WO2024122209A1 - 熱硬化性接着剤、複合フィルム及びプリント配線板 - Google Patents

熱硬化性接着剤、複合フィルム及びプリント配線板 Download PDF

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Publication number
WO2024122209A1
WO2024122209A1 PCT/JP2023/038326 JP2023038326W WO2024122209A1 WO 2024122209 A1 WO2024122209 A1 WO 2024122209A1 JP 2023038326 W JP2023038326 W JP 2023038326W WO 2024122209 A1 WO2024122209 A1 WO 2024122209A1
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WO
WIPO (PCT)
Prior art keywords
adhesive layer
thermosetting
adhesive
layer
resin film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2023/038326
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English (en)
French (fr)
Japanese (ja)
Inventor
拓馬 一松
隆幸 米澤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumitomo Electric Industries Ltd
Sumitomo Electric Printed Circuits Inc
Original Assignee
Sumitomo Electric Industries Ltd
Sumitomo Electric Printed Circuits Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Electric Industries Ltd, Sumitomo Electric Printed Circuits Inc filed Critical Sumitomo Electric Industries Ltd
Priority to CN202380083626.0A priority Critical patent/CN120359814A/zh
Priority to JP2024562617A priority patent/JPWO2024122209A1/ja
Publication of WO2024122209A1 publication Critical patent/WO2024122209A1/ja
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J177/00—Adhesives based on polyamides obtained by reactions forming a carboxylic amide link in the main chain; Adhesives based on derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J179/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen, with or without oxygen, or carbon only, not provided for in groups C09J161/00 - C09J177/00
    • C09J179/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C09J179/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J201/00—Adhesives based on unspecified macromolecular compounds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate

