JPWO2024122209A1 - - Google Patents
Info
- Publication number
- JPWO2024122209A1 JPWO2024122209A1 JP2024562617A JP2024562617A JPWO2024122209A1 JP WO2024122209 A1 JPWO2024122209 A1 JP WO2024122209A1 JP 2024562617 A JP2024562617 A JP 2024562617A JP 2024562617 A JP2024562617 A JP 2024562617A JP WO2024122209 A1 JPWO2024122209 A1 JP WO2024122209A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J177/00—Adhesives based on polyamides obtained by reactions forming a carboxylic amide link in the main chain; Adhesives based on derivatives of such polymers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J179/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen, with or without oxygen, or carbon only, not provided for in groups C09J161/00 - C09J177/00
- C09J179/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
- C09J179/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J201/00—Adhesives based on unspecified macromolecular compounds
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Adhesives Or Adhesive Processes (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2022196404 | 2022-12-08 | ||
| PCT/JP2023/038326 WO2024122209A1 (ja) | 2022-12-08 | 2023-10-24 | 熱硬化性接着剤、複合フィルム及びプリント配線板 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2024122209A1 true JPWO2024122209A1 (https=) | 2024-06-13 |
| JPWO2024122209A5 JPWO2024122209A5 (https=) | 2025-08-18 |
Family
ID=91378892
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2024562617A Pending JPWO2024122209A1 (https=) | 2022-12-08 | 2023-10-24 |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JPWO2024122209A1 (https=) |
| CN (1) | CN120359814A (https=) |
| TW (1) | TW202440849A (https=) |
| WO (1) | WO2024122209A1 (https=) |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003229458A (ja) * | 2002-02-01 | 2003-08-15 | Toray Ind Inc | 半導体回路用基板の製造方法及び半導体装置 |
| JP2010195887A (ja) * | 2009-02-24 | 2010-09-09 | Sumitomo Electric Ind Ltd | 接着性樹脂組成物並びにこれを用いた積層体及びフレキシブル印刷配線板 |
| US11477884B2 (en) * | 2018-04-04 | 2022-10-18 | Sumitomo Electric Printed Circuits, Inc. | Cover film for flexible printed circuit board and flexible printed circuit board |
-
2023
- 2023-10-24 CN CN202380083626.0A patent/CN120359814A/zh active Pending
- 2023-10-24 WO PCT/JP2023/038326 patent/WO2024122209A1/ja not_active Ceased
- 2023-10-24 JP JP2024562617A patent/JPWO2024122209A1/ja active Pending
- 2023-11-28 TW TW112146060A patent/TW202440849A/zh unknown
Also Published As
| Publication number | Publication date |
|---|---|
| WO2024122209A1 (ja) | 2024-06-13 |
| CN120359814A (zh) | 2025-07-22 |
| TW202440849A (zh) | 2024-10-16 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20250526 |