TW202520358A - 基板處理方法、及基板處理裝置 - Google Patents

基板處理方法、及基板處理裝置 Download PDF

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Publication number
TW202520358A
TW202520358A TW114102132A TW114102132A TW202520358A TW 202520358 A TW202520358 A TW 202520358A TW 114102132 A TW114102132 A TW 114102132A TW 114102132 A TW114102132 A TW 114102132A TW 202520358 A TW202520358 A TW 202520358A
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TW
Taiwan
Prior art keywords
processing
unit
aforementioned
monitoring
condition
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TW114102132A
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English (en)
Chinese (zh)
Inventor
桾本裕一朗
濱田佳志
羽山史
岡田基
濱口翔喜
Original Assignee
日商東京威力科創股份有限公司
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Publication of TW202520358A publication Critical patent/TW202520358A/zh

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
    • B05C11/10—Storage, supply or control of liquid or other fluent material; Recovery of excess liquid or other fluent material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D1/00—Processes for applying liquids or other fluent materials
    • B05D1/40—Distributing applied liquids or other fluent materials by members moving relatively to surface
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D3/00—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D3/00—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
    • B05D3/002—Pretreatement
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D3/00—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
    • B05D3/02—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by baking
    • B05D3/0254—After-treatment
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/16—Coating processes; Apparatus therefor
    • G03F7/162—Coating on a rotating support, e.g. using a whirler or a spinner
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/30—Imagewise removal using liquid means
    • G03F7/3021—Imagewise removal using liquid means from a wafer supported on a rotating chuck
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/0002—Inspection of images, e.g. flaw detection
    • G06T7/0004—Industrial image inspection
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/60—Control of cameras or camera modules
    • H04N23/69—Control of means for changing angle of the field of view, e.g. optical zoom objectives or electronic zooming
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/80—Camera processing pipelines; Components thereof
    • H04N23/815—Camera processing pipelines; Components thereof for controlling the resolution by using a single image
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N5/00—Details of television systems
    • H04N5/76—Television signal recording
    • H04N5/91—Television signal processing therefor
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N7/00—Television systems
    • H04N7/18—Closed-circuit television [CCTV] systems, i.e. systems in which the video signal is not broadcast
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N7/00—Television systems
    • H04N7/18—Closed-circuit television [CCTV] systems, i.e. systems in which the video signal is not broadcast
    • H04N7/183—Closed-circuit television [CCTV] systems, i.e. systems in which the video signal is not broadcast for receiving images from a single remote source
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P76/00—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00—Indexing scheme for image analysis or image enhancement
    • G06T2207/30—Subject of image; Context of image processing
    • G06T2207/30108—Industrial image inspection
    • G06T2207/30148—Semiconductor; IC; Wafer

Landscapes

  • Engineering & Computer Science (AREA)
  • Multimedia (AREA)
  • Signal Processing (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Quality & Reliability (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Theoretical Computer Science (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Coating Apparatus (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
TW114102132A 2019-11-15 2020-11-05 基板處理方法、及基板處理裝置 TW202520358A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2019206954 2019-11-15
JP2019-206954 2019-11-15

Publications (1)

Publication Number Publication Date
TW202520358A true TW202520358A (zh) 2025-05-16

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Family Applications (2)

Application Number Title Priority Date Filing Date
TW114102132A TW202520358A (zh) 2019-11-15 2020-11-05 基板處理方法、及基板處理裝置
TW109138558A TWI873216B (zh) 2019-11-15 2020-11-05 監視裝置、基板處理裝置、監視方法、及記憶媒體

Family Applications After (1)

Application Number Title Priority Date Filing Date
TW109138558A TWI873216B (zh) 2019-11-15 2020-11-05 監視裝置、基板處理裝置、監視方法、及記憶媒體

Country Status (6)

Country Link
US (1) US12244972B2 (https=)
JP (2) JP7309896B2 (https=)
KR (2) KR102783425B1 (https=)
CN (1) CN114667592B (https=)
TW (2) TW202520358A (https=)
WO (1) WO2021095612A1 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7443163B2 (ja) * 2020-05-27 2024-03-05 株式会社Ｓｃｒｅｅｎホールディングス 基板処理方法および基板処理装置
JP7793427B2 (ja) * 2022-03-01 2026-01-05 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置及び基板処理システム並びに基板処理方法

