TW203624B - - Google Patents

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TW203624B
TW203624B TW080107901A TW80107901A TW203624B TW 203624 B TW203624 B TW 203624B TW 080107901 A TW080107901 A TW 080107901A TW 80107901 A TW80107901 A TW 80107901A TW 203624 B TW203624 B TW 203624B
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adhesive layer
guide
cover tape
lotus
tape
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TW080107901A
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Sumitomo Bakelite Co
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    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00Adhesives in the form of films or foils
    • C09J7/20Adhesives in the form of films or foils characterised by their carriers
    • C09J7/29Laminated material
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00Adhesives in the form of films or foils
    • C09J7/20Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22Plastics; Metallised plastics
    • C09J7/24Plastics; Metallised plastics based on macromolecular compounds obtained by reactions involving only carbon-to-carbon unsaturated bonds
    • C09J7/241Polyolefin, e.g.rubber
    • C09J7/243Ethylene or propylene polymers
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    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00Adhesives in the form of films or foils
    • C09J7/30Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/35Heat-activated
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/0084Containers and magazines for components, e.g. tube-like magazines
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00Additional features of adhesives in the form of films or foils
    • C09J2301/10Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet
    • C09J2301/16Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the structure of the carrier layer
    • C09J2301/162Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the structure of the carrier layer the carrier being a laminate constituted by plastic layers only
    • CCHEMISTRY; METALLURGY
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    • C09J2423/00Presence of polyolefin
    • C09J2423/006Presence of polyolefin in the substrate
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10STECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S428/00Stock material or miscellaneous articles
    • Y10S428/922Static electricity metal bleed-off metallic stock
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    • Y10T428/25Web or sheet containing structurally defined element or component and including a second component containing structurally defined particles
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    • Y10T428/25Web or sheet containing structurally defined element or component and including a second component containing structurally defined particles
    • Y10T428/256Heavy metal or aluminum or compound thereof
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
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    • Y10T428/25Web or sheet containing structurally defined element or component and including a second component containing structurally defined particles
    • Y10T428/256Heavy metal or aluminum or compound thereof
    • Y10T428/257Iron oxide or aluminum oxide
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00Stock material or miscellaneous articles
    • Y10T428/28Web or sheet containing structurally defined element or component and having an adhesive outermost layer
    • Y10T428/2813Heat or solvent activated or sealable
    • Y10T428/2817Heat sealable
    • Y10T428/2826Synthetic resin or polymer
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
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    • Y10T428/28Web or sheet containing structurally defined element or component and having an adhesive outermost layer
    • Y10T428/2848Three or more layers
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00Stock material or miscellaneous articles
    • Y10T428/28Web or sheet containing structurally defined element or component and having an adhesive outermost layer
    • Y10T428/2852Adhesive compositions
    • Y10T428/2878Adhesive compositions including addition polymer from unsaturated monomer
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00Stock material or miscellaneous articles
    • Y10T428/28Web or sheet containing structurally defined element or component and having an adhesive outermost layer
    • Y10T428/2852Adhesive compositions
    • Y10T428/2878Adhesive compositions including addition polymer from unsaturated monomer
    • Y10T428/2891Adhesive compositions including addition polymer from unsaturated monomer including addition polymer from alpha-beta unsaturated carboxylic acid [e.g., acrylic acid, methacrylic acid, etc.] Or derivative thereof
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00Stock material or miscellaneous articles
    • Y10T428/28Web or sheet containing structurally defined element or component and having an adhesive outermost layer
    • Y10T428/2852Adhesive compositions
    • Y10T428/2896Adhesive compositions including nitrogen containing condensation polymer [e.g., polyurethane, polyisocyanate, etc.]

