JPWO2024122209A5 - - Google Patents

Info

Publication number
JPWO2024122209A5
JPWO2024122209A5 JP2024562617A JP2024562617A JPWO2024122209A5 JP WO2024122209 A5 JPWO2024122209 A5 JP WO2024122209A5 JP 2024562617 A JP2024562617 A JP 2024562617A JP 2024562617 A JP2024562617 A JP 2024562617A JP WO2024122209 A5 JPWO2024122209 A5 JP WO2024122209A5
Authority
JP
Japan
Prior art keywords
thermosetting
adhesive layer
adhesive
wiring
resin film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2024562617A
Other languages
English (en)
Japanese (ja)
Other versions
JPWO2024122209A1 (https=
Filing date
Publication date
Application filed filed Critical
Priority claimed from PCT/JP2023/038326 external-priority patent/WO2024122209A1/ja
Publication of JPWO2024122209A1 publication Critical patent/JPWO2024122209A1/ja
Publication of JPWO2024122209A5 publication Critical patent/JPWO2024122209A5/ja
Pending legal-status Critical Current

Links

JP2024562617A 2022-12-08 2023-10-24 Pending JPWO2024122209A1 (https=)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2022196404 2022-12-08
PCT/JP2023/038326 WO2024122209A1 (ja) 2022-12-08 2023-10-24 熱硬化性接着剤、複合フィルム及びプリント配線板

Publications (2)

Publication Number Publication Date
JPWO2024122209A1 JPWO2024122209A1 (https=) 2024-06-13
JPWO2024122209A5 true JPWO2024122209A5 (https=) 2025-08-18

Family

ID=91378892

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2024562617A Pending JPWO2024122209A1 (https=) 2022-12-08 2023-10-24

Country Status (4)

Country Link
JP (1) JPWO2024122209A1 (https=)
CN (1) CN120359814A (https=)
TW (1) TW202440849A (https=)
WO (1) WO2024122209A1 (https=)

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003229458A (ja) * 2002-02-01 2003-08-15 Toray Ind Inc 半導体回路用基板の製造方法及び半導体装置
JP2010195887A (ja) * 2009-02-24 2010-09-09 Sumitomo Electric Ind Ltd 接着性樹脂組成物並びにこれを用いた積層体及びフレキシブル印刷配線板
US11477884B2 (en) * 2018-04-04 2022-10-18 Sumitomo Electric Printed Circuits, Inc. Cover film for flexible printed circuit board and flexible printed circuit board

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