TW202217875A - 金屬磁粉芯一體式晶片電感的製備方法 - Google Patents
金屬磁粉芯一體式晶片電感的製備方法 Download PDFInfo
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Abstract
本發明提供的金屬磁粉芯一體式晶片電感的製備方法,它包括有以下步驟:繞制空心線圈、模壓成型、一次倒角、熱壓固化、二次倒角、一次納米絕緣包覆、一次研磨、電極鍍銅、二次納米絕緣包覆、二次研磨、電鍍金屬化電極、測試包裝。本發明的金屬磁粉芯一體式晶片電感,只保留底部電極並用納米絕緣材料包覆產品本體,節省了漿料封端電鍍型、料片點焊電極型一體成型電感產品的側面堆錫尺寸,從而減小產品在電路板上的安裝尺寸,增加了積體電路PCB板的安裝空間,為積體電路產業的高度集成化發展創造有利條件;在尺寸相同情況下產品綜合性能大幅提升。
Description
本發明涉及電感技術,尤其是指金屬磁粉芯一體式晶片電感的製備方法。
傳統電感包括有漿料封端電鍍型一體成型電感、料片點焊電極型一體成型電感、T~core電極型一體成型電感;其中漿料封端電鍍型一體成型電感的體積較小,在對電感進行貼片安裝時,側面堆錫面積大,減小了積體電路密集度,浪費了電路板的空間。同時漿料封端電鍍型一體成型電感在電極焊接位置包括本體有4個金屬層,分別是銅/銀/鎳/錫,4個金屬層之間容易形成寄生電容,增加了電感的直流電阻,降低了電感的自諧振頻率;料片點焊電極型一體成型電感的引線框架是從產品側邊折彎到底部,折彎幅度和框架厚度會使得產品長度尺寸變長並限制線圈設計導致產品特性受限,浪費了電路板空間的同時,減小積體電路密集度;T~core電極型一體成型電感的生產投入較大且產出低,產品的生產成本很高,不利於大規模生產,難以快速滿足市場需求。
本發明的目的在於提供一種只保留底部電極並採用納米絕緣材料包覆產品本體的金屬磁粉芯一體式晶片電感,節省了漿料封端電鍍型、料片點焊電極型一體式晶片電感產品的側面堆錫尺寸,從而減小產品在電路板上的安裝尺寸,增加了積體電路PCB板的安裝空間,為積體電路產業的高度集成化發展創造有利條件;在尺寸相同情況下產品綜合性能大幅提升。
為實現上述目的,本發明所提供的技術方案為:金屬磁粉芯一體式晶片電感的製備方法,其特徵在於:它包括有以下步驟:繞制空心線圈、模壓成型、一次倒角、熱壓固化、二次倒角、一次納米絕緣包覆、一次研磨、電極鍍銅、二次納米絕緣包覆、二次研磨、電鍍金屬化電極、測試包裝。
作為上述工藝的優選步驟:所述空心線圈的繞制,其繞制方式採用在繞線治具上多軸整齊並繞,漆包線絕緣漆膜不能刮傷或壓傷,而且要達到相應的特性要求。
作為上述工藝的優選步驟:所述模壓成型是通過將含空心線圈的繞線治具放入成型機的模具中,再將線圈定點植入模腔,在模腔中注入微米級軟磁金屬粉末,金屬粉末將空心線圈完全包裹後衝壓成型;成型密度不小於3g/cm³。
作為上述工藝的優選步驟:所述的一次倒角是將模壓成型製品,按製品重量與倒角介質以一定比例混合後放入倒角設備完成倒角作業。
作為上述工藝的優選步驟:所述熱壓固化是將製品整齊排版放入熱壓設備型腔內,熱壓設備型腔的溫度控制不小於150℃,使用不小於0.5噸壓力進行不低於10分鐘的保壓完成熱壓固化作業。
作為上述工藝的優選步驟:所述的二次倒角是將熱壓後的製品按製品重量與倒角介質以一定比例混合後放入倒角設備完成二次倒角作業。
作為上述工藝的優選步驟:所述的一次納米絕緣包覆是使用聚醯亞胺系納米材料對製品表面進行絕緣包覆處理,絕緣層厚度為不低於5um,製品包覆後在150℃以上烘烤1小時以上固化絕緣層。
作為上述工藝的優選步驟:所述的一次研磨是將製品整齊排列到治具內,使用高精密磨床對製品進行研磨作業,製品單邊研磨不小於5um並露出製品兩端導電線銅介面和製品底部的兩個電極面。