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Laminated Bodies (AREA)
  • Packages (AREA)
  • Packaging Frangible Articles (AREA)

Description

Λ 6 Β6 經濟部中央標準局员工消费合作社印製 五、發明説明(1 ) 本發明有關一種蓋覆帶,可熱封合於塑膠載帶,載帶 具有一定間隔之口袋可容纳電子零件,該蓋覆帶為包裝材 料組件之一,包裝材料偽用來儲存,蓮送及裝配晶k型電 子零件,此種配置可保護電子零件免受污染並可取出裝配 於電路基片上。 最近幾年,晶片型電子零件用來作表面裝配,如1C ,電晶髏,二極體,電容器,壓電電阻者,皆以塑膠載帶 包裝材料包裝,載帶以浮花壓製方式在一定間隔形成口袋 以容纳特定形狀之晶片型電子零件及可熱封合於載帶之蓋 覆帶,將包裝蓋覆帶剝離邸可自動取出包含在包裝材料内 之電子零件,然後裝配在電子電路基片上。 蓋覆帶自載帶剝離的強度稱為 ''剝離強度〃,若剝離 強度太低,則蓮送時蓋覆帶會自包裝分離並使電子零件掉 落,若剝離強度太高,則剝離蓋覆帶時亦使載帶振動導致 電子零件在裝配之前即跳出口袋掉落出來。 傳統之載帶使用聚氯乙烯(PVC)板,聚苯乙烯板 ,聚酯(PET)板,聚碩酸酯板,丙烯酸板及其他板材 ,同時由於蓋覆帶熱封合於載板上,使用之複合軟片由聚 乙烯變性軟片或乙烯醋酸乙烯共聚物(EVA)變性軟片 ,可熱封合於PVC或聚苯乙烯板,夾層於雙軸向聚酯而 成。但傳统蓋覆帶之剝離強度受封合條件,如封合溫度, 壓力及其他之影饗很大,此種不穩定的封合條件很難將剝 離強度控制於上述適當之範圍;另外,儲存時之溫度,濕 度,及封合後之儲存條件皆會影響剝離強度,使其隨時間 (請先閲讀背面之注意事項再填寫本頁) 本紙張尺度边用中國國家標準(CNS)甲4規格(210 X297公犮) -3 - Λ 6 Β 6 經濟部屮央標準局员工消費合作社印製 五、發明説明(2 ) 增加或減少,甚至偏離通用範圍。 有兩種不同剝離機構的蓋覆帶;一種是介面剝離型, 另一種是内聚剝離型,介面剝離型很難滿足蓋覆帶基本要 件> 強黏易剝”的兩相反特性,因為封合表面就是剝離表 面;剝離強度亦受載帶表面條件的影W,故不易控制剝離 強度於上述適當範圍内;同時,蓋覆帶之剝離強度亦受儲 存條件,如溫度與濕度的影饗,故會隨時間增加或減少其 強度,甚至偏離適用範圍,而内聚剝離型使用如日本特許 公報1 2936/1 986所掲示之軟片製成的蓋覆帶, 其中封合表面與剝離表面不同,其剝離強度僳得自黏合層 的内聚強度;此種蓋覆帶有極佳性質,穩定度不因時間而 變化,然而黏合層之内聚強度不大;因此,當蓋覆帶産品 成捲儲存時,尤其在夏天高溫時,其雙軸向軟片在心部分 會與封合表面産生封固而造成封合不足,透明性明顯降低 等,另外,有關”強黏易剝",内聚剝離之剝離容易,但 強黏仍是難題,因為黏層並未強黏於載帶,且黏性亦視封 合表面情況及載帶封合寬度而定。 最近幾年在表面裝配技術上的顯著改良,表面裝配所 使用之電子零件趨向於更高能力更小尺寸的晶片。