TW297159B - - Google Patents
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- Publication number
- TW297159B TW297159B TW084111429A TW84111429A TW297159B TW 297159 B TW297159 B TW 297159B TW 084111429 A TW084111429 A TW 084111429A TW 84111429 A TW84111429 A TW 84111429A TW 297159 B TW297159 B TW 297159B
- Authority
- TW
- Taiwan
- Prior art keywords
- layer
- random access
- insulating layer
- buffer
- conductive
- Prior art date
Links
- 238000005530 etching Methods 0.000 claims description 19
- 238000000034 method Methods 0.000 claims description 19
- 230000003068 static effect Effects 0.000 claims description 19
- 239000002184 metal Substances 0.000 claims description 18
- 229910052751 metal Inorganic materials 0.000 claims description 18
- 238000004519 manufacturing process Methods 0.000 claims description 14
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 12
- 239000000758 substrate Substances 0.000 claims description 12
- 239000013078 crystal Substances 0.000 claims description 10
- 239000010931 gold Substances 0.000 claims description 10
- 229910052737 gold Inorganic materials 0.000 claims description 10
- 238000009413 insulation Methods 0.000 claims description 10
- 239000005380 borophosphosilicate glass Substances 0.000 claims description 9
- 230000002093 peripheral effect Effects 0.000 claims description 9
- 239000004020 conductor Substances 0.000 claims description 7
- 239000010409 thin film Substances 0.000 claims description 7
- 239000000463 material Substances 0.000 claims description 6
- 239000004065 semiconductor Substances 0.000 claims description 6
- 238000000151 deposition Methods 0.000 claims description 5
- 241001331845 Equus asinus x caballus Species 0.000 claims description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 2
- 230000003139 buffering effect Effects 0.000 claims description 2
- 238000000059 patterning Methods 0.000 claims description 2
- 229910052710 silicon Inorganic materials 0.000 claims description 2
- 239000010703 silicon Substances 0.000 claims description 2
- 229910052715 tantalum Inorganic materials 0.000 claims 2
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 claims 2
- 241000270349 Iguana Species 0.000 claims 1
- 239000009731 jinlong Substances 0.000 claims 1
- QWZCSSOOCJGFTI-UHFFFAOYSA-N tricyanosilylformonitrile Chemical compound N#C[Si](C#N)(C#N)C#N QWZCSSOOCJGFTI-UHFFFAOYSA-N 0.000 claims 1
- 239000002699 waste material Substances 0.000 claims 1
- 230000005540 biological transmission Effects 0.000 description 6
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 6
- 230000015572 biosynthetic process Effects 0.000 description 3
- 229920002120 photoresistant polymer Polymers 0.000 description 3
- 238000000926 separation method Methods 0.000 description 3
- 241000234282 Allium Species 0.000 description 2
- 235000002732 Allium cepa var. cepa Nutrition 0.000 description 2
- 229910052581 Si3N4 Inorganic materials 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 2
- 239000004744 fabric Substances 0.000 description 2
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 2
- 244000247747 Coptis groenlandica Species 0.000 description 1
- 235000002991 Coptis groenlandica Nutrition 0.000 description 1
- XFXPMWWXUTWYJX-UHFFFAOYSA-N Cyanide Chemical compound N#[C-] XFXPMWWXUTWYJX-UHFFFAOYSA-N 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 230000001186 cumulative effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 238000001312 dry etching Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000006870 function Effects 0.000 description 1
- 238000002309 gasification Methods 0.000 description 1
- 238000007429 general method Methods 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 210000000936 intestine Anatomy 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 230000002262 irrigation Effects 0.000 description 1
- 238000003973 irrigation Methods 0.000 description 1
- 238000002372 labelling Methods 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 239000011574 phosphorus Substances 0.000 description 1
- 238000009428 plumbing Methods 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 230000000979 retarding effect Effects 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
- KHDSWONFYIAAPE-UHFFFAOYSA-N silicon sulfide Chemical compound S=[Si]=S KHDSWONFYIAAPE-UHFFFAOYSA-N 0.000 description 1
- 210000003625 skull Anatomy 0.000 description 1
- 210000001154 skull base Anatomy 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B10/00—Static random access memory [SRAM] devices
- H10B10/12—Static random access memory [SRAM] devices comprising a MOSFET load element
- H10B10/125—Static random access memory [SRAM] devices comprising a MOSFET load element the MOSFET being a thin film transistor [TFT]
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B10/00—Static random access memory [SRAM] devices
- H10B10/18—Peripheral circuit regions
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S257/00—Active solid-state devices, e.g. transistors, solid-state diodes
- Y10S257/903—FET configuration adapted for use as static memory cell
- Y10S257/904—FET configuration adapted for use as static memory cell with passive components,, e.g. polysilicon resistors
Landscapes
