 1) on the ceramic substrate A support metal is filled in the hole reserved above; and G 1 1) a conductive layer is formed on the surface of the contact portion of the ceramic substrate; and (1 v) a metal signal wire is inserted in the contact portion; and (v) A welding process is performed at the contact point to form a plurality of welding points. 9. The method for joining metal and talman to manufacture a high-temperature-resistant sensor as described in item 8 of the scope of patent application, wherein the conductive layer is mixed with a proportion of shell metal powder and ceramic powder greater than 50% by weight, and then applied. It is sintered on ceramic substrate and supporting metal. 10. The method for joining a metal and a ceramic for a high-temperature-resistant sensor according to item 8 of the scope of patent application, wherein the material of the supporting metal includes a material selected from nickel-based, cobalt-based, iron-based alloy, and metal-based composite materials. And platinum. 11. The method for joining a metal and a ceramic for manufacturing a high-temperature-resistant sensor according to item 8 of the scope of patent application, wherein the supporting metal may be a solid short rod, a sheet, or a powder that is pressed or sintered. 12 · The gold of the high-temperature sensor at the time of manufacture as described in item 8 of the scope of patent application Page 15 555722 6. Scope of patent application It belongs to the method of bonding with ceramics, wherein the material of the metal signal wire includes at least one group selected from the group consisting of nickel-based, starting-based and iron-based alloys. 13. The method for manufacturing a metal-to-ceramic joint for a high-temperature-resistant sensor according to item 8 of the scope of patent application, wherein the welding process can use laser welding, electron beam welding, argon welding, plasma welding, and resistance welding. One. Page 16