如此一 ♦ 來,電子零件在包裝蓮送時振動並接觸包裝載帶浮花壓印 的内表面,或接觭包裝之蓋覆帶會造成磨擦而産生靜電, 蓋覆帶在剝離載帶寺亦會産生靜電,此種靜電産生的電弧 會破壊電子零件而使劣質化,故靜電成為電子零件最大的 麻煩,須發展包裝材料反靜電的措施。 (請先閲讀背面之注意事項再蜞寫本頁) 裝- 訂- 線- 本紙張尺度边用中S國家«毕(CNS)甲4規格(210X297公犮) —4 — Λ 6 Η 6 經濟部中央標準局負工消t合作社印製 五、發明説明(3 ) 在載帶上滲入或塗層碩黑於載帶上為有效之反靜電處 理。但蓋覆帶反靜電處理仍無充分的辦法,目前使用之方 法效果有限,例如,在蓋覆帶外層塗層反靜電劑或傳導性 材料等。此等處理僅在外倒,對封合之電子零件並無保護 作用,尤其對蓋覆帶内部與電子零件磨擦産生的靜電更無 效,邸蓋覆帶之黏合層也須塗層或滲入反靜電劑才有效, 在滲入的情形,黏合層之反靜電劑會流入蓋覆帶内表造成 不穩定之封合,會引起很多封合不良的麻煩;而且受溫度 ,壓力及濕度的影鬱,反靜電效果亦會隨時間而遞減,待 別在10%相對濕度的情況反靜電效果的減少極明顯,故 效果不大,同時,將傳導材料滲入黏合層技術上有困難, 因為黏合層係將擠製軟片及其他同類者夾靥成外層而形成 ;另外,滲入亦顯著的使蓋覆帶之透明性降低,而不適用 。事實上在黏合層塗層傳導性材料亦沒效果,因為選擇可 穩定黏合於載帶的黏合劑有困難,而且黏合層已被塗層覆 蓋住。 本發明花費很多時間要克服上述問題,以便製成一種 黏層接受反靜電處理,而剝離強度僅稍微受封合條件影饗 ,且封合性質穩定隨時間變化不大的蓋覆帶。本發明人發 現一種複合軟片包含(a)由雙軸向軟片組成之外層(b )在該外層與黏合層之間備有中間層及一組成為聚烯烴軟 片,稍後將說明之黏合層,當使用該複合軟片作為蓋覆帶 封合於載帶上,在剝離時該黏合層會使本身内聚性失效而 致能剝離,及(c) 一黏合層塗層於該中間層,其組成為 (請先閲讀背面之注意事項再填寫本頁) 本紙張尺度边用中a國家《準(CHS) f 4規格(210X297公犮) -5 ~ 經濟部中央標準局员工消t合作社印製 Λ 6 ___Π6_ 五、發明説明(4 ) 熱封漆型之熱塑膠黏膠,其中散怖傳導性细粉,此種複合 軟片係透明可作良好性質之蓋覆帶。 本發明傜一種包裝晶Η型電子零件用之蓋覆帶,包含 一外層,一中間層及一黏合層,可熱封合於熱塑膠載帶, 載帶具有一定間隔之口袋以容纳晶片型電子零件,其待徴 在外層偽一雙軸向軟Η,组成有聚酯,聚丙烯或尼龍,在 外層以黏合層之間備有中間層係一聚烯烴軟片包含(a) 55—95%重量之至少一種選自密度0. 91— ◦. 93克/立方厘米聚乙烯的乙烯聚合物及含10%重 置或以下之醋酸乙烯的乙烯一醋酸乙烯共聚物,(b) 5 一 30%重量之聚苯乙烯及(c) 0 - 20%重量苯乙烯 -丁二烯一苯乙烯或苯乙烯一異戊二烯一苯乙烯塊聚合物 具有熱塑膠彈性本質,使其在封合於載帶的蓋覆帶剝離時 能使本身内聚失效而致能剝離,及組成有傳導細粉散佈之 黏合層,含氧化錫,氣化鋅,氧化鈦,碩黑或矽基有機化 合物,或其組合散佈於熱塑膠樹脂内,其組成為聚氨脂樹 脂,丙烯酸樹脂,聚氣乙烯樹脂,乙烯一醋酸乙烯聚合物 樹脂或聚酯樹脂,或其組合。