JPWO2021095612A1 - - Google Patents
Info
- Publication number
- JPWO2021095612A1 JPWO2021095612A1 JP2021556044A JP2021556044A JPWO2021095612A1 JP WO2021095612 A1 JPWO2021095612 A1 JP WO2021095612A1 JP 2021556044 A JP2021556044 A JP 2021556044A JP 2021556044 A JP2021556044 A JP 2021556044A JP WO2021095612 A1 JPWO2021095612 A1 JP WO2021095612A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N5/00—Details of television systems
- H04N5/76—Television signal recording
- H04N5/91—Television signal processing therefor
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N7/00—Television systems
- H04N7/18—Closed-circuit television [CCTV] systems, i.e. systems in which the video signal is not broadcast
- H04N7/183—Closed-circuit television [CCTV] systems, i.e. systems in which the video signal is not broadcast for receiving images from a single remote source
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
- B05C11/10—Storage, supply or control of liquid or other fluent material; Recovery of excess liquid or other fluent material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D1/00—Processes for applying liquids or other fluent materials
- B05D1/40—Distributing applied liquids or other fluent materials by members moving relatively to surface
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D3/00—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D3/00—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
- B05D3/002—Pretreatement
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D3/00—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
- B05D3/02—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by baking
- B05D3/0254—After-treatment
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T7/00—Image analysis
- G06T7/0002—Inspection of images, e.g. flaw detection
- G06T7/0004—Industrial image inspection
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/60—Control of cameras or camera modules
- H04N23/69—Control of means for changing angle of the field of view, e.g. optical zoom objectives or electronic zooming
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/80—Camera processing pipelines; Components thereof
- H04N23/815—Camera processing pipelines; Components thereof for controlling the resolution by using a single image
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N7/00—Television systems
- H04N7/18—Closed-circuit television [CCTV] systems, i.e. systems in which the video signal is not broadcast
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/16—Coating processes; Apparatus therefor
- G03F7/162—Coating on a rotating support, e.g. using a whirler or a spinner
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/26—Processing photosensitive materials; Apparatus therefor
- G03F7/30—Imagewise removal using liquid means
- G03F7/3021—Imagewise removal using liquid means from a wafer supported on a rotating chuck
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T2207/00—Indexing scheme for image analysis or image enhancement
- G06T2207/30—Subject of image; Context of image processing
- G06T2207/30108—Industrial image inspection
- G06T2207/30148—Semiconductor; IC; Wafer
Landscapes
- Engineering & Computer Science (AREA)
- Multimedia (AREA)
- Signal Processing (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Power Engineering (AREA)
- Quality & Reliability (AREA)
- Computer Vision & Pattern Recognition (AREA)
- Theoretical Computer Science (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Cleaning Or Drying Semiconductors (AREA)