Family Cites Families (24)

* Cited by examiner, † Cited by third party
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JP4408720B2 (ja) * 2003-03-03 2010-02-03 富士フイルム株式会社 放射線撮影システムの検査方法及びそれを用いた医用画像処理装置
JP2005073218A (ja) 2003-08-07 2005-03-17 Matsushita Electric Ind Co Ltd 画像処理装置
JP2007289901A (ja) * 2006-04-27 2007-11-08 Fuji Mach Mfg Co Ltd 塗布方法及び検査機能付き塗布装置
JP5045218B2 (ja) * 2006-10-25 2012-10-10 東京エレクトロン株式会社 液処理装置、液処理方法及び記憶媒体
JP2009032830A (ja) * 2007-07-25 2009-02-12 Dainippon Screen Mfg Co Ltd 基板検出装置および基板処理装置
JP2009172966A (ja) * 2008-01-28 2009-08-06 Fujifilm Corp 画像出力装置及び異常検出方法
WO2012169423A1 (ja) * 2011-06-07 2012-12-13 シャープ株式会社 パターン検査装置およびパターン検査方法
JP2013183493A (ja) * 2012-02-29 2013-09-12 Aisin Aw Co Ltd コイルの製造方法
JP5497144B2 (ja) * 2012-03-07 2014-05-21 東京エレクトロン株式会社 半導体製造装置のプロセス監視装置及び半導体製造装置のプロセス監方法並びに半導体製造装置
JP2015153903A (ja) 2014-02-14 2015-08-24 東京エレクトロン株式会社 液処理方法、基板処理装置、及びコンピュータ読み取り可能な記録媒体
JP6251086B2 (ja) * 2014-03-12 2017-12-20 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置および基板処理方法
US20150262848A1 (en) * 2014-03-11 2015-09-17 SCREEN Holdings Co., Ltd. Substrate processing apparatus and substrate processing method for discharge of processing liquid from nozzle
JP6423672B2 (ja) * 2014-09-26 2018-11-14 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置および基板処理方法
US10192128B2 (en) 2015-03-27 2019-01-29 Nec Corporation Mobile surveillance apparatus, program, and control method
KR101714627B1 (ko) * 2015-04-17 2017-03-23 성안기계 (주) 슬롯 다이 코팅 장치
JP6473047B2 (ja) * 2015-05-26 2019-02-20 株式会社Ｓｃｒｅｅｎホールディングス 検査装置および基板処理装置
US9589820B2 (en) * 2015-05-29 2017-03-07 Taiwan Semiconductor Manufacturing Co., Ltd. Semiconductor apparatus and adjustment method
CN106412388A (zh) * 2015-07-27 2017-02-15 恩逼真股份有限公司 光路改变单元、模块和方法及检测半导体基板的装置
KR101578765B1 (ko) * 2015-09-24 2015-12-18 성안기계 주식회사 슬롯 다이 코팅 장치 및 그 제어 방법
CN108701392A (zh) 2016-02-26 2018-10-23 艾奥姆尼森特私人有限公司 用于执行监视的方法和装置
JP6562864B2 (ja) * 2016-03-30 2019-08-21 東京エレクトロン株式会社 基板処理装置及び基板処理装置の調整方法
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JP6932597B2 (ja) * 2017-09-25 2021-09-08 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置および基板処理方法
US11923220B2 (en) 2018-01-26 2024-03-05 Tokyo Electron Limited Substrate processing apparatus

Also Published As

Publication number Publication date
US12244972B2 (en) 2025-03-04
TW202131390A (zh) 2021-08-16
KR102783425B1 (ko) 2025-03-17
CN114667592A (zh) 2022-06-24
JP2023118878A (ja) 2023-08-25
JP7309896B2 (ja) 2023-07-18
JP7727686B2 (ja) 2025-08-21
KR20250042195A (ko) 2025-03-26
JPWO2021095612A1 (https=) 2021-05-20
KR20220100614A (ko) 2022-07-15
CN114667592B (zh) 2025-06-03
TWI873216B (zh) 2025-02-21
WO2021095612A1 (ja) 2021-05-20
US20220400232A1 (en) 2022-12-15

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