本發明之蓋覆帶,其持徵在 加入1 ◦一 1 0 ◦◦重量組成之傳導性細粉至黏合層熱塑 膠樹的每100重量組成,蓋覆帶黏合層與載帶封合表面 之間的黏合強度大於蓋覆帶中間層的内聚強度,蓋覆帶中 間層之内聚強度為每毫米之封合1 0— 1 20克,及蓋覆 帶之可光透射比為10%或以上。 圖1為本發明蓋覆帶層組成實施例的截面。 (請先閲讀背面之注意事項再填寫本頁) 裝< 訂_ 本紙張尺度逍用中S 8家《準(CNS)甲4規格(210x297公犮) 一 6 一 經濟部中央標準局员工消#合作杜印製 五、發明説明(5 ) 圖2為本發明蓋覆帶黏合載帶狀態之截面。 圖3為本發明蓋覆帶黏合載帶然後剝離之載帶狀態的 截面。 圖4為本發明蓋覆帶黏合載帶然後剝離之蓋覆帶狀態 的截面。 本發明蓋覆帶1组成元件如圖1示,外層2係雙軸向 聚丙烯軟片或尼龍軟片,厚度6_100//m,透明高硬 度。當厚度小於6 //m時,硬度即不存在,當厚度超過 l〇0/zm,硬度太高,不適用於封合與黏合層3接觸之 外層2的表面必要時可接受表面處理,如電暈,等離子體 ,噴砂或其他處理以增加黏合層3之黏強度,外層2之外 表可用表面活性劑,傳導粉末或其他塗層,以便使該表面 具有反靜電性質。 中間層4係聚烯烴軟片,包含(a) 55-95%重 量之至少一種選自具有密度0. 91—0. 93克/立方 厘米聚乙烯之乙烯聚合物及乙烯一醋酸乙烯含10%重量 或以下之醋酸乙烯的共聚物,(b) 5—30%重量之聚 乙烯及(c) 0 — 20%重量之苯乙烯一丁二烯一苯乙烯 或苯乙烯一異戊二烯-苯乙烯之塊共聚物,具有熱塑膠彈 性性質,在蓋覆帶剝離載帶時可使其本身内聚失效而致能 剝離。接觸黏合層5之中間層4的表面,必要時可接受如 電翬,等離子體,噴砂或其他類似的表面處理,以增加中 間層4及黏合層5之間的黏合。 &度返用中8國家標準(CNS)T4規格(210X297公茇) " -7 - (請先閲讀背面之注意事項再填寫本頁) 裝· 訂 線· ί Λ 6 η 6 經濟部中央標準局EX工消費合作社印製 五、發明説明(6 ) 黏合層5之组成為熱封漆型之透明熱塑膠樹脂(即聚 氨酯,丙烯酸,乙烯-醋酸乙烯共聚物樹脂,聚氣乙播樹 脂,聚酯樹脂),選一單一或各熱封之混合樹脂作為塑膠 載帶6,供黏合層5之黏合,由於熱封黏合層覆蓋内聚剝 離中間靥,故可防止中間層對雙軸向軟片的封固,當蓋覆 帶儲存於高溫時,可同時改善蓋覆帶與載帶的黏合。 在黏合層中均勻散佈組成有氣化錫,氣化鋅,氣化鈦 ,碩黒或矽基有機化合物的傳導性細粉末,膜片形成後之 黏合層的表面電阻需有10Ζ3〇ΗΜ /口或以下,以 10e _ 10s OHM/口的範圍為宜,當表面電阻大於 10〃ΟΗΜ/口時反靜電效果極差,所加之傳導性細粉 末為10—1, 00◦重量組成,以每100重量组成之 黏合層熱塑膠樹脂加100—400重量組成為宜,才符 合上述要求,若加入量少於10重置组成,則無反靜電效 果,而超過1, 000,傳導性粉末在熱塑膠樹脂中之散 佈性變得很差,與中間層4黏合性及透明變差,生産成本 變高,致使生産力降低,反靜電材料本身有傳導性,半永 久性,不致造成流失等現象,故不會影響黏合層之封合性 質;黏合層之表面電阻控制在1 〇i3OHM /口或以下的 準位,故包含載帶6及蓋覆帶1,電子零件之包裝不會因 電子零件與蓋覆帶在運送時或剝離蓋覆帶1取出電子零件 時的磨擦而産生靜電,故可防止電子零件受靜電的損害。 