- Coating Apparatus (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2023110512A JP2023118878A (ja) | 2019-11-15 | 2023-07-05 | 監視装置、基板処理装置、監視方法、及び記憶媒体 |
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2019206954 | 2019-11-15 | ||
JP2019206954 | 2019-11-15 | ||
PCT/JP2020/041253 WO2021095612A1 (ja) | 2019-11-15 | 2020-11-04 | 監視装置、基板処理装置、監視方法、及び記憶媒体 |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2023110512A Division JP2023118878A (ja) | 2019-11-15 | 2023-07-05 | 監視装置、基板処理装置、監視方法、及び記憶媒体 |
Publications (3)
Publication Number | Publication Date |
---|---|
JPWO2021095612A1 true JPWO2021095612A1 (ja) | 2021-05-20 |
JPWO2021095612A5 JPWO2021095612A5 (ja) | 2022-07-14 |
JP7309896B2 JP7309896B2 (ja) | 2023-07-18 |
Family
ID=75912871
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2021556044A Active JP7309896B2 (ja) | 2019-11-15 | 2020-11-04 | 監視装置、基板処理装置、監視方法、及び記憶媒体 |
JP2023110512A Pending JP2023118878A (ja) | 2019-11-15 | 2023-07-05 | 監視装置、基板処理装置、監視方法、及び記憶媒体 |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2023110512A Pending JP2023118878A (ja) | 2019-11-15 | 2023-07-05 | 監視装置、基板処理装置、監視方法、及び記憶媒体 |
Country Status (6)
Country | Link |
---|---|
US (1) | US20220400232A1 (ja) |
JP (2) | JP7309896B2 (ja) |
KR (1) | KR20220100614A (ja) |
CN (1) | CN114667592A (ja) |
TW (1) | TW202131390A (ja) |
WO (1) | WO2021095612A1 (ja) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP7443163B2 (ja) * | 2020-05-27 | 2024-03-05 | 株式会社Screenホールディングス | 基板処理方法および基板処理装置 |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007289901A (ja) * | 2006-04-27 | 2007-11-08 | Fuji Mach Mfg Co Ltd | 塗布方法及び検査機能付き塗布装置 |
JP2013214279A (ja) * | 2012-03-07 | 2013-10-17 | Tokyo Electron Ltd | 半導体製造装置のプロセス監視装置及び半導体製造装置のプロセス監方法並びに半導体製造装置 |
JP2016072282A (ja) * | 2014-09-26 | 2016-05-09 | 株式会社Screenホールディングス | 基板処理装置および基板処理方法 |
JP2017183493A (ja) * | 2016-03-30 | 2017-10-05 | 東京エレクトロン株式会社 | 基板処理装置及び基板処理装置の調整方法 |
JP2019062007A (ja) * | 2017-09-25 | 2019-04-18 | 株式会社Screenホールディングス | 基板処理装置および基板処理方法 |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2015153903A (ja) | 2014-02-14 | 2015-08-24 | 東京エレクトロン株式会社 | 液処理方法、基板処理装置、及びコンピュータ読み取り可能な記録媒体 |
-
2020
- 2020-11-04 KR KR1020227019016A patent/KR20220100614A/ko unknown
- 2020-11-04 WO PCT/JP2020/041253 patent/WO2021095612A1/ja active Application Filing
- 2020-11-04 JP JP2021556044A patent/JP7309896B2/ja active Active
- 2020-11-04 US US17/776,800 patent/US20220400232A1/en active Pending
- 2020-11-04 CN CN202080078123.0A patent/CN114667592A/zh active Pending
- 2020-11-05 TW TW109138558A patent/TW202131390A/zh unknown
-
2023
- 2023-07-05 JP JP2023110512A patent/JP2023118878A/ja active Pending
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007289901A (ja) * | 2006-04-27 | 2007-11-08 | Fuji Mach Mfg Co Ltd | 塗布方法及び検査機能付き塗布装置 |
JP2013214279A (ja) * | 2012-03-07 | 2013-10-17 | Tokyo Electron Ltd | 半導体製造装置のプロセス監視装置及び半導体製造装置のプロセス監方法並びに半導体製造装置 |
JP2016072282A (ja) * | 2014-09-26 | 2016-05-09 | 株式会社Screenホールディングス | 基板処理装置および基板処理方法 |
JP2017183493A (ja) * | 2016-03-30 | 2017-10-05 | 東京エレクトロン株式会社 | 基板処理装置及び基板処理装置の調整方法 |
JP2019062007A (ja) * | 2017-09-25 | 2019-04-18 | 株式会社Screenホールディングス | 基板処理装置および基板処理方法 |
Also Published As
Publication number | Publication date |
---|---|
US20220400232A1 (en) | 2022-12-15 |
CN114667592A (zh) | 2022-06-24 |
TW202131390A (zh) | 2021-08-16 |
KR20220100614A (ko) | 2022-07-15 |
JP7309896B2 (ja) | 2023-07-18 |
JP2023118878A (ja) | 2023-08-25 |
WO2021095612A1 (ja) | 2021-05-20 |
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