SG43744A1 - Cover tape for packaging chip type electronic parts - Google Patents

Cover tape for packaging chip type electronic parts

Info

Publication number
SG43744A1
SG43744A1 SG1996000460A SG1996000460A SG43744A1 SG 43744 A1 SG43744 A1 SG 43744A1 SG 1996000460 A SG1996000460 A SG 1996000460A SG 1996000460 A SG1996000460 A SG 1996000460A SG 43744 A1 SG43744 A1 SG 43744A1
Authority
SG
Singapore
Prior art keywords
electronic parts
type electronic
cover tape
chip type
packaging chip
Prior art date
Application number
SG1996000460A
Other languages
English (en)
Inventor
Tomoharu Miyamoto
Shigeru Maeda
Original Assignee
Sumitomo Bakelite Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Bakelite Co filed Critical Sumitomo Bakelite Co
Publication of SG43744A1 publication Critical patent/SG43744A1/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/29—Laminated material
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
    • C09J7/24—Plastics; Metallised plastics based on macromolecular compounds obtained by reactions involving only carbon-to-carbon unsaturated bonds
    • C09J7/241—Polyolefin, e.g.rubber
    • C09J7/243—Ethylene or propylene polymers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/35—Heat-activated
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/0084—Containers and magazines for components, e.g. tube-like magazines
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/10—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet
    • C09J2301/16—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the structure of the carrier layer
    • C09J2301/162—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the structure of the carrier layer the carrier being a laminate constituted by plastic layers only
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2423/00—Presence of polyolefin
    • C09J2423/006—Presence of polyolefin in the substrate
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S428/00—Stock material or miscellaneous articles
    • Y10S428/922—Static electricity metal bleed-off metallic stock
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/25—Web or sheet containing structurally defined element or component and including a second component containing structurally defined particles
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/25—Web or sheet containing structurally defined element or component and including a second component containing structurally defined particles
    • Y10T428/256—Heavy metal or aluminum or compound thereof
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/25—Web or sheet containing structurally defined element or component and including a second component containing structurally defined particles
    • Y10T428/256—Heavy metal or aluminum or compound thereof
    • Y10T428/257—Iron oxide or aluminum oxide
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
    • Y10T428/2813—Heat or solvent activated or sealable
    • Y10T428/2817—Heat sealable
    • Y10T428/2826—Synthetic resin or polymer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
    • Y10T428/2848—Three or more layers
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
    • Y10T428/2852—Adhesive compositions
    • Y10T428/2878—Adhesive compositions including addition polymer from unsaturated monomer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
    • Y10T428/2852—Adhesive compositions
    • Y10T428/2878—Adhesive compositions including addition polymer from unsaturated monomer
    • Y10T428/2891—Adhesive compositions including addition polymer from unsaturated monomer including addition polymer from alpha-beta unsaturated carboxylic acid [e.g., acrylic acid, methacrylic acid, etc.] Or derivative thereof
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
    • Y10T428/2852—Adhesive compositions
    • Y10T428/2896—Adhesive compositions including nitrogen containing condensation polymer [e.g., polyurethane, polyisocyanate, etc.]

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Laminated Bodies (AREA)
  • Packages (AREA)
  • Packaging Frangible Articles (AREA)
SG1996000460A 1991-02-28 1991-10-29 Cover tape for packaging chip type electronic parts SG43744A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11709091 1991-02-28

Publications (1)

Publication Number Publication Date
SG43744A1 true SG43744A1 (en) 1997-11-14

Family

ID=14703150

Family Applications (1)

Application Number Title Priority Date Filing Date
SG1996000460A SG43744A1 (en) 1991-02-28 1991-10-29 Cover tape for packaging chip type electronic parts

Country Status (7)

Country Link
US (1) US5208103A (zh)
EP (1) EP0501068B1 (zh)
KR (1) KR940011833B1 (zh)
DE (1) DE69117730T2 (zh)
MY (1) MY107463A (zh)
SG (1) SG43744A1 (zh)
TW (1) TW203624B (zh)

Families Citing this family (48)