為加強反靜電效果,可在外層兩表面提供一反靜電層 或傳導層,即雙軸向軟片,形成熱封合黏合層的方法可利 (請先閲讀背面之注意事項再填寫本頁) 裝* 訂_ 線- 本紙張尺度逍用中a國家«準(CNS)甲4規格(210X297公釐) -8 - Λ 6 II 6 經濟部屮央標準局貝工消"合作社印製 五、發明説明(7 ) 用熔合的軟片形成方法或利用溶液的軟片形成方法,但以 溶液的方法有較佳之傳導粉末的散佈性,軟片厚度以 5 /im或以下為宜,最好在2 以下,當厚度超過 5/im時很難使用溶液方法形成黏合層。 為改善.外層與黏合層之間的夾靥強度,可將此兩層經 由漆型黏合層夾層,該漆型黏層由乾燥,固化異氣酸類, 亞胺類或類似者而形成。 在封合一剝離蓋覆帶的程序中,首先蓋覆帶1偽連接 封合於載帶6兩側成雙軌形狀,一側之封合寬度為1毫米 (圖2),然後將蓋覆帶1自載帶6剝離時,當蓋覆帶1 之黏合層5與載帶6之封合表面之間的黏合強度小於中間 層4之内聚強度時,剝離強度對應黏合層5與封合表面之 間的黏合強度,此種剝離機構即為目前常用之介面剝離, 在此種情況下,強力封合使蓋覆帶很難剝離載帶,而封合 力弱則可瞬間剝離,故難以滿足要封合強,又要剝離易之 兩難情況。 本發明蓋覆帶1之黏合層5與載帶6封合表面之黏合 強度大於蓋覆帶1中間層4之内聚強度,剝離時僅在黏合 層5封合部分7與中間層4仍留在載帶(圖3),蓋覆帶 剝離後(圖4),僅黏合層5熱封合*部分7及中間層4由 於内聚失效造成内聚剝離而失去;故可設計一完全分離的 封合/剝離表面。簡言之,剝離表面設計在蓋覆帶1,而 中間層内聚強度可設計在載帶材料上,封合強度可經由黏 合劑之選擇而強化。 (請先閲讀背面之注意事項再填寫本頁) 本紙張尺度逍用中國a家《準(CNS) T4規格(210X297公茇) 經濟部屮央標準局β工消#合作社印製 Λ 6 __ 五、發明説明(8 ) - 此種情形可選擇聚烯烴軟片,使中間層4之内聚強度 變成每毫米封合寬度為1 0 — 1 2 0克,以1 0-7〇克 /毫米為佳。當剝離強度小於1 0克時,在蓋覆帶瞬間剝 離時會使電子零件掉落。當剝離強度大於120克時,則 蓋覆帶剝離載帶時載帶會振動並使電子零件在裝配之前即 掉落,即跳動問題。根據本發明可得到不受封合條件及時 間影镨的蓋覆帶。 本發明之蓋覆帶為可見光透射比10%或以上,以 5 0%或以上為佳,以便識別(目視或儀表)載帶内之電 子零件。當透射比低於1 0 %就很難識別電子零件。 以下為本發明之實施例及比較,但並不受限於這些實 施例。 奮旃例1、2、3、4、5及其fch較 在雙軸向軟片夾層之聚烯烴軟片侧成為外層,而聚烯 烴軟片則成為中間層,以乙基醋酸溶液塗層,溶液含熱塑 膠樹脂及傳導粉末之混合物,利用凹皮塗劑使塗層成為 2厚之軟片成為黏合層;因而得到表1與2各層組成 之各種蓋覆帶。