作為上述工藝的優選步驟:所述的電極鍍銅是將一次研磨後的製品電鍍一層不小於10um的銅層。
作為上述工藝的優選步驟:所述的二次納米絕緣包覆是使用聚醯亞胺系納米材料對製品表面進行絕緣包覆處理,絕緣層厚度為不低於5um,製品包覆後在150℃以上烘烤1小時以上固化絕緣層。
作為上述工藝的優選步驟:所述的二次研磨是將製品整齊排列到治具內,使用高精密磨床對製品進行研磨作業,製品單邊研磨不小於5um並露出製品底部銅導體鍍層。
作為上述工藝的優選步驟:所述的電鍍金屬化電極是將製品採用離子鍍膜技術(PVD技術)或傳統電鍍工藝,在原一次鍍好銅的表面上再增加所需要的金屬及合金材料鍍層,以增加製品可焊性,耐焊性和附著力。
作為上述工藝的優選步驟:所述的測試包裝是將製品進行全自動測試包裝以剔除尺寸及特性不良品並將製品包入載帶。
本發明的技術優勢在於:
1)、本發明的技術優勢在於提供一種只保留底部電極並採用納米絕緣材料包覆產品本體的金屬磁粉芯一體式晶片電感,節省了漿料封端電鍍型、料片點焊電極型一體成型電感產品的側面堆錫尺寸,從而減小產品在電路板上的安裝尺寸,增加了積體電路PCB板的安裝空間,為積體電路產業的高度集成化發展創造有利條件;在尺寸相同情況下產品綜合性能大幅提升。
2)、製造過程使用離子鍍膜技術或傳統的電鍍工藝,在提升鍍層緻密性的同時將鍍層從4層降低為2層,從而節約製造成本,提高制程良率。
3)、採用新的納米絕緣包覆材料和納米絕緣包覆工藝將產品絕緣塗層厚度做到5um以上,絕緣包覆材料為熱固型環保聚酯亞胺系材料。
下面結合所有附圖對本發明作進一步說明,參見附圖1,本發明的較佳實施例為:
金屬磁粉芯一體式晶片電感的製備方法包括以下步驟:繞制空心線圈、模壓成型、一次倒角、熱壓固化、二次倒角、一次納米絕緣包覆、一次研磨、電極鍍銅、二次納米絕緣包覆、二次研磨、電鍍金屬化電極、測試包裝;
其中,
第一步驟:繞制空心線圈:根據製品規格設定要求製作空心線圈;其繞制方式採用在繞線治具上多軸整齊並繞,漆包線表皮絕緣漆膜不能刮傷或壓傷,而且要達到相應的特性要求。漆包線的選取及繞制經過反復試驗,取得了可以批量生產的繞線設備參數及線材的規格資料。繞線方式採用在繞線治具上多軸並繞,在節省料片的同時提升繞線速度。
第二步驟:模壓成型:採用羰基鐵粉或合金材料(鐵矽,鐵矽鉻,鐵鎳,鐵矽鋁及非晶納米等材料體系)成型、研發團隊經過多次的試驗,記錄資料,統計分析後篩選出最佳的羰基粉末成份配方如下:
將羰基鐵粉或合金材料與環氧樹脂及丙酮按照重量比例100:5:15混合均勻,然後在溫度為65℃條件下保溫2小時,然後進行粉碎造粒,製備的粉末需要滿足球形度≥90%,且粉末粒徑滿足:D50≤30μm,D90≤90μm,D10≤20μm;(D10是顆粒累積分佈為10%的粒徑,即小於此粒徑的顆粒體積含量占全部顆粒的10%,D50是顆粒累積分佈為50%的粒徑。也叫中位徑或中值粒徑,這是一個表示粒度大小的典型值。D90是顆粒累積分佈為90%的粒徑。即小於此粒徑的顆粒體積含量占全部顆粒的90%。)環氧樹脂作為粘結劑,粉末造粒完成後添加硬脂酸鋅作為潤滑劑;
將含空心線圈的繞線治具放入成型機的模具中,再將線圈定點植入模腔,在模腔中注入微米級軟磁金屬粉末,金屬粉末將空心線圈完全包裹後衝壓成型;成型的密度為不小於3g/cm³。
成型機具體壓力的選取:壓力大了會把線圈的漆皮刮傷或壓傷,壓力不夠,生產出來的製品密度不足,會導致製品缺角、電感值低等不良,經過大量的試驗,統計資料篩選出既能滿足製品品質,生產效率及良品率最好的參數。
第三步驟:一次倒角:將模壓成型製品,按製品重量與倒角介質以一定比例混合後放入倒角設備完成倒角作業。
第四步驟:熱壓固化:將製品整齊排版放入熱壓設備型腔內,熱壓設備型腔的溫度控制不小於150℃,使用不小於0.5噸壓力進行不低於10分鐘的保壓完成熱壓固化作業。
第五步驟:二次倒角:將熱壓後的製品按製品重量與倒角介質以一定比例混合後放入倒角設備完成二次倒角作業。