Definitions

  • thermosetting adhesive a composite film, and a printed wiring board.
  • This application claims priority to Japanese Patent Application No. 2022-196404, filed on December 8, 2022. All contents of said Japanese patent application are incorporated herein by reference.
  • Patent Document 1 JP 2019-116619 A (Patent Document 1) describes a coverlay.
  • the coverlay described in Patent Document 1 has a cover film and an adhesive layer.
  • the adhesive layer is disposed on the main surface of the cover film.
  • the adhesive layer is a layer of a thermosetting adhesive.
  • the printed wiring board has a base film and a conductive pattern.
  • the conductive pattern is disposed on the main surface of the base film.
  • the coverlay described in Patent Document 1 is attached to the main surface of the base film so that the adhesive layer covers the conductive pattern.
  • thermosetting adhesive of the present disclosure comprises a thermosetting component that hardens when heated, and an organic component different from the thermosetting component.
  • the mass fraction of the organic component in the thermosetting adhesive is 40 ppm or more.
  • FIG. 1 is a cross-sectional view of a composite film 100 .
  • FIG. 2 is a cross-sectional view of a composite film 100 according to a modified example.
  • FIG. 3 is a cross-sectional view of the printed wiring board 200.
  • FIG. 4 is a cross-sectional view of a printed wiring board 200 according to the first modification.
  • FIG. 5 is a cross-sectional view of a printed wiring board 200 according to the second modification.
  • 6A to 6C are diagrams showing the manufacturing process of the printed wiring board 200.
  • FIG. 7 is a cross-sectional view illustrating the seed layer forming step S2.
  • FIG. 8 is a cross-sectional view illustrating the electroless plating step S3.
  • FIG. 9 is a cross-sectional view illustrating the resist pattern forming step S4.
  • FIG. 10 is a cross-sectional view illustrating the electrolytic plating step S5.
  • FIG. 11 is a cross-sectional view illustrating the resist pattern removing step S6.
  • FIG. 12 is a cross-sectional view illustrating the etching step S7.
  • thermosetting adhesive that has improved embeddability between two adjacent portions of a wiring.
  • thermosetting adhesive of the present disclosure can improve the embedding ability between two adjacent portions of a wiring.
  • thermosetting adhesive of the present disclosure comprises a thermosetting component that hardens when heated, and an organic component different from the thermosetting component.
  • the mass fraction of the organic component in the thermosetting adhesive is 40 ppm or more.
  • the thermosetting adhesive of (1) above can improve the embeddability between two adjacent portions of a wiring.
  • thermosetting component and the organic component may be compatible with each other.
  • the thermosetting component may include at least one selected from the group consisting of epoxy, amide, and amide-imide.
  • the boiling point of the organic component may be 60° C. or higher and 210° C. or lower.
  • the thermosetting adhesive of (3) can improve the embedding property between two adjacent parts of the wiring while ensuring insulation between the two adjacent parts of the wiring.
  • thermosetting adhesives according to (1) to (3) above may have a melt viscosity of 1 ⁇ 10 5 Pa ⁇ s or less in a temperature range of 150° C. or more and 180° C. or less.
  • the composite film of the present disclosure comprises a first resin film having a first surface, and an adhesive layer disposed on the first surface.
  • the adhesive layer is a layer of a thermosetting adhesive as described in (1) to (4) above.
  • the composite film of (5) above may further include a second resin film disposed on the adhesive layer.
  • the composite film of (5) above makes it possible to protect the adhesive layer before use.
  • the second resin film may be a polyester film.
  • the first resin film may be a polyimide, liquid crystal polymer, or polyester film.
  • the printed wiring board of the present disclosure comprises a third resin film having a second surface, wiring disposed on the second surface, and an adhesive layer.
  • the value obtained by dividing the height of the wiring by the width of the wiring is 0.5 or more.
  • the distance between two adjacent portions of the wiring is 100 ⁇ m or less.
  • the adhesive layer is disposed on the second surface so as to cover the wiring.
  • the maximum diameter of the voids in the adhesive layer is 3 ⁇ m or less. According to the printed wiring board of (9) above, it is possible to improve the embeddability of the adhesive layer between two adjacent wirings.
  • the printed wiring board of (9) above may further include a first resin film disposed on the adhesive layer.
  • composite film according to the embodiment is referred to as composite film 100
  • printed wiring board 200 is referred to as printed wiring board 200.
  • FIG. 1 is a cross-sectional view of a composite film 100. As shown in FIG. 1, the composite film 100 has a first resin film 10, an adhesive layer 20, and a second resin film 30.
  • the first resin film 10 has a first surface 10a.
  • the first surface 10a is an end surface of the first resin film 10 in the thickness direction.
  • the first resin film 10 is, for example, a film of polyimide, liquid crystal polymer, or polyester.
  • the adhesive layer 20 is disposed on the first surface 10a.
  • the adhesive layer 20 is a layer of a thermosetting adhesive.
  • the thickness of the adhesive layer 20 is thickness T1. Thickness T1 may be 5 ⁇ m or more and 100 ⁇ m or less.
  • the thermosetting adhesive of the adhesive layer 20 is in an uncured state.
  • the thermosetting adhesive constituting the adhesive layer 20 has a thermosetting component and an organic component.
  • the thermosetting component is a component that hardens when heated.
