JPWO2021095612A1 - - Google Patents

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Publication number
JPWO2021095612A1
JPWO2021095612A1 JP2021556044A JP2021556044A JPWO2021095612A1 JP WO2021095612 A1 JPWO2021095612 A1 JP WO2021095612A1 JP 2021556044 A JP2021556044 A JP 2021556044A JP 2021556044 A JP2021556044 A JP 2021556044A JP WO2021095612 A1 JPWO2021095612 A1 JP WO2021095612A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Application number
JP2021556044A
Other languages
Japanese (ja)
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JPWO2021095612A5 (https=
JP7309896B2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Application filed filed Critical
Publication of JPWO2021095612A1 publication Critical patent/JPWO2021095612A1/ja
Publication of JPWO2021095612A5 publication Critical patent/JPWO2021095612A5/ja
Priority to JP2023110512A priority Critical patent/JP7727686B2/ja
Application granted granted Critical
Publication of JP7309896B2 publication Critical patent/JP7309896B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N7/00—Television systems
    • H04N7/18—Closed-circuit television [CCTV] systems, i.e. systems in which the video signal is not broadcast
    • H04N7/183—Closed-circuit television [CCTV] systems, i.e. systems in which the video signal is not broadcast for receiving images from a single remote source
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N5/00—Details of television systems
    • H04N5/76—Television signal recording
    • H04N5/91—Television signal processing therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
    • B05C11/10—Storage, supply or control of liquid or other fluent material; Recovery of excess liquid or other fluent material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D1/00—Processes for applying liquids or other fluent materials
    • B05D1/40—Distributing applied liquids or other fluent materials by members moving relatively to surface
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D3/00—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D3/00—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
    • B05D3/002—Pretreatement
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D3/00—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
    • B05D3/02—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by baking
    • B05D3/0254—After-treatment
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/0002—Inspection of images, e.g. flaw detection
    • G06T7/0004—Industrial image inspection
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/60—Control of cameras or camera modules
    • H04N23/69—Control of means for changing angle of the field of view, e.g. optical zoom objectives or electronic zooming
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/80—Camera processing pipelines; Components thereof
    • H04N23/815—Camera processing pipelines; Components thereof for controlling the resolution by using a single image
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N7/00—Television systems
    • H04N7/18—Closed-circuit television [CCTV] systems, i.e. systems in which the video signal is not broadcast
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P76/00—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/16—Coating processes; Apparatus therefor
    • G03F7/162—Coating on a rotating support, e.g. using a whirler or a spinner
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/30—Imagewise removal using liquid means
    • G03F7/3021—Imagewise removal using liquid means from a wafer supported on a rotating chuck
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00—Indexing scheme for image analysis or image enhancement
    • G06T2207/30—Subject of image; Context of image processing
    • G06T2207/30108—Industrial image inspection
    • G06T2207/30148—Semiconductor; IC; Wafer

Landscapes

  • Engineering & Computer Science (AREA)
  • Multimedia (AREA)
  • Signal Processing (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Quality & Reliability (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Theoretical Computer Science (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Coating Apparatus (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
JP2021556044A 2019-11-15 2020-11-04 監視装置、基板処理装置、監視方法、及び記憶媒体 Active JP7309896B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2023110512A JP7727686B2 (ja) 2019-11-15 2023-07-05 基板処理方法、及び基板処理装置

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2019206954 2019-11-15
JP2019206954 2019-11-15
PCT/JP2020/041253 WO2021095612A1 (ja) 2019-11-15 2020-11-04 監視装置、基板処理装置、監視方法、及び記憶媒体

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2023110512A Division JP7727686B2 (ja) 2019-11-15 2023-07-05 基板処理方法、及び基板処理装置

Publications (3)

Publication Number Publication Date
JPWO2021095612A1 true JPWO2021095612A1 (https=) 2021-05-20
JPWO2021095612A5 JPWO2021095612A5 (https=) 2022-07-14
JP7309896B2 JP7309896B2 (ja) 2023-07-18

Family

ID=75912871

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2021556044A Active JP7309896B2 (ja) 2019-11-15 2020-11-04 監視装置、基板処理装置、監視方法、及び記憶媒体
JP2023110512A Active JP7727686B2 (ja) 2019-11-15 2023-07-05 基板処理方法、及び基板処理装置

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2023110512A Active JP7727686B2 (ja) 2019-11-15 2023-07-05 基板処理方法、及び基板処理装置

Country Status (6)

Country Link
US (1) US12244972B2 (https=)
JP (2) JP7309896B2 (https=)
KR (2) KR102783425B1 (https=)
CN (1) CN114667592B (https=)
TW (2) TW202520358A (https=)
WO (1) WO2021095612A1 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7443163B2 (ja) * 2020-05-27 2024-03-05 株式会社Ｓｃｒｅｅｎホールディングス 基板処理方法および基板処理装置
JP7793427B2 (ja) * 2022-03-01 2026-01-05 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置及び基板処理システム並びに基板処理方法

