CN115956288A - 安装构造体、led显示器以及安装方法 - Google Patents

安装构造体、led显示器以及安装方法 Download PDF

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Publication number
CN115956288A
CN115956288A CN202180050328.2A CN202180050328A CN115956288A CN 115956288 A CN115956288 A CN 115956288A CN 202180050328 A CN202180050328 A CN 202180050328A CN 115956288 A CN115956288 A CN 115956288A
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CN
China
Prior art keywords
mold
printing method
ink
substrate
mounting structure
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202180050328.2A
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English (en)
Chinese (zh)
Inventor
三宅弘人
稻田佳信
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Daicel Corp
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Daicel Corp
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Filing date
Publication date
Application filed by Daicel Corp filed Critical Daicel Corp
Publication of CN115956288A publication Critical patent/CN115956288A/zh
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/01—Manufacture or treatment
    • H10H20/011—Manufacture or treatment of bodies, e.g. forming semiconductor layers
    • H10H20/018—Bonding of wafers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41M—PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
    • B41M1/00—Inking and printing with a printer's forme
    • B41M1/02—Letterpress printing, e.g. book printing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41M—PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
    • B41M1/00—Inking and printing with a printer's forme
    • B41M1/10—Intaglio printing ; Gravure printing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41N—PRINTING PLATES OR FOILS; MATERIALS FOR SURFACES USED IN PRINTING MACHINES FOR PRINTING, INKING, DAMPING, OR THE LIKE; PREPARING SUCH SURFACES FOR USE AND CONSERVING THEM
    • B41N1/00—Printing plates or foils; Materials therefor
    • B41N1/003—Printing plates or foils; Materials therefor with ink abhesive means or abhesive forming means, such as abhesive siloxane or fluoro compounds, e.g. for dry lithographic printing
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
    • G09F9/33—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being semiconductor devices, e.g. diodes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/857—Interconnections, e.g. lead-frames, bond wires or solder balls
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/01—Manufacture or treatment
    • H10H20/036—Manufacture or treatment of packages
    • H10H20/0364—Manufacture or treatment of packages of interconnections
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/01—Manufacture or treatment
    • H10W70/05—Manufacture or treatment of insulating or insulated package substrates, or of interposers, or of redistribution layers
    • H10W70/098—Applying pastes or inks, e.g. screen printing
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Led Device Packages (AREA)
CN202180050328.2A 2020-09-07 2021-09-02 安装构造体、led显示器以及安装方法 Pending CN115956288A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2020-150001 2020-09-07
JP2020150001 2020-09-07
PCT/JP2021/032303 WO2022050353A1 (ja) 2020-09-07 2021-09-02 実装構造体、ｌｅｄディスプレイ、及び実装方法

Publications (1)

Publication Number Publication Date
CN115956288A true CN115956288A (zh) 2023-04-11

Family

ID=80491111

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202180050328.2A Pending CN115956288A (zh) 2020-09-07 2021-09-02 安装构造体、led显示器以及安装方法

Country Status (7)

Country Link
US (1) US20230282763A1 (https=)
EP (1) EP4213195A4 (https=)
JP (1) JPWO2022050353A1 (https=)
KR (1) KR20230061522A (https=)
CN (1) CN115956288A (https=)
TW (1) TW202224231A (https=)
WO (1) WO2022050353A1 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102741605B1 (ko) * 2022-05-25 2024-12-16 한국기계연구원 나노 클러스터를 이용한 대면적 투명 반사 패널 및 이의 제조 방법
EP4555248A1 (en) 2022-07-15 2025-05-21 Fraenkel Wright Limited Gas storage using liquid for gas displacement