各蓋覆帶割成5. 5毫米寛,然後熱封於 8毫米寬之PVC載帶,之後才量測k剝離強度。量测黏 合層側及各實驗蓋覆帶之可見光透射比結果如表3與4示 0 宵施例6、 7、 8、 9、 10 (請先閲讀背面之注意事項再填寫本頁) 裝- 訂- 線- 本紙张尺度通用中®國家標準(CNS)甲4規格(210 X297公发) -10 - Λ 6 Β 6 五、發明説明气) 重複實施例1之步驟,但改變傳導性粉末Sn〇2加 入黏合層的劑量如下: 每100重量組成PVC型樹脂S η Ο 2量 實施例6 2 0 重置组成 實施例7 5 0 重量组成 實施例8 5 〇 〇 重量組成 實施例9 7 5 〇 重量组成 實施例1 0 9 0 〇 重量组成 樣品評鑑如實施例1。其結果示於表5 (請先閲讀背面之注意事項再填窝本頁) 裝- 經濟部中央標準局员工消t合作社印製 本紙張尺度逍用中Η國家標準(CNS)甲4規格(210 Χ297公;¢) 咽⑽5®^專利申請常 之兑明書修正頁 民國82年2月 #jt A6 B6
五、發明説明(10 ) 表1 實例1 實例2 mm 實例4 實例5 外 層 雙軸取向的 雙軸取向的 雙鼬取向的 燹軸取向的 雙軸取向的 PET NY PP PET ΚΥ 密度(8/0^) 0.923 0.915 0.927 0.925 0.912 聚乙烯 65 80 90 70 55 聚苯乙烯 20 12 7 20 30 中間層 苯乙烯-丁二 烯-苯乙烯 15 8 3 苯乙烯-異戊 二烯$乙烯 • 10 15 黏合靥 樹脂 pvc« EVA類 PETS 丙烯酸糸 聚胺基甲_ 傳導性粉末 Sn02 150 Ti02 250 ZnO 100 磺黑350 矽酸乙酯120 (請先閲讀背面之注意事項再場寫本頁) 丨裝- 註:PET:聚對苯二甲酸乙二醇SB, PP:聚丙烯, NY:尼龍· EVA:乙烯-乙酸乙搬共聚物 PVC:聚氛乙烯, 311〇厂氣化錫,
Ti02:氣化纹· ZnO :氣化鋅 層的厚度:外層=12 u m,中間層=5 Ο μ m, 黏合層=2 中間層各組成之數字像指金部三種组成每1〇〇重量組^的重置组成。 傳導性粉末之數字指加入黏合層熱塑膝樹脂1◦◦重置组成中該粉末的重置組成。 -11, 經濟部中央標準局員工消費合作社印製 12 - 本紙張尺度適用中國國家標準(CNS)甲4規格(210 X 297公釐) - ο ^ Ϋ
A B 五、發明説明(ll ) 表2 比較實例1 比較實例2 比例3 比較實例4 比較例實5 外 層 雙軸取向的 雙軸取向的 燹軸取向的 雙軸取向的 雙軸取向的 PET NY PP PET NY 密度(Woo3) 0.925 0.975 0.915 聚乙烯 40 75 70 聚苯乙烯 35 15 20 中間層 苯乙烯-丁二 烯^乙烯 10 苯乙烯-異戊 二烯-苯乙烯 25 10 黏合層 熱塑膠樹脂 pvc類 Acryi ie 類 PHTSS EVA類 傅導性粉末 Sn〇2 1100 ZnO? 6 Surfactant 1 註:PET:聚對苯二甲酸乙二醇Bg. PP:聚丙烯, ΝΎ:尼龍, EVA:乙烯-乙酸乙嫌酷共聚物 PVC:聚氛乙烯· Sn02:氣化錫.
