TW202344616A - 聚合性組成物、密封材、影像顯示裝置及影像顯示裝置之製造方法 - Google Patents

聚合性組成物、密封材、影像顯示裝置及影像顯示裝置之製造方法 Download PDF

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Publication number
TW202344616A
TW202344616A TW112104346A TW112104346A TW202344616A TW 202344616 A TW202344616 A TW 202344616A TW 112104346 A TW112104346 A TW 112104346A TW 112104346 A TW112104346 A TW 112104346A TW 202344616 A TW202344616 A TW 202344616A
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TW
Taiwan
Prior art keywords
polymerizable composition
mass
tertiary amine
parts
image display
Prior art date
Application number
TW112104346A
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English (en)
Chinese (zh)
Inventor
舘野航太郎
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日商三井化學股份有限公司
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Publication of TW202344616A publication Critical patent/TW202344616A/zh

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    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/68Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G65/00Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule
    • C08G65/02Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from cyclic ethers by opening of the heterocyclic ring
    • C08G65/04Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from cyclic ethers by opening of the heterocyclic ring from cyclic ethers only
    • C08G65/06Cyclic ethers having no atoms other than carbon and hydrogen outside the ring
    • C08G65/16Cyclic ethers having four or more ring atoms
    • C08G65/18Oxetanes
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00Use of organic ingredients
    • C08K5/16Nitrogen-containing compounds
    • C08K5/17Amines; Quaternary ammonium compounds
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00Use of organic ingredients
    • C08K5/16Nitrogen-containing compounds
    • C08K5/34Heterocyclic compounds having nitrogen in the ring
    • C08K5/3412Heterocyclic compounds having nitrogen in the ring having one nitrogen atom in the ring
    • C08K5/3432Six-membered rings
    • C08K5/3435Piperidines
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L71/00Compositions of polyethers obtained by reactions forming an ether link in the main chain; Compositions of derivatives of such polymers
    • C08L71/02Polyalkylene oxides
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09KMATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00Materials not provided for elsewhere
    • C09K3/10Materials in mouldable or extrudable form for sealing or packing joints or covers
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05BELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00Electroluminescent light sources
    • H05B33/02Details
    • H05B33/04Sealing arrangements, e.g. against humidity
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00Organic light-emitting devices
    • H10K50/80Constructional details
    • H10K50/84Passivation; Containers; Encapsulations
    • H10K50/844Encapsulations
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10OLED displays

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Sealing Material Composition (AREA)
  • Epoxy Resins (AREA)
TW112104346A 2022-02-08 2023-02-08 聚合性組成物、密封材、影像顯示裝置及影像顯示裝置之製造方法 TW202344616A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2022017939 2022-02-08
JP2022-017939 2022-02-08

Publications (1)

Publication Number Publication Date
TW202344616A true TW202344616A (zh) 2023-11-16

Family

ID=87564414

Family Applications (1)

Application Number Title Priority Date Filing Date
TW112104346A TW202344616A (zh) 2022-02-08 2023-02-08 聚合性組成物、密封材、影像顯示裝置及影像顯示裝置之製造方法

Country Status (2)

Country Link
TW (1) TW202344616A (ja)
WO (1) WO2023153387A1 (ja)

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4012426B2 (ja) * 2002-04-05 2007-11-21 理想科学工業株式会社 カチオン重合性組成物
JP2004099775A (ja) * 2002-09-10 2004-04-02 Fuji Photo Film Co Ltd セルロースアシレートフィルム、並びに該フィルムを用いた光学フィルム、液晶表示装置及びハロゲン化銀写真感光材料
JP4606907B2 (ja) * 2005-03-08 2011-01-05 富士フイルム株式会社 インク組成物、インクジェット記録方法、印刷物、平版印刷版の作製方法及び平版印刷版
JP4999393B2 (ja) * 2006-07-31 2012-08-15 旭化成ケミカルズ株式会社 カチオン系感光性組成物およびその硬化物
JP2009013315A (ja) * 2007-07-06 2009-01-22 Toyo Ink Mfg Co Ltd 封止用組成物
JP2009275080A (ja) * 2008-05-13 2009-11-26 Konica Minolta Ij Technologies Inc 活性エネルギー線硬化性組成物及びインクジェット用インク
JP2011080017A (ja) * 2009-10-09 2011-04-21 Denso Corp カチオン重合性組成物
JP5680668B2 (ja) * 2010-11-05 2015-03-04 株式会社日本触媒 カチオン硬化性樹脂組成物
JP7228343B2 (ja) * 2017-10-06 2023-02-24 株式会社Adeka 組成物及び硬化性組成物
KR20220016941A (ko) * 2019-07-05 2022-02-10 미쓰이 가가쿠 가부시키가이샤 유기 el 표시 소자용 봉지제 및 유기 el 표시 장치
JP2021059640A (ja) * 2019-10-03 2021-04-15 昭和電工マテリアルズ株式会社 光硬化性樹脂組成物及び樹脂硬化物の形成方法
BR112022012649A2 (pt) * 2019-12-27 2022-09-06 Cytec Ind Inc Material de acabamento de superfície, estrutura compósita, e, método para formar uma estrutura compósita

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Publication number Publication date
WO2023153387A1 (ja) 2023-08-17

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