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20050016217A1 (en) * 2003-06-13 2005-01-27 Seiko Epson Corporation Method for manufacturing optical waveguide, optical waveguide device, electro-optical apparatus and electronic apparatus
US20050238967A1 (en) * 2004-04-27 2005-10-27 The Board Of Trustees Of The University Of Illinois Composite patterning devices for soft lithography
JP2010219447A (ja) * 2009-03-18 2010-09-30 Toppan Printing Co Ltd 有機トランジスタ用インク、有機トランジスタの電極及びその形成方法並びに有機トランジスタ
JP2010278228A (ja) * 2009-05-28 2010-12-09 Seiko Epson Corp 接合方法および接合体
JP2012119572A (ja) * 2010-12-02 2012-06-21 Shimadzu Corp 転写印刷用スタンプ製造方法および電子デバイス
JP2013074041A (ja) * 2011-09-27 2013-04-22 Toppan Printing Co Ltd Ｃｍｏｓ半導体装置の製造方法及びｃｍｏｓ半導体装置
JP2014013868A (ja) * 2012-07-05 2014-01-23 Nec Corp マイクロコンタクトプリント装置およびマイクロコンタクトプリント方法
JP2016167471A (ja) * 2013-07-09 2016-09-15 株式会社ダイセル 銀ナノ粒子を用いた半導体装置及びその製造方法
WO2018212345A1 (ja) * 2017-05-18 2018-11-22 学校法人芝浦工業大学 導体の製造方法、配線基板の製造方法及び導体形成用組成物

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07212015A (ja) * 1994-01-12 1995-08-11 Matsushita Electric Ind Co Ltd 電子部品実装方法および電子部品実装機
JP4539284B2 (ja) 2004-10-26 2010-09-08 パナソニック株式会社 発光素子実装構造体および発光素子実装構造体の製造方法
JP2007110054A (ja) 2005-10-17 2007-04-26 Hyogo Prefecture パターン形成方法およびパターン形成ずみ基板
JP4853078B2 (ja) * 2006-03-30 2012-01-11 凸版印刷株式会社 印刷方法、電極パターンの形成方法及び薄膜トランジスタの形成方法
JP5416153B2 (ja) * 2010-03-18 2014-02-12 古河電気工業株式会社 導電性ペースト、及びその製造方法、並びに導電接続部材
KR102454083B1 (ko) * 2017-08-30 2022-10-12 엘지디스플레이 주식회사 마이크로-led 표시장치 및 그 제조방법
JP2020150001A (ja) 2019-03-11 2020-09-17 株式会社リコー 受光回路、受光素子及びａｐｄアレイ装置

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20050016217A1 (en) * 2003-06-13 2005-01-27 Seiko Epson Corporation Method for manufacturing optical waveguide, optical waveguide device, electro-optical apparatus and electronic apparatus
US20050238967A1 (en) * 2004-04-27 2005-10-27 The Board Of Trustees Of The University Of Illinois Composite patterning devices for soft lithography
JP2010219447A (ja) * 2009-03-18 2010-09-30 Toppan Printing Co Ltd 有機トランジスタ用インク、有機トランジスタの電極及びその形成方法並びに有機トランジスタ
JP2010278228A (ja) * 2009-05-28 2010-12-09 Seiko Epson Corp 接合方法および接合体
JP2012119572A (ja) * 2010-12-02 2012-06-21 Shimadzu Corp 転写印刷用スタンプ製造方法および電子デバイス
JP2013074041A (ja) * 2011-09-27 2013-04-22 Toppan Printing Co Ltd Ｃｍｏｓ半導体装置の製造方法及びｃｍｏｓ半導体装置
JP2014013868A (ja) * 2012-07-05 2014-01-23 Nec Corp マイクロコンタクトプリント装置およびマイクロコンタクトプリント方法
JP2016167471A (ja) * 2013-07-09 2016-09-15 株式会社ダイセル 銀ナノ粒子を用いた半導体装置及びその製造方法
WO2018212345A1 (ja) * 2017-05-18 2018-11-22 学校法人芝浦工業大学 導体の製造方法、配線基板の製造方法及び導体形成用組成物

Also Published As

Publication number Publication date
EP4213195A1 (en) 2023-07-19
TW202224231A (zh) 2022-06-16
EP4213195A4 (en) 2024-08-21
JPWO2022050353A1 (https=) 2022-03-10
KR20230061522A (ko) 2023-05-08
US20230282763A1 (en) 2023-09-07
WO2022050353A1 (ja) 2022-03-10

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Application publication date: 20230411