Citations (5)

* Cited by examiner, † Cited by third party
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JP2007289901A (ja) * 2006-04-27 2007-11-08 Fuji Mach Mfg Co Ltd 塗布方法及び検査機能付き塗布装置
JP2013214279A (ja) * 2012-03-07 2013-10-17 Tokyo Electron Ltd 半導体製造装置のプロセス監視装置及び半導体製造装置のプロセス監方法並びに半導体製造装置
JP2016072282A (ja) * 2014-09-26 2016-05-09 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置および基板処理方法
JP2017183493A (ja) * 2016-03-30 2017-10-05 東京エレクトロン株式会社 基板処理装置及び基板処理装置の調整方法
JP2019062007A (ja) * 2017-09-25 2019-04-18 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置および基板処理方法

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JP4408720B2 (ja) * 2003-03-03 2010-02-03 富士フイルム株式会社 放射線撮影システムの検査方法及びそれを用いた医用画像処理装置
JP2005073218A (ja) 2003-08-07 2005-03-17 Matsushita Electric Ind Co Ltd 画像処理装置
JP5045218B2 (ja) * 2006-10-25 2012-10-10 東京エレクトロン株式会社 液処理装置、液処理方法及び記憶媒体
JP2009032830A (ja) * 2007-07-25 2009-02-12 Dainippon Screen Mfg Co Ltd 基板検出装置および基板処理装置
JP2009172966A (ja) * 2008-01-28 2009-08-06 Fujifilm Corp 画像出力装置及び異常検出方法
WO2012169423A1 (ja) * 2011-06-07 2012-12-13 シャープ株式会社 パターン検査装置およびパターン検査方法
JP2013183493A (ja) * 2012-02-29 2013-09-12 Aisin Aw Co Ltd コイルの製造方法
JP2015153903A (ja) 2014-02-14 2015-08-24 東京エレクトロン株式会社 液処理方法、基板処理装置、及びコンピュータ読み取り可能な記録媒体
JP6251086B2 (ja) * 2014-03-12 2017-12-20 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置および基板処理方法
US20150262848A1 (en) * 2014-03-11 2015-09-17 SCREEN Holdings Co., Ltd. Substrate processing apparatus and substrate processing method for discharge of processing liquid from nozzle
US10192128B2 (en) 2015-03-27 2019-01-29 Nec Corporation Mobile surveillance apparatus, program, and control method
KR101714627B1 (ko) * 2015-04-17 2017-03-23 성안기계 (주) 슬롯 다이 코팅 장치
JP6473047B2 (ja) * 2015-05-26 2019-02-20 株式会社Ｓｃｒｅｅｎホールディングス 検査装置および基板処理装置
US9589820B2 (en) * 2015-05-29 2017-03-07 Taiwan Semiconductor Manufacturing Co., Ltd. Semiconductor apparatus and adjustment method
CN106412388A (zh) * 2015-07-27 2017-02-15 恩逼真股份有限公司 光路改变单元、模块和方法及检测半导体基板的装置
KR101578765B1 (ko) * 2015-09-24 2015-12-18 성안기계 주식회사 슬롯 다이 코팅 장치 및 그 제어 방법
CN108701392A (zh) 2016-02-26 2018-10-23 艾奥姆尼森特私人有限公司 用于执行监视的方法和装置
US10784134B2 (en) * 2017-05-03 2020-09-22 Applied Materials, Inc. Image based substrate mapper
US11923220B2 (en) 2018-01-26 2024-03-05 Tokyo Electron Limited Substrate processing apparatus

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007289901A (ja) * 2006-04-27 2007-11-08 Fuji Mach Mfg Co Ltd 塗布方法及び検査機能付き塗布装置
JP2013214279A (ja) * 2012-03-07 2013-10-17 Tokyo Electron Ltd 半導体製造装置のプロセス監視装置及び半導体製造装置のプロセス監方法並びに半導体製造装置
JP2016072282A (ja) * 2014-09-26 2016-05-09 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置および基板処理方法
JP2017183493A (ja) * 2016-03-30 2017-10-05 東京エレクトロン株式会社 基板処理装置及び基板処理装置の調整方法
JP2019062007A (ja) * 2017-09-25 2019-04-18 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置および基板処理方法

Also Published As

Publication number Publication date
US12244972B2 (en) 2025-03-04
TW202131390A (zh) 2021-08-16
KR102783425B1 (ko) 2025-03-17
CN114667592A (zh) 2022-06-24
JP2023118878A (ja) 2023-08-25
JP7309896B2 (ja) 2023-07-18
JP7727686B2 (ja) 2025-08-21
KR20250042195A (ko) 2025-03-26
KR20220100614A (ko) 2022-07-15
CN114667592B (zh) 2025-06-03
TWI873216B (zh) 2025-02-21
WO2021095612A1 (ja) 2021-05-20
US20220400232A1 (en) 2022-12-15
TW202520358A (zh) 2025-05-16

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