  • the thermosetting component includes at least one selected from the group consisting of epoxy, amide, and amide-imide.
  • the organic component is a component different from the thermosetting component.
  • the thermosetting component and the organic component may be compatible. "The thermosetting component and the organic component are compatible" means that the thermosetting component and the organic component have mutual affinity and are mixed at the molecular level.
  • the mass fraction of the organic component in the thermosetting adhesive constituting the adhesive layer 20 is 40 ppm or more.
  • the mass fraction of the organic component in the thermosetting adhesive constituting the adhesive layer 20 may be, for example, 500 ppm or less.
  • the mass fraction of the organic component in the thermosetting adhesive constituting the adhesive layer 20 is measured by pyrolysis gas chromatography mass spectrometry.
  • the boiling point of the organic component in the thermosetting adhesive constituting the adhesive layer 20 may be, for example, 60° C. or higher and 210° C. or lower.
  • the melt viscosity of the thermosetting adhesive constituting the adhesive layer 20 may be 1 ⁇ 10 5 Pa ⁇ s or lower in a temperature range of 150° C. or higher and 180° C. or lower.
  • the melt viscosity of the thermosetting adhesive constituting the adhesive layer 20 is measured in accordance with JIS K 7121 (1987). More specifically, the viscosity is measured while heating using a rotational rheometer under conditions of a frequency of 1 Hz and a temperature rise rate of 10° C./min, and is taken as the melt viscosity.
  • As the rotational rheometer Rheosol-G3000 manufactured by UBM is used.
  • the second resin film 30 is disposed on the adhesive layer 20. From another perspective, the adhesive layer 20 is sandwiched between the first resin film 10 and the second resin film 30. The adhesive layer 20 is protected by the second resin film 30.
  • the second resin film 30 is, for example, a polyester film.
  • Fig. 2 is a cross-sectional view of a composite film 100 according to a modified example.
  • the composite film 100 has the second resin film 30, but the composite film 100 does not have to have the second resin film 30 as shown in Fig. 2.
  • FIG. 3 is a cross-sectional view of the printed wiring board 200.
  • the printed wiring board 200 has a third resin film 40, wiring 50, an adhesive layer 60, and a first resin film 10.
  • the third resin film 40 has a second surface 40a and a third surface 40b.
  • the second surface 40a and the third surface 40b are end surfaces in the thickness direction of the third resin film 40.
  • the third surface 40b is the opposite surface to the second surface 40a.
  • the third resin film 40 is, for example, a film of polyimide, liquid crystal polymer, or fluororesin.
  • the wiring 50 is disposed on the second surface 40a.
  • the width and height of the wiring 50 are width W and height H, respectively.
  • the aspect ratio of the wiring 50 (height H divided by width W) is, for example, 0.5 or more.
  • the distance between two adjacent portions of the wiring 50 is distance DIS.
  • Distance DIS is, for example, 100 ⁇ m or less.
  • the wiring 50 has a seed layer 51, an electroless plating layer 52, and an electrolytic plating layer 53.
  • the seed layer 51 is disposed on the second surface 40a.
  • the seed layer 51 is, for example, a layer of a nickel-chromium alloy formed by sputtering.
  • the seed layer 51 may also be a layer of sintered nano-copper particles.
  • the electroless plating layer 52 is disposed on the seed layer 51.
  • the electroless plating layer 52 is a copper layer formed by electroless plating.
  • the electrolytic plating layer 53 is disposed on the electroless plating layer 52.
  • the electrolytic plating layer 53 is a copper layer formed by electrolytic plating.
  • the adhesive layer 60 is disposed on the second surface 40a so as to cover the wiring 50.
  • the adhesive layer 60 is a layer of a thermosetting resin. In the adhesive layer 60, the thermosetting component is in a cured state.
  • the maximum diameter of the voids in the adhesive layer 60 is 3 ⁇ m or less.
  • the maximum diameter of the voids in the adhesive layer 60 is measured using an optical microscope.
  • the thickness of the adhesive layer 60 is taken as thickness T2.
  • Thickness T2 is the thickness of the adhesive layer 60 on the upper surface of the wiring 50. Thickness T2 may be 20 ⁇ m or less.
  • the first resin film 10 is disposed on the adhesive layer 60.
  • Fig. 4 is a cross-sectional view of a printed wiring board 200 according to Modification 1. As shown in Fig. 4, the printed wiring board 200 does not need to have the first resin film 10.
  • Fig. 5 is a cross-sectional view of a printed wiring board 200 according to Modification 2. As shown in Fig. 5, the wiring 50 may be disposed on the third surface 40b, and the adhesive layer 60 may be disposed on the third surface 40b so as to cover the wiring 50.
  • FIG. 6 is a manufacturing process diagram of the printed wiring board 200.
  • the manufacturing method of the printed wiring board 200 includes a preparation process S1, a seed layer formation process S2, an electroless plating process S3, a resist pattern formation process S4, an electrolytic plating process S5, a resist pattern removal process S6, an etching process S7, and a composite film attachment process S8.
  • FIG. 7 is a cross-sectional view illustrating the seed layer formation step S2.
  • a seed layer 51 is formed on the second surface 40a.
  • the seed layer 51 is formed by, for example, sputtering.
  • the seed layer 51 may be formed by applying an ink containing nano-copper particles onto the second surface 40a and baking the ink.
  • FIG. 8 is a cross-sectional view illustrating the electroless plating step S3.
  • an electroless plating layer 52 is formed on a seed layer 51.
