TW202224231A - 安裝構造體、ｌｅｄ顯示器及安裝方法 - Google Patents

安裝構造體、ｌｅｄ顯示器及安裝方法 Download PDF

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Publication number
TW202224231A
TW202224231A TW110133220A TW110133220A TW202224231A TW 202224231 A TW202224231 A TW 202224231A TW 110133220 A TW110133220 A TW 110133220A TW 110133220 A TW110133220 A TW 110133220A TW 202224231 A TW202224231 A TW 202224231A
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TW
Taiwan
Prior art keywords
mold
ink
electrodes
printing method
substrate
Prior art date
Application number
TW110133220A
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English (en)
Chinese (zh)
Inventor
三宅弘人
稲田佳信
Original Assignee
日商大賽璐股份有限公司
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Filing date
Publication date
Application filed by 日商大賽璐股份有限公司 filed Critical 日商大賽璐股份有限公司
Publication of TW202224231A publication Critical patent/TW202224231A/zh

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/01—Manufacture or treatment
    • H10H20/011—Manufacture or treatment of bodies, e.g. forming semiconductor layers
    • H10H20/018—Bonding of wafers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41M—PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
    • B41M1/00—Inking and printing with a printer's forme
    • B41M1/02—Letterpress printing, e.g. book printing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41M—PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
    • B41M1/00—Inking and printing with a printer's forme
    • B41M1/10—Intaglio printing ; Gravure printing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41N—PRINTING PLATES OR FOILS; MATERIALS FOR SURFACES USED IN PRINTING MACHINES FOR PRINTING, INKING, DAMPING, OR THE LIKE; PREPARING SUCH SURFACES FOR USE AND CONSERVING THEM
    • B41N1/00—Printing plates or foils; Materials therefor
    • B41N1/003—Printing plates or foils; Materials therefor with ink abhesive means or abhesive forming means, such as abhesive siloxane or fluoro compounds, e.g. for dry lithographic printing
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
    • G09F9/33—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being semiconductor devices, e.g. diodes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/857—Interconnections, e.g. lead-frames, bond wires or solder balls
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/01—Manufacture or treatment
    • H10H20/036—Manufacture or treatment of packages
    • H10H20/0364—Manufacture or treatment of packages of interconnections
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/01—Manufacture or treatment
    • H10W70/05—Manufacture or treatment of insulating or insulated package substrates, or of interposers, or of redistribution layers
    • H10W70/098—Applying pastes or inks, e.g. screen printing
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Led Device Packages (AREA)
TW110133220A 2020-09-07 2021-09-07 安裝構造體、ｌｅｄ顯示器及安裝方法 TW202224231A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2020-150001 2020-09-07
JP2020150001 2020-09-07

Publications (1)

Publication Number Publication Date
TW202224231A true TW202224231A (zh) 2022-06-16

Family

ID=80491111

Family Applications (1)

Application Number Title Priority Date Filing Date
TW110133220A TW202224231A (zh) 2020-09-07 2021-09-07 安裝構造體、ｌｅｄ顯示器及安裝方法

Country Status (7)

Country Link
US (1) US20230282763A1 (https=)
EP (1) EP4213195A4 (https=)
JP (1) JPWO2022050353A1 (https=)
KR (1) KR20230061522A (https=)
CN (1) CN115956288A (https=)
TW (1) TW202224231A (https=)
WO (1) WO2022050353A1 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102741605B1 (ko) * 2022-05-25 2024-12-16 한국기계연구원 나노 클러스터를 이용한 대면적 투명 반사 패널 및 이의 제조 방법
EP4555248A1 (en) 2022-07-15 2025-05-21 Fraenkel Wright Limited Gas storage using liquid for gas displacement

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07212015A (ja) * 1994-01-12 1995-08-11 Matsushita Electric Ind Co Ltd 電子部品実装方法および電子部品実装機
JP3952995B2 (ja) * 2003-06-13 2007-08-01 セイコーエプソン株式会社 光導波路の形成方法
US7195733B2 (en) * 2004-04-27 2007-03-27 The Board Of Trustees Of The University Of Illinois Composite patterning devices for soft lithography
JP4539284B2 (ja) 2004-10-26 2010-09-08 パナソニック株式会社 発光素子実装構造体および発光素子実装構造体の製造方法
JP2007110054A (ja) 2005-10-17 2007-04-26 Hyogo Prefecture パターン形成方法およびパターン形成ずみ基板
JP4853078B2 (ja) * 2006-03-30 2012-01-11 凸版印刷株式会社 印刷方法、電極パターンの形成方法及び薄膜トランジスタの形成方法
JP2010219447A (ja) * 2009-03-18 2010-09-30 Toppan Printing Co Ltd 有機トランジスタ用インク、有機トランジスタの電極及びその形成方法並びに有機トランジスタ
JP2010278228A (ja) * 2009-05-28 2010-12-09 Seiko Epson Corp 接合方法および接合体
JP5416153B2 (ja) * 2010-03-18 2014-02-12 古河電気工業株式会社 導電性ペースト、及びその製造方法、並びに導電接続部材
JP2012119572A (ja) * 2010-12-02 2012-06-21 Shimadzu Corp 転写印刷用スタンプ製造方法および電子デバイス
JP5838692B2 (ja) * 2011-09-27 2016-01-06 凸版印刷株式会社 Ｃｍｏｓ半導体装置の製造方法
JP2014013868A (ja) * 2012-07-05 2014-01-23 Nec Corp マイクロコンタクトプリント装置およびマイクロコンタクトプリント方法
JP2016167471A (ja) * 2013-07-09 2016-09-15 株式会社ダイセル 銀ナノ粒子を用いた半導体装置及びその製造方法
JP7130631B2 (ja) * 2017-05-18 2022-09-05 株式会社ダイセル 導体の製造方法、配線基板の製造方法及び導体形成用組成物の製造方法
KR102454083B1 (ko) * 2017-08-30 2022-10-12 엘지디스플레이 주식회사 마이크로-led 표시장치 및 그 제조방법
JP2020150001A (ja) 2019-03-11 2020-09-17 株式会社リコー 受光回路、受光素子及びａｐｄアレイ装置

Also Published As

Publication number Publication date
EP4213195A1 (en) 2023-07-19
EP4213195A4 (en) 2024-08-21
JPWO2022050353A1 (https=) 2022-03-10
KR20230061522A (ko) 2023-05-08
US20230282763A1 (en) 2023-09-07
WO2022050353A1 (ja) 2022-03-10
CN115956288A (zh) 2023-04-11

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