Ti07:氧化敎, ZnO :氣化鋅 層的厚度:外層中間層=50以m, 黏合層=2 wm 中間層各组成之數宇指全部三種组成每1。〇重置组成的重置組成。 傳導性粉末之數宇係指加入黏合層熱_樹脂1 0 0重ft组成中該粉末的重量组成。 (請先閲讀背面之注意事項再場寫本頁) 裝· .11‘ 經濟部中央標準局員工消費合作社印製 13 - 本紙張尺度適用中國國家標準(CNS)甲4规格(210 X 297公釐) 五、發明説明(12) Λ 6η 6 表3 實例1 mm 實和 nm 實術 iHWra 起賊 S5 59 40 54 60 40lC-«».30^ 56 45 30 50 50 601C. 60 53 42 60 65 紙 €心 S8 52 45 62 60 mt 無 無 無 無 無 總射比(*>(抵心) 82.0 72.2 85-2 69.5 81-5 獻機轉 黏部摊 黏絲據 黏合剝離 黏合剝離 黏部攤 黏合靥之表面隨2/口) 107 10* 103 103 10* 衡SSH比(*) 85.0 71-5 85-2 69.7 81.2 註:_合條件:1401C, 1公斤/平方公分.1秒,封合寬度=1毫米Χ2H9Sm¥· 1801C, lajeta^: 300*}^/^ 樣品數:3 (請先閲讀背面之注意事項再填寫本頁) 裝- 訂_ 線· 經濟部中央標準局员工消费合作社印製 本紙JS·尺度边用中a國家«準(CNS)甲4規格(210X297公龙) -14 - 五、發明説明(33) Λ 6 U 6 表4· 比tar例1 比紋例2 ί±β«例3 fcfci*你 i±«WM5 起始值 40 50 30 80 55 40^-90*.3(^ 25 52 15 13 54 60t:. 45 58 帶扯裂 175 58 棍心 46 56 雛裂 168 13 黏著 無 無 無 有 有 «比(*)(幅心 > 25.0 85.0 86.4 78-0 40.8 条獅之機轉 黏合剝SS 黏細離 界面剝離 界面麵 黏部搬 黏合層之表面阻力(2/口) 106 10U 10。 10J5 10“ 绝光透射比(*) 27.3 85.3 86-6 83-5 84-3 註:熱封合接件:1 4 01:,1公斤/平方公分.1秒.封合寛度=1著米X 2 msm^· i8〇t, «sets: 3〇〇«^κ^· 樣品數:3 (請先閲讀背面之注意事項再填寫本頁) 裝· 線· 經濟部中央標準局β工消费合作杜印製 本紙張尺度通用中a Β家標準(CNS)甲4規格(21〇x2(J7公犮) -15 - 五、發明説明 (14) Λ 6 Π 6 表5 實例6 實例7 寅例8 實例9 實例10 ㈣值 53 55 53 50 48 4〇lC-9〇*,30^ 55 55 49 47 45 60*0. 歡(·部 56 59 57 53 43 55 57 57 50 47 黏著 無 無 無 無 無 總光透射_ (棍心> 84.5 84.2 75.3 70-0 65-2 亲_之機轉 黏合剝雄 黏合剝離 黏雜離 黏合f鹏 黏合剝離 黏合層之表面®Λ(Ω/口) 10° 103 107 10* 10β 绝光透射比(*) 85-5 85.2 77-1 70.5 65.5 註:熱封合烧件:14〇·ϋ, 1公斤/平方公分,1秒,封合寬度=1¾米Χ2 麵麟:1 8 01C, ΜβΙϋ* : 3 0 分«S 數:3 (請先閲讀背面之注意事項再填寫本頁) 裝- 訂' 線. 