CN114667592B - 监视装置、基板处理装置、监视方法以及存储介质 - Google Patents

监视装置、基板处理装置、监视方法以及存储介质 Download PDF

Info

Publication number
CN114667592B
CN114667592B CN202080078123.0A CN202080078123A CN114667592B CN 114667592 B CN114667592 B CN 114667592B CN 202080078123 A CN202080078123 A CN 202080078123A CN 114667592 B CN114667592 B CN 114667592B
Authority
CN
China
Prior art keywords
processing
image data
moving image
unit
monitoring
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN202080078123.0A
Other languages
English (en)
Chinese (zh)
Other versions
CN114667592A (zh
Inventor
桾本裕一朗
滨田佳志
羽山隆史
冈田基
滨口翔喜
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokyo Electron Ltd
Original Assignee
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Publication of CN114667592A publication Critical patent/CN114667592A/zh
Application granted granted Critical
Publication of CN114667592B publication Critical patent/CN114667592B/zh
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B05SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05CAPPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C11/00Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B05SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05CAPPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C11/00Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
    • B05C11/10Storage, supply or control of liquid or other fluent material; Recovery of excess liquid or other fluent material
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B05SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05DPROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D1/00Processes for applying liquids or other fluent materials
    • B05D1/40Distributing applied liquids or other fluent materials by members moving relatively to surface
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B05SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05DPROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D3/00Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B05SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05DPROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D3/00Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
    • B05D3/002Pretreatement
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B05SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05DPROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D3/00Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
    • B05D3/02Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by baking
    • B05D3/0254After-treatment
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/16Coating processes; Apparatus therefor
    • G03F7/162Coating on a rotating support, e.g. using a whirler or a spinner
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26Processing photosensitive materials; Apparatus therefor
    • G03F7/30Imagewise removal using liquid means
    • G03F7/3021Imagewise removal using liquid means from a wafer supported on a rotating chuck
    • GPHYSICS
    • G06COMPUTING OR CALCULATING; COUNTING
    • G06TIMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00Image analysis
    • G06T7/0002Inspection of images, e.g. flaw detection
    • G06T7/0004Industrial image inspection
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04NPICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/60Control of cameras or camera modules
    • H04N23/69Control of means for changing angle of the field of view, e.g. optical zoom objectives or electronic zooming
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04NPICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/80Camera processing pipelines; Components thereof
    • H04N23/815Camera processing pipelines; Components thereof for controlling the resolution by using a single image
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04NPICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N5/00Details of television systems
    • H04N5/76Television signal recording
    • H04N5/91Television signal processing therefor
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04NPICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N7/00Television systems
    • H04N7/18Closed-circuit television [CCTV] systems, i.e. systems in which the video signal is not broadcast
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04NPICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N7/00Television systems
    • H04N7/18Closed-circuit television [CCTV] systems, i.e. systems in which the video signal is not broadcast
    • H04N7/183Closed-circuit television [CCTV] systems, i.e. systems in which the video signal is not broadcast for receiving images from a single remote source
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10PGENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P76/00Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography
    • GPHYSICS
    • G06COMPUTING OR CALCULATING; COUNTING
    • G06TIMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00Indexing scheme for image analysis or image enhancement
    • G06T2207/30Subject of image; Context of image processing
    • G06T2207/30108Industrial image inspection
    • G06T2207/30148Semiconductor; IC; Wafer

Landscapes

  • Engineering & Computer Science (AREA)
  • Multimedia (AREA)
  • Signal Processing (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Quality & Reliability (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Theoretical Computer Science (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Coating Apparatus (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
CN202080078123.0A 2019-11-15 2020-11-04 监视装置、基板处理装置、监视方法以及存储介质 Active CN114667592B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2019206954 2019-11-15
JP2019-206954 2019-11-15
PCT/JP2020/041253 WO2021095612A1 (ja) 2019-11-15 2020-11-04 監視装置、基板処理装置、監視方法、及び記憶媒体

Publications (2)

Publication Number Publication Date
CN114667592A CN114667592A (zh) 2022-06-24
CN114667592B true CN114667592B (zh) 2025-06-03

Family

ID=75912871

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202080078123.0A Active CN114667592B (zh) 2019-11-15 2020-11-04 监视装置、基板处理装置、监视方法以及存储介质

Country Status (6)

Country Link
US (1) US12244972B2 (https=)
JP (2) JP7309896B2 (https=)
KR (2) KR102783425B1 (https=)
CN (1) CN114667592B (https=)
TW (2) TW202520358A (https=)
WO (1) WO2021095612A1 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7443163B2 (ja) * 2020-05-27 2024-03-05 株式会社Screenホールディングス 基板処理方法および基板処理装置
JP7793427B2 (ja) * 2022-03-01 2026-01-05 株式会社Screenホールディングス 基板処理装置及び基板処理システム並びに基板処理方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005073218A (ja) * 2003-08-07 2005-03-17 Matsushita Electric Ind Co Ltd 画像処理装置
CN104916570A (zh) * 2014-03-11 2015-09-16 斯克林集团公司 基板处理装置以及基板处理方法

