CN115558083A - 环氧树脂及含有该环氧树脂的固化性组合物 - Google Patents

环氧树脂及含有该环氧树脂的固化性组合物 Download PDF

Info

Publication number
CN115558083A
CN115558083A CN202210768226.0A CN202210768226A CN115558083A CN 115558083 A CN115558083 A CN 115558083A CN 202210768226 A CN202210768226 A CN 202210768226A CN 115558083 A CN115558083 A CN 115558083A
Authority
CN
China
Prior art keywords
epoxy resin
aromatic
compound
resin
group
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202210768226.0A
Other languages
English (en)
Chinese (zh)
Inventor
广田阳祐
矢本和久
青山和贤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
DIC Corp
Original Assignee
DIC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by DIC Corp filed Critical DIC Corp
Publication of CN115558083A publication Critical patent/CN115558083A/zh
Pending legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/02—Polycondensates containing more than one epoxy group per molecule
    • C08G59/04—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof
    • C08G59/06—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof of polyhydric phenols
    • C08G59/063—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof of polyhydric phenols with epihalohydrins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/18—Manufacture of films or sheets
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/036—Multilayers with layers of different types
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • H10W74/47—Encapsulations, e.g. protective coatings characterised by their materials comprising organic materials, e.g. plastics or resins
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • H10W74/47—Encapsulations, e.g. protective coatings characterised by their materials comprising organic materials, e.g. plastics or resins
    • H10W74/476—Organic materials comprising silicon
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2363/00—Characterised by the use of epoxy resins; Derivatives of epoxy resins

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Epoxy Resins (AREA)
  • Polyoxymethylene Polymers And Polymers With Carbon-To-Carbon Bonds (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
CN202210768226.0A 2021-07-01 2022-06-30 环氧树脂及含有该环氧树脂的固化性组合物 Pending CN115558083A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2021110380A JP7848449B2 (ja) 2021-07-01 2021-07-01 エポキシ樹脂及び当該エポキシ樹脂を含有する硬化性組成物
JP2021-110380 2021-07-01

Publications (1)

Publication Number Publication Date
CN115558083A true CN115558083A (zh) 2023-01-03

Family

ID=84737368

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202210768226.0A Pending CN115558083A (zh) 2021-07-01 2022-06-30 环氧树脂及含有该环氧树脂的固化性组合物

Country Status (4)

Country Link
JP (1) JP7848449B2 (https=)
KR (1) KR20230005755A (https=)
CN (1) CN115558083A (https=)
TW (1) TW202309118A (https=)

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3206672B2 (ja) * 1991-03-29 2001-09-10 大日本インキ化学工業株式会社 エポキシ樹脂硬化剤及びエポキシ樹脂組成物
JPH051131A (ja) * 1991-06-25 1993-01-08 Dainippon Ink & Chem Inc 合成樹脂の製造方法、エポキシ樹脂硬化剤、エポキシ樹脂の製造方法及びエポキシ樹脂組成物
JPH0656964A (ja) * 1991-09-30 1994-03-01 Dainippon Ink & Chem Inc 電子部品用エポキシ樹脂組成物、エポキシ樹脂およびエポキシ樹脂の製造方法
JPH09255758A (ja) * 1996-03-25 1997-09-30 Nippon Steel Chem Co Ltd 新規エポキシ樹脂、その中間体及びそれらの製造法並びにそれらを用いたエポキシ樹脂組成物及びその硬化物
JPH11158255A (ja) * 1997-11-28 1999-06-15 Nippon Steel Chem Co Ltd 新規多価ヒドロキシ化合物、新規エポキシ樹脂、それらの製造方法、それらを用いたエポキシ樹脂組成物及びその硬化物
JP5548562B2 (ja) 2010-09-10 2014-07-16 新日鉄住金化学株式会社 多価ヒドロキシ樹脂、エポキシ樹脂、それらの製造方法、エポキシ樹脂組成物及びその硬化物
JP6799370B2 (ja) 2015-09-30 2020-12-16 日鉄ケミカル＆マテリアル株式会社 多価ヒドロキシ樹脂、エポキシ樹脂、それらの製造方法、エポキシ樹脂組成物及びその硬化物