- Semiconductor Memories (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
- Drying Of Semiconductors (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1019940040680A KR0145058B1 (ko) | 1994-12-31 | 1994-12-31 | 스태틱 랜덤 억세스 메모리 소자 및 제조방법 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TW297159B true TW297159B (enExample) | 1997-02-01 |
Family
ID=19406287
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW084111429A TW297159B (enExample) | 1994-12-31 | 1995-10-28 |
Country Status (4)
| Country | Link |
|---|---|
| US (2) | US5856706A (enExample) |
| JP (1) | JPH08330446A (enExample) |
| KR (1) | KR0145058B1 (enExample) |
| TW (1) | TW297159B (enExample) |
Families Citing this family (19)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5789317A (en) * | 1996-04-12 | 1998-08-04 | Micron Technology, Inc. | Low temperature reflow method for filling high aspect ratio contacts |
| US5994780A (en) * | 1997-12-16 | 1999-11-30 | Advanced Micro Devices, Inc. | Semiconductor device with multiple contact sizes |
| JP3515363B2 (ja) * | 1998-03-24 | 2004-04-05 | 株式会社東芝 | 半導体装置の製造方法 |
| KR20000012252U (ko) * | 1998-12-16 | 2000-07-05 | 전주범 | 압전소자를 사용한 커넥터 |
| US6720660B1 (en) * | 1998-12-22 | 2004-04-13 | Seiko Epson Corporation | Semiconductor device and method for manufacturing the same |
| JP3204316B2 (ja) * | 1998-12-28 | 2001-09-04 | 日本電気株式会社 | 半導体装置の製造方法 |
| US6521947B1 (en) | 1999-01-28 | 2003-02-18 | International Business Machines Corporation | Method of integrating substrate contact on SOI wafers with STI process |
| US6165891A (en) * | 1999-11-22 | 2000-12-26 | Chartered Semiconductor Manufacturing Ltd. | Damascene structure with reduced capacitance using a carbon nitride, boron nitride, or boron carbon nitride passivation layer, etch stop layer, and/or cap layer |
| KR100346832B1 (ko) * | 2000-01-12 | 2002-08-03 | 삼성전자 주식회사 | 스태틱 랜덤 억세스 메모리 소자 및 그 제조 방법 |
| KR100354440B1 (ko) * | 2000-12-04 | 2002-09-28 | 삼성전자 주식회사 | 반도체 장치의 패턴 형성 방법 |
| KR100378200B1 (ko) * | 2001-05-22 | 2003-03-29 | 삼성전자주식회사 | 반도체 소자의 콘택 플러그 형성방법 |
| US6621129B1 (en) * | 2002-05-24 | 2003-09-16 | Macronix International Co., Ltd. | MROM memory cell structure for storing multi level bit information |
| KR20080076459A (ko) * | 2007-02-16 | 2008-08-20 | 삼성전자주식회사 | 박막 트랜지스터 표시판 및 박막 트랜지스터 표시판의 제조방법 |
| US7767496B2 (en) | 2007-12-14 | 2010-08-03 | Stats Chippac, Ltd. | Semiconductor device and method of forming interconnect structure for encapsulated die having pre-applied protective layer |
| US8183095B2 (en) | 2010-03-12 | 2012-05-22 | Stats Chippac, Ltd. | Semiconductor device and method of forming sacrificial protective layer to protect semiconductor die edge during singulation |
| US9318441B2 (en) | 2007-12-14 | 2016-04-19 | Stats Chippac, Ltd. | Semiconductor device and method of forming sacrificial adhesive over contact pads of semiconductor die |
| US8343809B2 (en) * | 2010-03-15 | 2013-01-01 | Stats Chippac, Ltd. | Semiconductor device and method of forming repassivation layer with reduced opening to contact pad of semiconductor die |
| US8456002B2 (en) | 2007-12-14 | 2013-06-04 | Stats Chippac Ltd. | Semiconductor device and method of forming insulating layer disposed over the semiconductor die for stress relief |
| US9548240B2 (en) | 2010-03-15 | 2017-01-17 | STATS ChipPAC Pte. Ltd. | Semiconductor device and method of forming repassivation layer for robust low cost fan-out semiconductor package |
Family Cites Families (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62229976A (ja) * | 1986-03-31 | 1987-10-08 | Toshiba Corp | 半導体装置およびその製造方法 |
| US5401994A (en) * | 1991-05-21 | 1995-03-28 | Sharp Kabushiki Kaisha | Semiconductor device with a non-uniformly doped channel |
| EP0523856A3 (en) * | 1991-06-28 | 1993-03-17 | Sgs-Thomson Microelectronics, Inc. | Method of via formation for multilevel interconnect integrated circuits |
| JP3065829B2 (ja) * | 1992-12-25 | 2000-07-17 | 新日本製鐵株式会社 | 半導体装置 |
| KR0161378B1 (ko) * | 1994-06-13 | 1998-12-01 | 김광호 | 바이폴라 접합 트랜지스터 제조방법 |
| US5576240A (en) * | 1994-12-09 | 1996-11-19 | Lucent Technologies Inc. | Method for making a metal to metal capacitor |
| KR0161398B1 (ko) * | 1995-03-13 | 1998-12-01 | 김광호 | 고내압 트랜지스터 및 그 제조방법 |
| KR0176199B1 (ko) * | 1996-03-19 | 1999-04-15 | 김광호 | 반도체 소자의 접촉창 형성방법 |
| KR0183877B1 (ko) * | 1996-06-07 | 1999-03-20 | 김광호 | 불휘발성 메모리 장치 및 그 제조방법 |
| KR100267087B1 (en) * | 1997-01-07 | 2000-10-02 | Samsung Electronics Co Ltd | Manufacturing method of capacitor device |
-
1994
- 1994-12-31 KR KR1019940040680A patent/KR0145058B1/ko not_active Expired - Fee Related
-
1995
- 1995-10-28 TW TW084111429A patent/TW297159B/zh not_active IP Right Cessation
- 1995-11-06 JP JP7286956A patent/JPH08330446A/ja active Pending
- 1995-11-13 US US08/557,865 patent/US5856706A/en not_active Expired - Lifetime
-
1998
- 1998-10-14 US US09/172,441 patent/US6110773A/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| US6110773A (en) | 2000-08-29 |
| KR960026113A (ko) | 1996-07-22 |
| JPH08330446A (ja) | 1996-12-13 |
| US5856706A (en) | 1999-01-05 |
| KR0145058B1 (ko) | 1998-07-01 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MM4A | Annulment or lapse of patent due to non-payment of fees |