Family Cites Families (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4408720B2 (ja) * 2003-03-03 2010-02-03 富士フイルム株式会社 放射線撮影システムの検査方法及びそれを用いた医用画像処理装置
JP2007289901A (ja) * 2006-04-27 2007-11-08 Fuji Mach Mfg Co Ltd 塗布方法及び検査機能付き塗布装置
JP5045218B2 (ja) * 2006-10-25 2012-10-10 東京エレクトロン株式会社 液処理装置、液処理方法及び記憶媒体
JP2009032830A (ja) * 2007-07-25 2009-02-12 Dainippon Screen Mfg Co Ltd 基板検出装置および基板処理装置
JP2009172966A (ja) * 2008-01-28 2009-08-06 Fujifilm Corp 画像出力装置及び異常検出方法
WO2012169423A1 (ja) * 2011-06-07 2012-12-13 シャープ株式会社 パターン検査装置およびパターン検査方法
JP2013183493A (ja) * 2012-02-29 2013-09-12 Aisin Aw Co Ltd コイルの製造方法
JP5497144B2 (ja) * 2012-03-07 2014-05-21 東京エレクトロン株式会社 半導体製造装置のプロセス監視装置及び半導体製造装置のプロセス監方法並びに半導体製造装置
JP2015153903A (ja) 2014-02-14 2015-08-24 東京エレクトロン株式会社 液処理方法、基板処理装置、及びコンピュータ読み取り可能な記録媒体
JP6251086B2 (ja) * 2014-03-12 2017-12-20 株式会社Screenホールディングス 基板処理装置および基板処理方法
JP6423672B2 (ja) * 2014-09-26 2018-11-14 株式会社Screenホールディングス 基板処理装置および基板処理方法
US10192128B2 (en) 2015-03-27 2019-01-29 Nec Corporation Mobile surveillance apparatus, program, and control method
KR101714627B1 (ko) * 2015-04-17 2017-03-23 성안기계 (주) 슬롯 다이 코팅 장치
JP6473047B2 (ja) * 2015-05-26 2019-02-20 株式会社Screenホールディングス 検査装置および基板処理装置
US9589820B2 (en) * 2015-05-29 2017-03-07 Taiwan Semiconductor Manufacturing Co., Ltd. Semiconductor apparatus and adjustment method
CN106412388A (zh) * 2015-07-27 2017-02-15 恩逼真股份有限公司 光路改变单元、模块和方法及检测半导体基板的装置
KR101578765B1 (ko) * 2015-09-24 2015-12-18 성안기계 주식회사 슬롯 다이 코팅 장치 및 그 제어 방법
CN108701392A (zh) 2016-02-26 2018-10-23 艾奥姆尼森特私人有限公司 用于执行监视的方法和装置
JP6562864B2 (ja) * 2016-03-30 2019-08-21 東京エレクトロン株式会社 基板処理装置及び基板処理装置の調整方法
US10784134B2 (en) * 2017-05-03 2020-09-22 Applied Materials, Inc. Image based substrate mapper
JP6932597B2 (ja) * 2017-09-25 2021-09-08 株式会社Screenホールディングス 基板処理装置および基板処理方法
US11923220B2 (en) 2018-01-26 2024-03-05 Tokyo Electron Limited Substrate processing apparatus

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005073218A (ja) * 2003-08-07 2005-03-17 Matsushita Electric Ind Co Ltd 画像処理装置
CN104916570A (zh) * 2014-03-11 2015-09-16 斯克林集团公司 基板处理装置以及基板处理方法

Also Published As

Publication number Publication date
US12244972B2 (en) 2025-03-04
TW202131390A (zh) 2021-08-16
KR102783425B1 (ko) 2025-03-17
CN114667592A (zh) 2022-06-24
JP2023118878A (ja) 2023-08-25
JP7309896B2 (ja) 2023-07-18
JP7727686B2 (ja) 2025-08-21
KR20250042195A (ko) 2025-03-26
JPWO2021095612A1 (https=) 2021-05-20
KR20220100614A (ko) 2022-07-15
TWI873216B (zh) 2025-02-21
WO2021095612A1 (ja) 2021-05-20
US20220400232A1 (en) 2022-12-15
TW202520358A (zh) 2025-05-16

Similar Documents

Publication Publication Date Title
JP7727686B2 (ja) 基板処理方法、及び基板処理装置
KR101184808B1 (ko) 액 처리 장치, 액 처리 방법 및 기억 매체
TWI649130B (zh) 基板處理裝置及基板處理方法
CN109560012B (zh) 衬底处理装置及衬底处理方法
KR102925369B1 (ko) 동작 감시 방법 및 제조 장치
KR102860793B1 (ko) 해석 방법 및 평가 방법
JP2020061417A (ja) 基板処理装置及び検査方法
JP2020061419A (ja) 基板処理装置及び検査方法
US20250240390A1 (en) Monitoring apparatus, substrate processing apparatus, monitoring method, and storage medium
JPWO2021095612A5 (https=)
US20250384544A1 (en) Monitoring method and manufacturing apparatus
CN112505035A (zh) 喷嘴内部的气液界面的检测方法及衬底处理装置
KR20240096763A (ko) 동작 감시 방법 및 제조 장치
JP2025167261A (ja) 撮像装置
JP2026002375A (ja) 基板処理装置および基板処理方法
JP2026045275A (ja) 撮像装置および基板処理装置
JP2024134148A (ja) 基板処理装置および基板処理方法

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
GR01 Patent grant
GR01 Patent grant