第六步驟:一次納米絕緣包覆:使用聚醯亞胺系納米材料對製品表面進行絕緣包覆處理,絕緣層厚度為不低於5um,製品包覆後在150℃以上烘烤1小時以上固化絕緣層。
第七步驟:一次研磨:將製品整齊排列到治具內,使用高精密磨床對製品進行研磨作業,製品單邊研磨不小於5um並露出製品兩端導電線銅介面和製品底部的兩個電極面。
第八步驟:電鍍銅:將一次研磨後的製品電鍍一層不小於10um的銅層。
第九步驟:二次納米絕緣包覆:使用聚醯亞胺系納米材料對製品表面進行絕緣包覆處理,絕緣層厚度為不低於5um,製品包覆後在150℃以上烘烤1小時以上固化絕緣層。
第十步驟:二次研磨:將製品整齊排列到治具內,使用高精密磨床對製品進行研磨作業,製品單邊研磨不小於5um並露出製品底部銅導體鍍層。
第十一步驟:電鍍金屬化電極:將製品採用離子鍍膜技術(PVD技術)或傳統電鍍工藝,在原一次鍍好銅的表面上再增加所需要的金屬及合金材料鍍層,以增加製品可焊性,耐焊性和附著力。
第十二步驟:測試包裝:將製品進行全自動測試包裝以剔除尺寸及特性不良品並將製品包入載帶。
以上所述之實施例只為本發明之較佳實施例,並非以此限制本發明的實施範圍,故凡依本發明之形狀、原理所作的變化,均應涵蓋在本發明的保護範圍內。
無。
圖1為本發明的工藝流程圖。
無。
Claims (10)
- 金屬磁粉芯一體式晶片電感的製備方法,其中,它包括有以下步驟:繞制空心線圈、模壓成型、一次倒角、熱壓固化、二次倒角、一次納米絕緣包覆、一次研磨、電極鍍銅、二次納米絕緣包覆、二次研磨、電鍍金屬化電極、測試包裝。
- 如申請專利範圍第1項所述的金屬磁粉芯一體式晶片電感的製備方法,其中,所述空心線圈的繞制,其繞制方式採用在繞線治具上多軸整齊並繞,漆包線絕緣漆膜不能刮傷或壓傷,而且要達到相應的特性要求。
- 如申請專利範圍第1項所述的金屬磁粉芯一體式晶片電感的製備方法,其中,所述模壓成型是通過將含空心線圈的繞線治具放入成型機的模具中,再將線圈定點植入模腔,在模腔中注入微米級軟磁金屬粉末,金屬粉末將空心線圈完全包裹後衝壓成型;成型密度不小於3g/cm³。
- 如申請專利範圍第1項所述的金屬磁粉芯一體式晶片電感的製備方法,其中,所述的一次倒角是將模壓成型製品,按製品重量與倒角介質以一定比例混合後放入倒角設備完成倒角作業。
- 如申請專利範圍第1項所述的金屬磁粉芯一體式晶片電感的製備方法,其中,所述熱壓固化是將製品整齊排版放入熱壓設備型腔內,熱壓設備型腔的溫度控制不小於150℃,使用不小於0.5噸壓力進行不低於10分鐘的保壓完成熱壓固化作業。
- 如申請專利範圍第1項所述的金屬磁粉芯一體式晶片電感的製備方法,其中,所述的二次倒角是將熱壓固化後的製品按製品重量與倒角介質以一定比例混合後放入倒角設備完成二次倒角作業。
- 如申請專利範圍第1項所述的金屬磁粉芯一體式晶片電感的製備方法,其中,所述的一次納米絕緣包覆是使用聚醯亞胺系納米材料對製品表面進行絕緣包覆處理,絕緣層厚度為不低於5um,製品包覆後在150℃以上烘烤1小時以上固化絕緣層。
- 如申請專利範圍第1項所述的金屬磁粉芯一體式晶片電感的製備方法,其中,所述的一次研磨是將製品整齊排列到治具內,使用高精密磨床對製品進行研磨作業,製品單邊研磨不小於5um並露出製品兩端導電線銅介面和製品底部的兩個電極面。
- 如申請專利範圍第1項所述的金屬磁粉芯一體式晶片電感的製備方法,其中,所述的電鍍金屬化電極是將製品採用離子鍍膜技術(PVD技術)或傳統電鍍工藝,在原一次鍍好銅的表面上再增加所需要的金屬及合金材料鍍層,以增加製品可焊性,耐焊性和附著力。
- 如申請專利範圍第1項所述的金屬磁粉芯一體式晶片電感的製備方法,其中,所述的測試包裝是將製品進行全自動測試包裝以剔除尺寸及特性不良品並將製品包入載帶。
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