TW202440849A - 熱硬化性接著劑、複合膜及印刷電路板 - Google Patents

熱硬化性接著劑、複合膜及印刷電路板 Download PDF

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Publication number
TW202440849A
TW202440849A TW112146060A TW112146060A TW202440849A TW 202440849 A TW202440849 A TW 202440849A TW 112146060 A TW112146060 A TW 112146060A TW 112146060 A TW112146060 A TW 112146060A TW 202440849 A TW202440849 A TW 202440849A
Authority
TW
Taiwan
Prior art keywords
thermosetting
adhesive layer
adhesive
layer
wiring
Prior art date
Application number
TW112146060A
Other languages
English (en)
Chinese (zh)
Inventor
一松拓馬
米澤隆幸
Original Assignee
日商住友電工印刷電路股份有限公司
日商住友電氣工業股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商住友電工印刷電路股份有限公司, 日商住友電氣工業股份有限公司 filed Critical 日商住友電工印刷電路股份有限公司
Publication of TW202440849A publication Critical patent/TW202440849A/zh

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J177/00—Adhesives based on polyamides obtained by reactions forming a carboxylic amide link in the main chain; Adhesives based on derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J179/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen, with or without oxygen, or carbon only, not provided for in groups C09J161/00 - C09J177/00
    • C09J179/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C09J179/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J201/00—Adhesives based on unspecified macromolecular compounds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Adhesives Or Adhesive Processes (AREA)
TW112146060A 2022-12-08 2023-11-28 熱硬化性接著劑、複合膜及印刷電路板 TW202440849A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2022-196404 2022-12-08
JP2022196404 2022-12-08

Publications (1)

Publication Number Publication Date
TW202440849A true TW202440849A (zh) 2024-10-16

Family

ID=91378892

Family Applications (1)

Application Number Title Priority Date Filing Date
TW112146060A TW202440849A (zh) 2022-12-08 2023-11-28 熱硬化性接著劑、複合膜及印刷電路板

Country Status (4)

Country Link
JP (1) JPWO2024122209A1 (https=)
CN (1) CN120359814A (https=)
TW (1) TW202440849A (https=)
WO (1) WO2024122209A1 (https=)

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003229458A (ja) * 2002-02-01 2003-08-15 Toray Ind Inc 半導体回路用基板の製造方法及び半導体装置
JP2010195887A (ja) * 2009-02-24 2010-09-09 Sumitomo Electric Ind Ltd 接着性樹脂組成物並びにこれを用いた積層体及びフレキシブル印刷配線板
US11477884B2 (en) * 2018-04-04 2022-10-18 Sumitomo Electric Printed Circuits, Inc. Cover film for flexible printed circuit board and flexible printed circuit board

Also Published As

Publication number Publication date
WO2024122209A1 (ja) 2024-06-13
CN120359814A (zh) 2025-07-22
JPWO2024122209A1 (https=) 2024-06-13

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