* Cited by examiner, † Cited by third party
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US5346765A (en) * 1990-02-06 1994-09-13 Sumitono Bakelite Company Limited Cover tape for packaging chip type electronic parts
IT1255632B (it) * 1992-05-22 1995-11-09 Snam Spa Nastro per rinforzare corpi cavi adatti a sopportare pressioni e procedimento per la riparazione di tubazioni deteriorate
US5441809A (en) * 1993-10-28 1995-08-15 Brady U.S.A., Inc. Dissipative cover tape surface mount device packaging
TW339840U (en) * 1993-12-22 1998-09-01 Lintec Corp Coating applicator
US5447784A (en) * 1994-06-01 1995-09-05 Rexham Industries Corp. Electrostatic dissipating cover tape
US5631311A (en) * 1994-08-18 1997-05-20 E. I. Du Pont De Nemours And Company Transparent static dissipative formulations for coatings
US5491013A (en) * 1994-08-31 1996-02-13 Rexam Industries Corp. Static-dissipating adhesive tape
US5759462A (en) * 1994-10-14 1998-06-02 Amoco Corporaiton Electrically conductive tapes and process
JPH08295001A (ja) * 1995-04-27 1996-11-12 Dainippon Printing Co Ltd 蓋材とキャリアテープおよびこれらを用いたテーピング
US5846621A (en) * 1995-09-15 1998-12-08 Minnesota Mining And Manufacturing Company Component carrier tape having static dissipative properties
US5599621A (en) * 1995-09-29 1997-02-04 Brady Precision Tape Co. Cover tape for surface mount device packaging
US5670254A (en) * 1995-09-29 1997-09-23 Brady Precision Tape Co. Cover tape for surface mount device packaging
EP0862602B1 (en) * 1995-11-22 1999-09-01 Sumitomo Bakelite Company Limited Cover tape for packaging electronic components
US5811184A (en) * 1996-06-04 1998-09-22 Hughes Electronics Corporation Double-faced adhesive film particle getter
US6030692A (en) * 1996-09-13 2000-02-29 Netpco Incorporated Cover tape for formed tape packing system and process for making same
US5726283A (en) * 1997-01-03 1998-03-10 Far Eastern Textile, Ltd. Conductive polyester sheet
US6027802A (en) * 1997-10-23 2000-02-22 Four Piliars Enterprise Co., Ltd. Cover tape for packaging
JPH11165762A (ja) * 1997-12-01 1999-06-22 Lintec Corp チップ体搬送用カバーテープおよび封止構造体
US6529379B1 (en) 1998-10-13 2003-03-04 International Business Machines Corporation Article exhibiting enhanced adhesion between a dielectric substrate and heat spreader and method
WO2001015897A1 (en) * 1999-08-31 2001-03-08 Denki Kagaku Kogyo Kabushiki Kaisha Transparent heat-sealing film
WO2001040079A1 (fr) * 1999-11-29 2001-06-07 Denki Kagaku Kogyo Kabushiki Kaisha Recipient d'emballage pour piece electronique
KR100768280B1 (ko) * 2000-04-03 2007-10-17 다이니폰 인사츠 가부시키가이샤 투명 도전성 히트 실링재 및 이를 이용한 캐리어 테이프커버체
DE60124405T2 (de) * 2000-07-14 2007-02-22 Nitto Denko Corp., Ibaraki Reinigungsblatt, förderelement dafür und reinigungsverfahren für substrat-bearbeitungsvorrichtungen in dem diese verwendet werden
US6540086B1 (en) * 2000-10-13 2003-04-01 Peak International Ltd. Protective cover tape having a foam layer
ATE336371T1 (de) * 2001-06-26 2006-09-15 Sumitomo Bakelite Co Abdeckstreifen zum verpacken von elektronischen bauteilen
SG115510A1 (en) * 2001-12-20 2005-10-28 Nitto Denko Corp Cover tape for the electronic part conveyance, process for its production and electronic part conveying member
US7108899B2 (en) * 2002-09-11 2006-09-19 Entegris, Inc. Chip tray with tacky surface
US6926937B2 (en) * 2002-09-11 2005-08-09 Entegris, Inc. Matrix tray with tacky surfaces
US20050260380A1 (en) * 2004-05-20 2005-11-24 Moon Richard C Tuftable carpet backings and carpets with enhanced tuft holding properties
FR2872788B1 (fr) * 2004-07-09 2007-09-07 Alsacienne D Aluminium Sa Soc Emballage comprenant un recipient en matiere plastique obture par un opercule pelable thermoscellee audit recipient
KR100614449B1 (ko) * 2005-03-11 2006-08-22 율촌화학 주식회사 전자부품 포장용 커버 테이프 및 그 제조방법
US20070014956A1 (en) * 2005-07-14 2007-01-18 Mccarthy Dillon P Adhesive tape device
US20080041524A1 (en) * 2005-07-14 2008-02-21 Mccarthy Dillon P Adhesive tape device
US20070062844A1 (en) * 2005-09-16 2007-03-22 Velasquez Urey Ruben E Cover tape and method for manufacture
US8247057B2 (en) * 2005-09-16 2012-08-21 3M Innovative Properties Company Cover tape and method for manufacture
US20070155949A1 (en) * 2005-12-30 2007-07-05 Saint-Gobain Performance Plastics Corporation Thermally stable composite material
US20070152195A1 (en) * 2005-12-30 2007-07-05 Saint-Gobain Performance Plastics Corporation Electrostatic dissipative composite material
US20070154716A1 (en) * 2005-12-30 2007-07-05 Saint-Gobain Performance Plastics Corporation Composite material
US20070154717A1 (en) * 2005-12-30 2007-07-05 Saint-Gobain Performance Plastics Corporation Thermally stable composite material
US20070178790A1 (en) * 2006-01-31 2007-08-02 Propex Fabrics Inc. Secondary carpet backing and buckling resistant carpet made therefrom
JP5020563B2 (ja) * 2006-08-02 2012-09-05 日東電工株式会社 吸着フィルムの製造方法、および離型フィルム付き吸着フィルムの製造方法
US7476339B2 (en) * 2006-08-18 2009-01-13 Saint-Gobain Ceramics & Plastics, Inc. Highly filled thermoplastic composites
MY151527A (en) 2007-04-11 2014-05-30 Sumitomo Bakelite Co Packaged article containing electronic device
US8584859B2 (en) * 2009-07-22 2013-11-19 Sumitomo Bakelite Co., Ltd Cover tape for packaging electronic part and electronic part package
EP2492089A1 (de) 2011-02-25 2012-08-29 Amcor Flexibles Singen GmbH Verbundfolie
JP2014513013A (ja) * 2011-03-04 2014-05-29 スリーエム イノベイティブ プロパティズ カンパニー カバーテープ、コンポーネントパッケージ、及びこれらを作製する方法
KR101584845B1 (ko) 2011-11-14 2016-01-14 주식회사 엘지화학 접착 필름
WO2013095522A1 (en) * 2011-12-22 2013-06-27 Intel Corporation Electrostatic discharge compatible dicing tape with laser scribe capability

