TW314650B - - Google Patents

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Publication number
TW314650B
TW314650B TW085107308A TW85107308A TW314650B TW 314650 B TW314650 B TW 314650B TW 085107308 A TW085107308 A TW 085107308A TW 85107308 A TW85107308 A TW 85107308A TW 314650 B TW314650 B TW 314650B
Authority
TW
Taiwan
Prior art keywords
semiconductor
main surface
wiring
contact pad
semiconductor wafer
Prior art date
Application number
TW085107308A
Other languages
English (en)
Chinese (zh)
Original Assignee
Oki Electric Ind Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Oki Electric Ind Co Ltd filed Critical Oki Electric Ind Co Ltd
Application granted granted Critical
Publication of TW314650B publication Critical patent/TW314650B/zh

Links

Classifications

    • H10W74/121—
    • H10W70/415—
    • H10W70/427—
    • H10W70/457—
    • H10W72/075—
    • H10W72/536—
    • H10W72/5363—
    • H10W72/5522—
    • H10W72/59—
    • H10W72/865—
    • H10W72/9445—
    • H10W72/951—
    • H10W72/952—
    • H10W74/00—
    • H10W74/142—
    • H10W90/736—
    • H10W90/756—

Landscapes

  • Wire Bonding (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
TW085107308A 1995-06-21 1996-06-17 TW314650B (index.php)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP17829695 1995-06-21

Publications (1)

Publication Number Publication Date
TW314650B true TW314650B (index.php) 1997-09-01

Family

ID=16045997

Family Applications (1)

Application Number Title Priority Date Filing Date
TW085107308A TW314650B (index.php) 1995-06-21 1996-06-17

Country Status (4)

Country Link
US (1) US5874783A (index.php)
EP (2) EP0750342A3 (index.php)
KR (1) KR100473464B1 (index.php)
TW (1) TW314650B (index.php)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09283545A (ja) * 1996-04-10 1997-10-31 Oki Electric Ind Co Ltd 樹脂封止型半導体装置及びその製造方法
JP3427874B2 (ja) * 1996-05-16 2003-07-22 沖電気工業株式会社 樹脂封止型半導体装置とその製造方法
JPH10214933A (ja) * 1997-01-29 1998-08-11 Toshiba Corp 半導体装置とその製造方法
JP3638750B2 (ja) * 1997-03-25 2005-04-13 株式会社ルネサステクノロジ 半導体装置
JP3006546B2 (ja) 1997-06-12 2000-02-07 日本電気株式会社 半導体装置及びリードフレーム
JP3085278B2 (ja) * 1998-05-01 2000-09-04 日本電気株式会社 半導体装置の製造方法および半導体製造装置
JP2001156237A (ja) * 1999-11-25 2001-06-08 Mitsubishi Electric Corp リードフレーム及びそれを用いた樹脂封止型半導体装置
US6664649B2 (en) * 2001-02-28 2003-12-16 Siliconware Precision Industries Co., Ltd. Lead-on-chip type of semiconductor package with embedded heat sink
US7294533B2 (en) * 2003-06-30 2007-11-13 Intel Corporation Mold compound cap in a flip chip multi-matrix array package and process of making same
US7495321B2 (en) 2006-07-24 2009-02-24 Stats Chippac, Ltd. Leaded stacked packages having elevated die paddle
TW200941669A (en) * 2008-03-28 2009-10-01 Powertech Technology Inc Semiconductor packing structure
US9645163B2 (en) 2011-08-24 2017-05-09 Continental Teves Ag & Co. Ohg Sensor with a single electrical carrier means

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5854644A (ja) * 1981-09-28 1983-03-31 Nec Corp ボンデイング用樹脂基板
JPS5966157A (ja) * 1982-10-08 1984-04-14 Fujitsu Ltd 半導体装置及びその製造方法
KR0158868B1 (ko) * 1988-09-20 1998-12-01 미다 가쓰시게 반도체장치
JP2895920B2 (ja) * 1990-06-11 1999-05-31 株式会社日立製作所 半導体装置及びその製造方法
KR100234824B1 (ko) * 1991-03-20 1999-12-15 윌리엄 비. 켐플러 반도체 장치
JPH04320390A (ja) * 1991-04-19 1992-11-11 Hitachi Ltd 表面実装型半導体部品の実装方法
US5221642A (en) * 1991-08-15 1993-06-22 Staktek Corporation Lead-on-chip integrated circuit fabrication method
JP2518569B2 (ja) * 1991-09-19 1996-07-24 三菱電機株式会社 半導体装置
JP2509422B2 (ja) * 1991-10-30 1996-06-19 三菱電機株式会社 半導体装置及びその製造方法
US5229639A (en) * 1991-10-31 1993-07-20 International Business Machines Corporation Low powder distribution inductance lead frame for semiconductor chips
KR940007757Y1 (ko) * 1991-11-14 1994-10-24 금성일렉트론 주식회사 반도체 패키지
JPH05152495A (ja) * 1991-11-26 1993-06-18 Hitachi Ltd 半導体装置
JP3410752B2 (ja) * 1992-04-14 2003-05-26 富士通株式会社 半導体装置及びその製造方法
JPH06132339A (ja) * 1992-10-19 1994-05-13 Mitsubishi Electric Corp 半導体装置
JP2934357B2 (ja) * 1992-10-20 1999-08-16 富士通株式会社 半導体装置
KR100269281B1 (ko) * 1992-12-17 2000-10-16 윤종용 반도체장치
JPH06216282A (ja) * 1993-01-19 1994-08-05 Hitachi Ltd 樹脂封止型半導体装置
JP2810626B2 (ja) * 1994-06-07 1998-10-15 日鉄セミコンダクター株式会社 半導体装置
US5545921A (en) * 1994-11-04 1996-08-13 International Business Machines, Corporation Personalized area leadframe coining or half etching for reduced mechanical stress at device edge

Also Published As

Publication number Publication date
EP0750342A3 (en) 1997-10-08
EP1396886A3 (en) 2004-07-07
KR100473464B1 (ko) 2005-05-17
EP1396886A2 (en) 2004-03-10
KR970003884A (ko) 1997-01-29
EP0750342A2 (en) 1996-12-27
US5874783A (en) 1999-02-23

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees