JPH032355B2 - - Google Patents

Info

Publication number
JPH032355B2
JPH032355B2 JP59001446A JP144684A JPH032355B2 JP H032355 B2 JPH032355 B2 JP H032355B2 JP 59001446 A JP59001446 A JP 59001446A JP 144684 A JP144684 A JP 144684A JP H032355 B2 JPH032355 B2 JP H032355B2
Authority
JP
Japan
Prior art keywords
layer
polyimide
metal
composition
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP59001446A
Other languages
English (en)
Japanese (ja)
Other versions
JPS59204295A (ja
Inventor
Bakosu Piitaa
Erutsudo Daaro Ratsuseru
Piitaa Furanchaku Neruson
Fuyunari Josefu
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
International Business Machines Corp
Original Assignee
International Business Machines Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by International Business Machines Corp filed Critical International Business Machines Corp
Publication of JPS59204295A publication Critical patent/JPS59204295A/ja
Publication of JPH032355B2 publication Critical patent/JPH032355B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/62—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their interconnections
    • H10W70/66—Conductive materials thereof
    • H10W70/666—Organic materials or pastes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4673—Application methods or materials of intermediate insulating layers not specially adapted to any one of the previous methods of adding a circuit layer
    • H05K3/4676—Single layer compositions
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0154—Polyimide
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0209—Inorganic, non-metallic particles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/467—Adding a circuit layer by thin film methods

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Laminated Bodies (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
JP59001446A 1983-04-29 1984-01-10 金属回路構造体 Granted JPS59204295A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US48987883A 1983-04-29 1983-04-29
US489878 1983-04-29

Publications (2)

Publication Number Publication Date
JPS59204295A JPS59204295A (ja) 1984-11-19
JPH032355B2 true JPH032355B2 (https=) 1991-01-14

Family

ID=23945649

Family Applications (1)

Application Number Title Priority Date Filing Date
JP59001446A Granted JPS59204295A (ja) 1983-04-29 1984-01-10 金属回路構造体

Country Status (3)

Country Link
EP (1) EP0123954B1 (https=)
JP (1) JPS59204295A (https=)
DE (1) DE3479284D1 (https=)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6183222A (ja) * 1984-09-29 1986-04-26 Matsushita Electric Works Ltd ポリフエニレンオキサイド系固化物の改質法
AU4502399A (en) 1998-05-29 1999-12-20 Nokia Mobile Phones Limited Composite injection mouldable material
GB2337756B (en) * 1998-05-29 2002-08-28 Nokia Mobile Phones Ltd Composite injection mouldable material
RU2654963C1 (ru) * 2017-03-06 2018-05-23 Акционерное общество "Научно-производственное предприятие "Исток" имени А.И. Шокина" (АО "НПП "Исток" им. Шокина") Способ металлизации диэлектрического материала компонента электронной техники СВЧ

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3615913A (en) * 1968-11-08 1971-10-26 Westinghouse Electric Corp Polyimide and polyamide-polyimide as a semiconductor surface passivator and protectant coating
CA989151A (en) * 1971-03-01 1976-05-18 Harold E. Bellis Process for the manufacture of conductive metal laminates
JPS5443576A (en) * 1977-09-12 1979-04-06 Fujitsu Ltd Method of manufacturing printed board
JPS5824039B2 (ja) * 1978-03-01 1983-05-18 富士通株式会社 多層配線パタ−ン形成法
US4246147A (en) * 1979-06-04 1981-01-20 International Business Machines Corporation Screenable and strippable solder mask and use thereof
JPS5688204A (en) * 1979-12-17 1981-07-17 Ibm Insulating coating

Also Published As

Publication number Publication date
DE3479284D1 (en) 1989-09-07
EP0123954A3 (en) 1985-11-27
EP0123954A2 (en) 1984-11-07
JPS59204295A (ja) 1984-11-19
EP0123954B1 (en) 1989-08-02

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