  • the electroless plating layer 52 is formed by electroless plating.
  • FIG. 9 is a cross-sectional view illustrating the resist pattern formation step S4.
  • a resist pattern 70 is formed on the electroless plating layer 52.
  • the resist pattern 70 is formed, for example, by attaching a dry film resist on the electroless plating layer 52, and exposing and developing the dry film resist to pattern it.
  • the resist pattern 70 has an opening 71 penetrating the resist pattern 70 in the thickness direction, and the electroless plating layer 52 is exposed from the opening 71.
  • FIG. 10 is a cross-sectional view illustrating the electrolytic plating process S5. As shown in FIG. 10, in the electrolytic plating process S5, an electrolytic plating layer 53 is formed on the electroless plating layer 52 exposed from the opening 71. The electrolytic plating layer 53 is formed by electrolytic plating.
  • FIG. 11 is a cross-sectional view illustrating the resist pattern removal process S6. As shown in FIG. 11, in the resist pattern removal process S6, the resist pattern 70 is removed from the electroless plating layer 52.
  • FIG. 12 is a cross-sectional view illustrating the etching step S7. As shown in FIG. 12, in the etching step S7, the electroless plating layer 52 and the seed layer 51 that were underneath the resist pattern 70 are removed by etching.
  • the composite film 100 is attached onto the second surface 40a.
  • the composite film attachment process S8 first, the second resin film 30 is peeled off from the adhesive layer 20.
  • the composite film 100 is attached onto the second surface 40a so that the adhesive layer 20 covers the wiring 50.
  • the composite film 100 is heated and pressurized toward the third resin film 40. This heating is performed, for example, in a temperature range of 150°C to 180°C.
  • the thermosetting adhesive that constitutes the adhesive layer 20 flows and is embedded between the two adjacent portions of the wiring 50, and the thermosetting adhesive hardens. In this way, the adhesive layer 20 becomes the adhesive layer 60.
  • the mass fraction of organic components in the thermosetting adhesive constituting the adhesive layer 20 is 40 ppm or more. Therefore, the flowability of the thermosetting adhesive constituting the adhesive layer 20 can be ensured when the heating is performed in the composite film attachment step S8. More specifically, the melt viscosity of the thermosetting adhesive constituting the adhesive layer 20 can be set to 1 ⁇ 10 5 Pa ⁇ s or less when the heating is performed in the composite film attachment step S8. As a result, the composite film 100 can improve the embeddability of the adhesive layer 60 between two adjacent portions of the wiring 50.
  • the organic component contained in the thermosetting adhesive constituting the adhesive layer 20 may evaporate during heating in the composite film attachment process S8, and the fluidity of the thermosetting adhesive constituting the adhesive layer 20 may decrease.
  • the boiling point of the organic component contained in the thermosetting adhesive constituting the adhesive layer 20 is greater than 210°C, the organic component may remain in large amounts in the adhesive layer 60, which may reduce the insulating properties of the adhesive layer 60. Therefore, by setting the boiling point of the organic component contained in the thermosetting adhesive constituting the adhesive layer 20 to 60°C or more and 210°C or less, it is possible to improve the embedding property between two adjacent parts of the wiring 50 while ensuring the insulation between the two adjacent parts of the wiring 50.
  • Samples 1 to 7 were prepared as composite film samples. In Samples 1 to 7, a heat treatment was performed to adjust the mass fraction of the organic component in the thermosetting adhesive constituting the adhesive layer 20. Table 1 shows the heat treatment conditions applied to Samples 1 to 7.
  • thermosetting adhesive constituting the adhesive layer 20 As a result of this heat treatment, in samples 1 to 5, the mass fraction of organic components in the thermosetting adhesive constituting the adhesive layer 20 was 40 ppm or more. On the other hand, in samples 6 and 7, as a result of this heat treatment, the mass fraction of organic components in the thermosetting adhesive constituting the adhesive layer 20 was less than 40 ppm.
  • Tables 2 to 8 show the melt viscosities of the thermosetting adhesive constituting the adhesive layer 20 in Samples 1 to 7, respectively.
  • the melt viscosity of the thermosetting adhesive constituting the adhesive layer 20 was 1 ⁇ 10 5 Pa ⁇ s or less in the temperature range of 150° C. or more and 180° C. or less.
  • thermosetting adhesive constituting adhesive layer 20 As this comparison, it became clear that by setting the mass fraction of organic components in the thermosetting adhesive constituting adhesive layer 20 to 40 ppm or more, the melt viscosity of the thermosetting adhesive constituting adhesive layer 20 becomes 1 x 105 Pa ⁇ s or less in the temperature range of 150°C or higher and 180°C or lower.
  • Printed wiring boards were prepared using the composite films of samples 4 to 7.
  • the aspect ratio of the wiring 50 was 1.5 or more, and the distance DIS was 30 ⁇ m or less.
  • the voids in the adhesive layer 60 were observed.
  • the maximum diameter of the voids in the adhesive layer 60 was 3 ⁇ m or less.
  • the maximum diameter of the voids in the adhesive layer 60 was more than 3 ⁇ m.
  • thermosetting adhesive constituting the adhesive layer 20 By setting the mass fraction of the organic components in the thermosetting adhesive constituting the adhesive layer 20 to 40 ppm or more, the fluidity of the thermosetting adhesive constituting the adhesive layer 20 can be ensured during heating in the composite film attachment process S8, and the embeddability between two adjacent portions of the wiring 50 can be improved.