經濟部中央標準局貝工消费合作社印Μ 本紙張尺度边用中a S家《準(CNS)甲4規格(210 Χ297公没) 16 - 經濟部屮央標準局员工消#合作社印製 五、發明説明(15) 前述實施例與比較中有三特點,即黏合層接受反靜電 處理,降低電子零件在運送時及剝離蓋覆帶時與載帶磨擦 産生之靜電力,及反靜電效果穩定不受使用情況及時間影 響且不影響蓋覆帶之封合性質,另一特點在剝離強度可設 定於所要之1◦一12◦克/毫米的範圍内,即由组合中 間層之内聚強度及載帶黏合層之黏合強度而加以設定,另 一持點在剝離強度由蓋覆帶内之中間層的内聚強度決定, 不受載帶與黏合層之間的封合條件影響,本發明蓋覆帶可 解決傳统蓋覆帶的問題,即剝離強度受封合條件,儲存時 間,儲存條件的影饗,及電子零件在蓋覆帶剝離時因磨擦 産生靜電之問題,故本發明之蓋覆帶的剝離強度穩定。 Λ () Π 6 (請先閲讀背面之注意事項再蜞窝本頁) 本紙張尺度边用中a Η家«準(CNS)TM規格(210x297公犮) 17 -

Claims (1)

  1. (tit^ti甘uf龙宰 fs>«*^IM^#?j ..……t».........._·……........U.............................. ............... ................................:~ ° M¥ 码翦2:®蔟璲县苜‘嗡莲驿酴龄2塞一龄二β暂一龄2去 笹邾*2去一料二丄一斜<2袭蓄軍%〇2 — 0 (3)谷齡2 遙?Τ軎堇%OS-g (q) ‘坳遙驿斟2翱翡一龄2胡斟 2翱鼸3土竹鹆軎重%〇 ΐ琴斟2翱弱一斟·2¾呦导莲斟 2明邾12莲氺蜀钇;/基26 ·0—ΐ6 ·0^舉目鍪動 一布丟S軎蓽%26 — SS (Β)琴^M^Si邾蓮坳魯閭 Φ : 土竹鹆a/WHOerO ΐ哿別墨里拏齒导碟忍‘鹆辟 軎蓽〇◦◦ ‘t — 〇TYfli^&褂籲ϋ璲?:鹆辟軎重οοτ 每霪导碟谢軎本纷斟鮝尉:呦导取茸鹆‘則褂 围蓬绝勛褂呦谨沣齡2麵齦一邾2 ‘則褂龄2鹙莲‘戢斟 * 呦导取茸筚‘呦°取斜阜耷幼鹆凿跑‘ ^q>鸾‘撻取篁‘ 辮锭鹆辟本槐科紫·湞‘勛"gi·藤璲名由茸沾本纷科 象尉畢赳碟紫鹆辟茸‘霤咢碟苕‘鹅fi|羽發迎 省本耷斟暴_癱膊錕崔巽名蛊讅诚导挥5 脚莲一 沏霤阗由‘難a鹆邾2莲‘國莲畢鹆‘w緙回鼬磊一缈 魯仏逛襯_茸‘勃鑫士蠆鹿w習明玆但链劉閻革一草 w嶽練‘蛊譁鱷藤城导挥璲羿‘魯碟一迓翦阖ψ— ‘螯仏 一琴舀‘嶽崔饔胡勒蠢士m頡η習議冯本財爵一 · 1: 31躋訌Ζ由Ζ8圃舀 本HI刹圍踽「法轚襞由萆由 峯靡由1¾童骚Ϊ06乙0108第 扔 φ、¥ ?6th.Tt私令办iif?x;Bl故古羿¥+淞枘荈 LQ LO L9 iV G<f a i7 -z - (#*^Z62X〇I2)ii®EU(SWD)^#SBB+ {1卞鉍^甘^耸菩^>埂姓^31^'?) 胡妨蠢士習讅玛3齒ΐ第圍缠雎輋襞由氓·△ °止过筚〃S锭萆®霪导碟Ψ茸‘鎢崔蒡 明#鑫士m鹿w晋箬冯^逾τ蚩圍91脉象襞由氓· 9 °«00ΐ— 9锭豸富衝係φ茸‘蛊S荽 ^劫鑫士 a舔w習洚舀?:氐ΐ第圍缠秘童製由埘· s°TY(im% ο τ 锭羽搏羁采Wik?:翦导碟φ茸‘鎢崔甕 3劫蠢士惠頡w習溃冯明唐丨第圍躂脉象羁由氓·ΐ7 ° ^: 0 2 I - 0 I 萆篡导挥米》每锭萆賻莲w明餾盥Ψ嶽銎饔出茸‘蛊崔饔 2:妨鑫士 ΕΡΗ習洚玛=氐2蚩圍蹿脉童綢由埘·ε °萆蒔莲璺阖Φ錕逛饔诚¥豸 蒔导碟朗盥=浬華导挥嶽灘¥蠆导聘蛊S甕φ茸‘蛊崔饔 3劫鑫士蠆恧Η習逋玛胡铤1第圍鵾陆象襞_氓·2 ®^k-會辟 φ、V LQ LD ia Z.V ,c-J αΓΟ1
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SG43744A1 (en) 1997-11-14
KR920016572A (ko) 1992-09-25
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