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US4343855A (en) * 1978-10-30 1982-08-10 Minnesota Mining And Manufacturing Company Transfer film
DK169553B1 (da) * 1979-08-08 1994-11-28 Ucb Sa Varmforseglelig emballeringsfilm, fremgangsmåde til dens fremstilling samt emballager deraf
US4384024A (en) * 1981-03-19 1983-05-17 Imperial Chemical Industries Limited Composite heat-sealable films
CA1222071A (en) * 1984-01-30 1987-05-19 Joseph A. Aurichio Conductive die attach tape
US4648508A (en) * 1985-06-19 1987-03-10 Robert A. Neal Flexible envelope for electronic component packaging
US4699830A (en) * 1986-06-30 1987-10-13 Baxter Travenol Laboratories, Inc. Laminated sheet material for packaging electronic components
FR2605326A1 (fr) * 1986-10-20 1988-04-22 Rhone Poulenc Multi Tech Composition potentiellement adhesive electriquement conductrice.
DE3850451T2 (de) * 1987-07-08 1995-03-09 Furukawa Electric Co Ltd Strahlungsvernetzbare Klebestreifen.
MY103125A (en) * 1987-07-24 1993-04-30 Lintec Corp Cover tape for sealing chip-holding parts of carrier tape
GB2219756A (en) * 1988-05-31 1989-12-20 Daimatsu Kagaku Kogyo Kk Adhesive material
JPH024670A (ja) * 1988-06-13 1990-01-09 Nec Corp エンボス包装用カバーテープ
JPH0257576A (ja) * 1988-08-12 1990-02-27 Minnesota Mining & Mfg Co <3M> 電子部品収納用テープ
EP0372728A3 (en) * 1988-12-07 1991-11-21 Minnesota Mining And Manufacturing Company Smoothly removable cover tape for electronic component carrier
US4956232A (en) * 1988-12-27 1990-09-11 Mobil Oil Corporation Multi-layer heat-sealable polypropylene films

Also Published As

Publication number Publication date
US5208103A (en) 1993-05-04
DE69117730T2 (de) 1996-07-18
MY107463A (en) 1995-12-30
KR940011833B1 (ko) 1994-12-26
TW203624B (zh) 1993-04-11
DE69117730D1 (de) 1996-04-11
EP0501068B1 (en) 1996-03-06
EP0501068A1 (en) 1992-09-02
KR920016572A (ko) 1992-09-25

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