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Adhesives Or Adhesive Processes (AREA)
PCT/JP2023/038326 2022-12-08 2023-10-24 熱硬化性接着剤、複合フィルム及びプリント配線板 Ceased WO2024122209A1 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
CN202380083626.0A CN120359814A (zh) 2022-12-08 2023-10-24 热固性粘接剂、复合膜以及印刷布线板
JP2024562617A JPWO2024122209A1 (https=) 2022-12-08 2023-10-24

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2022-196404 2022-12-08
JP2022196404 2022-12-08

Publications (1)

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WO2024122209A1 true WO2024122209A1 (ja) 2024-06-13

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PCT/JP2023/038326 Ceased WO2024122209A1 (ja) 2022-12-08 2023-10-24 熱硬化性接着剤、複合フィルム及びプリント配線板

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JP (1) JPWO2024122209A1 (https=)
CN (1) CN120359814A (https=)
TW (1) TW202440849A (https=)
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Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003229458A (ja) * 2002-02-01 2003-08-15 Toray Ind Inc 半導体回路用基板の製造方法及び半導体装置
JP2010195887A (ja) * 2009-02-24 2010-09-09 Sumitomo Electric Ind Ltd 接着性樹脂組成物並びにこれを用いた積層体及びフレキシブル印刷配線板
WO2019194208A1 (ja) * 2018-04-04 2019-10-10 住友電工プリントサーキット株式会社 フレキシブルプリント配線板用カバーフィルム及びフレキシブルプリント配線板

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003229458A (ja) * 2002-02-01 2003-08-15 Toray Ind Inc 半導体回路用基板の製造方法及び半導体装置
JP2010195887A (ja) * 2009-02-24 2010-09-09 Sumitomo Electric Ind Ltd 接着性樹脂組成物並びにこれを用いた積層体及びフレキシブル印刷配線板
WO2019194208A1 (ja) * 2018-04-04 2019-10-10 住友電工プリントサーキット株式会社 フレキシブルプリント配線板用カバーフィルム及びフレキシブルプリント配線板

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TW202440849A (zh) 2024-10-16
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