DE3479284D1 - Structure containing a layer consisting of polyimide and an inorganic filler and method for producing such a structure - Google Patents

Structure containing a layer consisting of polyimide and an inorganic filler and method for producing such a structure

Info

Publication number
DE3479284D1
DE3479284D1 DE8484103716T DE3479284T DE3479284D1 DE 3479284 D1 DE3479284 D1 DE 3479284D1 DE 8484103716 T DE8484103716 T DE 8484103716T DE 3479284 T DE3479284 T DE 3479284T DE 3479284 D1 DE3479284 D1 DE 3479284D1
Authority
DE
Germany
Prior art keywords
polyimide
producing
inorganic filler
layer consisting
structure containing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
DE8484103716T
Other languages
German (de)
English (en)
Inventor
Peter Bakos
Russel E Darrow
Nelson P Franchak
Joseph Funari
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
International Business Machines Corp
Original Assignee
International Business Machines Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by International Business Machines Corp filed Critical International Business Machines Corp
Application granted granted Critical
Publication of DE3479284D1 publication Critical patent/DE3479284D1/de
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/62—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their interconnections
    • H10W70/66—Conductive materials thereof
    • H10W70/666—Organic materials or pastes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4673—Application methods or materials of intermediate insulating layers not specially adapted to any one of the previous methods of adding a circuit layer
    • H05K3/4676—Single layer compositions
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0154—Polyimide
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0209—Inorganic, non-metallic particles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/467—Adding a circuit layer by thin film methods

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Laminated Bodies (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
DE8484103716T 1983-04-29 1984-04-05 Structure containing a layer consisting of polyimide and an inorganic filler and method for producing such a structure Expired DE3479284D1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US48987883A 1983-04-29 1983-04-29

Publications (1)

Publication Number Publication Date
DE3479284D1 true DE3479284D1 (en) 1989-09-07

Family

ID=23945649

Family Applications (1)

Application Number Title Priority Date Filing Date
DE8484103716T Expired DE3479284D1 (en) 1983-04-29 1984-04-05 Structure containing a layer consisting of polyimide and an inorganic filler and method for producing such a structure

Country Status (3)

Country Link
EP (1) EP0123954B1 (https=)
JP (1) JPS59204295A (https=)
DE (1) DE3479284D1 (https=)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6183222A (ja) * 1984-09-29 1986-04-26 Matsushita Electric Works Ltd ポリフエニレンオキサイド系固化物の改質法
AU4502399A (en) 1998-05-29 1999-12-20 Nokia Mobile Phones Limited Composite injection mouldable material
GB2337756B (en) * 1998-05-29 2002-08-28 Nokia Mobile Phones Ltd Composite injection mouldable material
RU2654963C1 (ru) * 2017-03-06 2018-05-23 Акционерное общество "Научно-производственное предприятие "Исток" имени А.И. Шокина" (АО "НПП "Исток" им. Шокина") Способ металлизации диэлектрического материала компонента электронной техники СВЧ

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3615913A (en) * 1968-11-08 1971-10-26 Westinghouse Electric Corp Polyimide and polyamide-polyimide as a semiconductor surface passivator and protectant coating
CA989151A (en) * 1971-03-01 1976-05-18 Harold E. Bellis Process for the manufacture of conductive metal laminates
JPS5443576A (en) * 1977-09-12 1979-04-06 Fujitsu Ltd Method of manufacturing printed board
JPS5824039B2 (ja) * 1978-03-01 1983-05-18 富士通株式会社 多層配線パタ−ン形成法
US4246147A (en) * 1979-06-04 1981-01-20 International Business Machines Corporation Screenable and strippable solder mask and use thereof
JPS5688204A (en) * 1979-12-17 1981-07-17 Ibm Insulating coating

Also Published As

Publication number Publication date
EP0123954A3 (en) 1985-11-27
EP0123954A2 (en) 1984-11-07
JPS59204295A (ja) 1984-11-19
EP0123954B1 (en) 1989-08-02
JPH032355B2 (https=) 1991-01-14

Similar Documents

Publication Publication Date Title
GB2143268B (en) Method of replacing a well conductor in an offshore platform
DE3463589D1 (en) Method of forming electrode/wiring layer
HUT62499A (en) Method and apparatus for producing fireproof layer
EP0162711A3 (en) Method of selectively forming an insulation layer
GB2156526B (en) A method of and apparatus for measuring the thickness of a layer
DE3376783D1 (en) Isolation layer for photovoltaic device and method of producing same
EP0305143A3 (en) Method of selectively forming a conductor layer
DE3267000D1 (en) Method of forming via holes in insulating layers
GB2133966B (en) Method and apparatus for producing a composite tobacco filler
DE3373401D1 (en) Method and apparatus for the production of multilayered portions of foodstuffs
GB2142346B (en) Method of formation of layer of multiconstituent material
DE3475632D1 (en) Method of making paper with high filler content
EP0231660A3 (en) Method for producing an electronic device having a multi-layer structure and electronic device obtained thereby
EP0064813A3 (en) A method of producing a polyimide film and a polyimide film produced by such a method
DE3471405D1 (en) A method of producing a semiconductor structure on a substrate and a semiconductor device manufactured thereby
ZA846628B (en) Method of and arrangement for positioning of a drilling apparatus
EP0107363A3 (en) Method of producing anisotropically-conducting layers
DE3479284D1 (en) Structure containing a layer consisting of polyimide and an inorganic filler and method for producing such a structure
EP0087321A3 (en) Offshore structure and method of constructing same
DE3362079D1 (en) A method of providing a protected layer
EP0228295A3 (en) Method for producing an electronic device having a multi-layer structure and electronic device obtained thereby
GB2130261B (en) Apparatus for and a method of producing a web
DE3465498D1 (en) Method of providing a metal layer
DE3469982D1 (en) Method of generating circuit boards using electroeroded sheet layers and circuit boards so produced
PH23007A (en) A method of producing an optical component and compounds formed thereby

Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee