KR102783425B1 - 감시 장치, 기판 처리 장치, 감시 방법 및 기억 매체 - Google Patents

감시 장치, 기판 처리 장치, 감시 방법 및 기억 매체 Download PDF

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Publication number
KR102783425B1
KR102783425B1 KR1020227019016A KR20227019016A KR102783425B1 KR 102783425 B1 KR102783425 B1 KR 102783425B1 KR 1020227019016 A KR1020227019016 A KR 1020227019016A KR 20227019016 A KR20227019016 A KR 20227019016A KR 102783425 B1 KR102783425 B1 KR 102783425B1
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South Korea
Prior art keywords
processing
unit
moving image
image data
monitoring
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Korean (ko)
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KR20220100614A (ko
Inventor
요이치로 구누기모토
게이시 하마다
다카후미 하야마
모토이 오카다
쇼키 하마구치
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도쿄엘렉트론가부시키가이샤
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Priority to KR1020257008341A priority Critical patent/KR20250042195A/ko
Publication of KR20220100614A publication Critical patent/KR20220100614A/ko
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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
    • B05C11/10—Storage, supply or control of liquid or other fluent material; Recovery of excess liquid or other fluent material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D1/00—Processes for applying liquids or other fluent materials
    • B05D1/40—Distributing applied liquids or other fluent materials by members moving relatively to surface
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D3/00—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D3/00—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
    • B05D3/002—Pretreatement
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D3/00—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
    • B05D3/02—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by baking
    • B05D3/0254—After-treatment
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/16—Coating processes; Apparatus therefor
    • G03F7/162—Coating on a rotating support, e.g. using a whirler or a spinner
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/30—Imagewise removal using liquid means
    • G03F7/3021—Imagewise removal using liquid means from a wafer supported on a rotating chuck
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/0002—Inspection of images, e.g. flaw detection
    • G06T7/0004—Industrial image inspection
    • H01L21/027—
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/60—Control of cameras or camera modules
    • H04N23/69—Control of means for changing angle of the field of view, e.g. optical zoom objectives or electronic zooming
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/80—Camera processing pipelines; Components thereof
    • H04N23/815—Camera processing pipelines; Components thereof for controlling the resolution by using a single image
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N5/00—Details of television systems
    • H04N5/76—Television signal recording
    • H04N5/91—Television signal processing therefor
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N7/00—Television systems
    • H04N7/18—Closed-circuit television [CCTV] systems, i.e. systems in which the video signal is not broadcast
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N7/00—Television systems
    • H04N7/18—Closed-circuit television [CCTV] systems, i.e. systems in which the video signal is not broadcast
    • H04N7/183—Closed-circuit television [CCTV] systems, i.e. systems in which the video signal is not broadcast for receiving images from a single remote source
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P76/00—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00—Indexing scheme for image analysis or image enhancement
    • G06T2207/30—Subject of image; Context of image processing
    • G06T2207/30108—Industrial image inspection
    • G06T2207/30148—Semiconductor; IC; Wafer

Landscapes

  • Engineering & Computer Science (AREA)
  • Multimedia (AREA)
  • Signal Processing (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Quality & Reliability (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Theoretical Computer Science (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Coating Apparatus (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
KR1020227019016A 2019-11-15 2020-11-04 감시 장치, 기판 처리 장치, 감시 방법 및 기억 매체 Active KR102783425B1 (ko)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1020257008341A KR20250042195A (ko) 2019-11-15 2020-11-04 기판 처리 방법 및 기판 처리 장치

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JPJP-P-2019-206954 2019-11-15
JP2019206954 2019-11-15
PCT/JP2020/041253 WO2021095612A1 (ja) 2019-11-15 2020-11-04 監視装置、基板処理装置、監視方法、及び記憶媒体

Related Child Applications (1)

Application Number Title Priority Date Filing Date
KR1020257008341A Division KR20250042195A (ko) 2019-11-15 2020-11-04 기판 처리 방법 및 기판 처리 장치

Publications (2)

Publication Number Publication Date
KR20220100614A KR20220100614A (ko) 2022-07-15
KR102783425B1 true KR102783425B1 (ko) 2025-03-17

Family

ID=75912871

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KR1020227019016A Active KR102783425B1 (ko) 2019-11-15 2020-11-04 감시 장치, 기판 처리 장치, 감시 방법 및 기억 매체
KR1020257008341A Pending KR20250042195A (ko) 2019-11-15 2020-11-04 기판 처리 방법 및 기판 처리 장치

Family Applications After (1)

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KR1020257008341A Pending KR20250042195A (ko) 2019-11-15 2020-11-04 기판 처리 방법 및 기판 처리 장치

Country Status (6)

Country Link
US (1) US12244972B2 (https=)
JP (2) JP7309896B2 (https=)
KR (2) KR102783425B1 (https=)
CN (1) CN114667592B (https=)
TW (2) TW202520358A (https=)
WO (1) WO2021095612A1 (https=)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7443163B2 (ja) * 2020-05-27 2024-03-05 株式会社Ｓｃｒｅｅｎホールディングス 基板処理方法および基板処理装置
JP7793427B2 (ja) * 2022-03-01 2026-01-05 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置及び基板処理システム並びに基板処理方法

Citations (1)

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JP2005073218A (ja) 2003-08-07 2005-03-17 Matsushita Electric Ind Co Ltd 画像処理装置
JP2007289901A (ja) * 2006-04-27 2007-11-08 Fuji Mach Mfg Co Ltd 塗布方法及び検査機能付き塗布装置
JP5045218B2 (ja) * 2006-10-25 2012-10-10 東京エレクトロン株式会社 液処理装置、液処理方法及び記憶媒体
JP2009032830A (ja) * 2007-07-25 2009-02-12 Dainippon Screen Mfg Co Ltd 基板検出装置および基板処理装置
JP2009172966A (ja) * 2008-01-28 2009-08-06 Fujifilm Corp 画像出力装置及び異常検出方法
WO2012169423A1 (ja) * 2011-06-07 2012-12-13 シャープ株式会社 パターン検査装置およびパターン検査方法
JP2013183493A (ja) * 2012-02-29 2013-09-12 Aisin Aw Co Ltd コイルの製造方法
JP5497144B2 (ja) * 2012-03-07 2014-05-21 東京エレクトロン株式会社 半導体製造装置のプロセス監視装置及び半導体製造装置のプロセス監方法並びに半導体製造装置
JP2015153903A (ja) 2014-02-14 2015-08-24 東京エレクトロン株式会社 液処理方法、基板処理装置、及びコンピュータ読み取り可能な記録媒体
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Also Published As

Publication number Publication date
US12244972B2 (en) 2025-03-04
TW202131390A (zh) 2021-08-16
CN114667592A (zh) 2022-06-24
JP2023118878A (ja) 2023-08-25
JP7309896B2 (ja) 2023-07-18
JP7727686B2 (ja) 2025-08-21
KR20250042195A (ko) 2025-03-26
JPWO2021095612A1 (https=) 2021-05-20
KR20220100614A (ko) 2022-07-15
CN114667592B (zh) 2025-06-03
TWI873216B (zh) 2025-02-21
WO2021095612A1 (ja) 2021-05-20
US20220400232A1 (en) 2022-12-15
TW202520358A (zh) 2025-05-16

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