Also Published As

Publication number Publication date
JP7848449B2 (ja) 2026-04-21
KR20230005755A (ko) 2023-01-10
TW202309118A (zh) 2023-03-01
JP2023007254A (ja) 2023-01-18

Similar Documents

Publication Publication Date Title
JP5648832B2 (ja) 熱硬化性樹脂組成物、その硬化物、活性エステル樹脂、半導体封止材料、プリプレグ、回路基板、及びビルドアップフィルム
JP7625940B2 (ja) 活性エステル、硬化性樹脂組成物、及び、硬化物
JP5146793B2 (ja) リン原子含有オリゴマー組成物、硬化性樹脂組成物、その硬化物、及びプリント配線基板
JP6809200B2 (ja) エポキシ樹脂、硬化性樹脂組成物及びその硬化物
JP2023074976A (ja) 多価ヒドロキシ樹脂
WO2014208132A1 (ja) フェノール性水酸基含有化合物、フェノール樹脂、硬化性組成物、その硬化物、半導体封止材料、及びプリント配線基板
JP7739969B2 (ja) エポキシ樹脂組成物及びその製造方法、硬化性組成物、硬化物、半導体封止材料、半導体装置、プリプレグ、回路基板、並びに、ビルドアップフィルム
JP2020100728A (ja) フェノキシ樹脂、その樹脂組成物、その硬化物、およびその製造方法。
JP5850228B2 (ja) 硬化性樹脂組成物、その硬化物、シアン酸エステル樹脂、半導体封止材料、プリプレグ、回路基板、及び、ビルドアップフィルム
JP6809206B2 (ja) エポキシ樹脂、硬化性樹脂組成物及びその硬化物
JP7848449B2 (ja) エポキシ樹脂及び当該エポキシ樹脂を含有する硬化性組成物
TW202231706A (zh) 環氧樹脂、硬化性組成物、硬化物、半導體封裝材料、半導體裝置、預浸漬物、電路基板、及增層薄膜
JP2023074975A (ja) 半導体封止用樹脂組成物、半導体封止材料及び半導体装置
JP2023074977A (ja) 半導体封止用樹脂組成物、半導体封止材料及び半導体装置
WO2019188333A1 (ja) 硬化性組成物及びその硬化物
JP7739968B2 (ja) エポキシ樹脂
KR102871799B1 (ko) 에폭시 수지, 경화성 조성물, 경화물, 반도체 봉지 재료, 반도체 장치, 프리프레그, 회로 기판, 및, 빌드업 필름
CN117940478A (zh) 酚树脂、环氧树脂、固化性树脂组合物、固化物、纤维增强复合材料、及纤维增强树脂成型品
JP5637367B2 (ja) 硬化性樹脂組成物、その硬化物、リン原子含有フェノール樹脂の製造方法、プリント配線基板用樹脂組成物、プリント配線基板、フレキシブル配線基板用樹脂組成物、半導体封止材料用樹脂組成物、及びビルドアップ基板用層間絶縁材料用樹脂組成物
JP7541664B2 (ja) エポキシ樹脂組成物、硬化物、半導体封止材、及び、半導体装置
JP6137607B2 (ja) フェノール性水酸基含有樹脂、フェノール性水酸基含有樹脂の製造方法、硬化性樹脂組成物、その硬化物、及び放熱樹脂材料
JP7541665B2 (ja) エポキシ樹脂、エポキシ樹脂組成物、硬化物、半導体封止材、及び、半導体装置
JP6750427B2 (ja) 多官能エポキシ樹脂、その製造方法、硬化性樹脂組成物及びその硬化物
TW202225245A (zh) 環氧樹脂、環氧樹脂組成物、半導體封裝材料、及半導體裝置
CN120098161A (zh) 活性酯树脂、树脂组合物、固化物及含酚性羟基的树脂

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination