TW202309118A - 環氧樹脂及含有該環氧樹脂之硬化性組成物 - Google Patents

環氧樹脂及含有該環氧樹脂之硬化性組成物 Download PDF

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Publication number
TW202309118A
TW202309118A TW111124758A TW111124758A TW202309118A TW 202309118 A TW202309118 A TW 202309118A TW 111124758 A TW111124758 A TW 111124758A TW 111124758 A TW111124758 A TW 111124758A TW 202309118 A TW202309118 A TW 202309118A
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TW
Taiwan
Prior art keywords
epoxy resin
aromatic
compound
resin
group
Prior art date
Application number
TW111124758A
Other languages
English (en)
Chinese (zh)
Inventor
廣田陽祐
矢本和久
青山和賢
Original Assignee
日商Ｄｉｃ股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商Ｄｉｃ股份有限公司 filed Critical 日商Ｄｉｃ股份有限公司
Publication of TW202309118A publication Critical patent/TW202309118A/zh

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/02—Polycondensates containing more than one epoxy group per molecule
    • C08G59/04—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof
    • C08G59/06—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof of polyhydric phenols
    • C08G59/063—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof of polyhydric phenols with epihalohydrins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/18—Manufacture of films or sheets
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/036—Multilayers with layers of different types
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • H10W74/47—Encapsulations, e.g. protective coatings characterised by their materials comprising organic materials, e.g. plastics or resins
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • H10W74/47—Encapsulations, e.g. protective coatings characterised by their materials comprising organic materials, e.g. plastics or resins
    • H10W74/476—Organic materials comprising silicon
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2363/00—Characterised by the use of epoxy resins; Derivatives of epoxy resins

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Epoxy Resins (AREA)
  • Polyoxymethylene Polymers And Polymers With Carbon-To-Carbon Bonds (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
TW111124758A 2021-07-01 2022-07-01 環氧樹脂及含有該環氧樹脂之硬化性組成物 TW202309118A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2021110380A JP7848449B2 (ja) 2021-07-01 2021-07-01 エポキシ樹脂及び当該エポキシ樹脂を含有する硬化性組成物
JP2021-110380 2021-07-01

Publications (1)

Publication Number Publication Date
TW202309118A true TW202309118A (zh) 2023-03-01

Family

ID=84737368

Family Applications (1)

Application Number Title Priority Date Filing Date
TW111124758A TW202309118A (zh) 2021-07-01 2022-07-01 環氧樹脂及含有該環氧樹脂之硬化性組成物

Country Status (4)

Country Link
JP (1) JP7848449B2 (https=)
KR (1) KR20230005755A (https=)
CN (1) CN115558083A (https=)
TW (1) TW202309118A (https=)

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3206672B2 (ja) * 1991-03-29 2001-09-10 大日本インキ化学工業株式会社 エポキシ樹脂硬化剤及びエポキシ樹脂組成物
JPH051131A (ja) * 1991-06-25 1993-01-08 Dainippon Ink & Chem Inc 合成樹脂の製造方法、エポキシ樹脂硬化剤、エポキシ樹脂の製造方法及びエポキシ樹脂組成物
JPH0656964A (ja) * 1991-09-30 1994-03-01 Dainippon Ink & Chem Inc 電子部品用エポキシ樹脂組成物、エポキシ樹脂およびエポキシ樹脂の製造方法
JPH09255758A (ja) * 1996-03-25 1997-09-30 Nippon Steel Chem Co Ltd 新規エポキシ樹脂、その中間体及びそれらの製造法並びにそれらを用いたエポキシ樹脂組成物及びその硬化物
JPH11158255A (ja) * 1997-11-28 1999-06-15 Nippon Steel Chem Co Ltd 新規多価ヒドロキシ化合物、新規エポキシ樹脂、それらの製造方法、それらを用いたエポキシ樹脂組成物及びその硬化物
JP5548562B2 (ja) 2010-09-10 2014-07-16 新日鉄住金化学株式会社 多価ヒドロキシ樹脂、エポキシ樹脂、それらの製造方法、エポキシ樹脂組成物及びその硬化物
JP6799370B2 (ja) 2015-09-30 2020-12-16 日鉄ケミカル＆マテリアル株式会社 多価ヒドロキシ樹脂、エポキシ樹脂、それらの製造方法、エポキシ樹脂組成物及びその硬化物

Also Published As

Publication number Publication date
JP7848449B2 (ja) 2026-04-21
KR20230005755A (ko) 2023-01-10
CN115558083A (zh) 2023-01-03
JP2023007254A (ja) 2023-01-18

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