CN113737161A - 采用助导介质带动镍离子吸附的金属化磁芯及陶瓷芯 - Google Patents
采用助导介质带动镍离子吸附的金属化磁芯及陶瓷芯 Download PDFInfo
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- NLJMYIDDQXHKNR-UHFFFAOYSA-K sodium citrate Chemical compound O.O.[Na+].[Na+].[Na+].[O-]C(=O)CC(O)(CC([O-])=O)C([O-])=O NLJMYIDDQXHKNR-UHFFFAOYSA-K 0.000 claims description 6
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- KWSLGOVYXMQPPX-UHFFFAOYSA-N 5-[3-(trifluoromethyl)phenyl]-2h-tetrazole Chemical compound FC(F)(F)C1=CC=CC(C2=NNN=N2)=C1 KWSLGOVYXMQPPX-UHFFFAOYSA-N 0.000 claims description 3
- DBMJMQXJHONAFJ-UHFFFAOYSA-M Sodium laurylsulphate Chemical compound [Na+].CCCCCCCCCCCCOS([O-])(=O)=O DBMJMQXJHONAFJ-UHFFFAOYSA-M 0.000 claims description 3
- LGQLOGILCSXPEA-UHFFFAOYSA-L nickel sulfate Chemical compound [Ni+2].[O-]S([O-])(=O)=O LGQLOGILCSXPEA-UHFFFAOYSA-L 0.000 claims description 3
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Abstract
本发明提供一种采用助导介质带动镍离子吸附的金属化磁芯及陶瓷芯,选取烧附好的带有导电电极的工件;对工件进行镀前清洗;按比例将化学镍药液与纯净水混合,在器皿内加温后倒入加入工件和助导介质,通过助导介质带动药水内的镍离子吸附在电极表面形成镍层;通过筛分使工件与介质分离;将工件再次倒入筛网,放入原镀液继续进行化学镀镍;镀镍后将工件取出清洗,装入电镀滚筒,加入适当比例的助导介质,将电镀滚筒放入电镀槽,完成电镀作业。本方案节省了工艺,降低了原材料的使用,从而大大减少人工物力,可以实现资源节约,环境友好,为世界电子产业发展创造独特价值。
Description
技术领域
本发明涉及电感技术领域,尤其是指一种采用助导介质带动镍离子吸附的金属化磁芯及陶瓷芯。
背景技术
金属化磁芯及陶瓷芯(工件)端银后在传统电镀镍、电镀锡时,其具有以下缺点:
1)、产品质量不稳定,容易造成产品破损,附锡不良,低温上锡效果差;
2)、传统工艺受设备及人员影响大,产能较低;
3)、传统工艺的镍药水在电镀时,需要加温至50-60℃,加温时为敞开式加热,其会产生大量热气,造成大量气体挥发,废气处理难度大,不利于环保,且镍的分散性排放大,易造成人体过敏,对工人皮肤产生较大影响,不利于人体健康。
4、废水处理负荷重,易产生大量含镍废水,环保处理难度大,不利于绿色清洁发展理念。
5、传统为分散式电镀,废气难以收集和处理。
发明内容
本发明的目的在于提供一种对环境影响小,产品质量稳定的采用助导介质带动镍离子吸附的金属化磁芯及陶瓷芯。
为实现上述目的,本发明所提供的技术方案为:
采用助导介质带动镍离子吸附的金属化磁芯及陶瓷芯,它包括有以下步骤:
第一步骤:选取烧附好的带有导电电极的工件;
第二步骤:对工件进行镀前清洗;
第三步骤:按比例将化学镍药液与纯净水混合,在器皿内加温后倒入工件和助导介质,通过助导介质带动药水内的镍离子吸附在电极表面形成镍层;
第四步骤:通过筛分使工件与介质分离;
第五步骤:将工件再次倒入筛网,放入原镀液继续进行化学镀镍;
第六步骤:镀镍后将工件取出清洗,装入电镀滚筒,加入适当比例的助导介质,将电镀滚筒放入电镀槽,完成电镀作业。
化学镍药液由A液和B液制成,其中,
A液组份质量份为:硫酸镍20-40份、柠檬酸钠0.5-5份、醋酸钠0.5-5份、乳酸1-6份、水30-60份、十二烷基磺酸钠4-12份;
B液组份质量份为:次亚磷酸钠20-40份、醋酸钠3-7份、柠檬酸钠3-10份、糖精钠0.1-3份、乳酸2-8份、水30-60份。
第二步骤的清洗是在缸内按比例加入水和硫酸液,混合后将工件倒入缸内进行搅拌清洗,清洗时间不低于3秒,水和浓硫酸液的重量比为50:0.3-5。
第三步骤是将A液、B液与纯净水按比例混合后,A液、B液与纯净水的比例为1:1:5-10,加温至75℃以上,调整PH值在4.3-5.5之间,然后在药液内平铺纱网,倒入工件和助导介质倒入纱网并充分混合,工件和助导介质的比例为1:0.1-3,通过震荡搅动催化,助导介质带动药水内的镍离子快速吸附在工件电极表面形成一层致密的镍层,电镀时间为10钟以内,镍层厚度不低于0.15um。
第五步骤是将工件再次倒入筛网,放入原镀液继续进行化学镀镍,直至镍层厚度达到0.8um以上。
第六步骤是将工件取出,通过纯净水清洗干净,装入电镀滚筒,在电镀滚筒内加入适当比例的助导介质,工件与助导介质的比例为1:0.1-3,将电镀滚筒放入电镀槽,进行电镀作业,直至产品完成。
本发明的优点在于:
1、减少了滚镀式电镀流程;
2、不需要通电及镍块作为阳极的电化学置换反应过程;
3、本方案可以在较小或密闭的环境下集中生产,从而使废气可以集中收集和处理;
4、本方案节省了工艺,同时降低了原材料的使用,从而大大减少人工物力,节约了企业的生产成本,资源节约,环境友好。
5、实现了快速量产,使品质更稳定,有效实现了清洁生产的目的。
6、本方案应用于磁芯工业、陶瓷产业及高精密五金行业。
附图说明
图1为新旧工艺产品膜厚比较图表。
图2为新旧工艺基板剥离强度及残留率比较图表。
图3为盐雾实验图表。
图4为新旧工艺良品对比图表。
具体实施方式
下面结合所有附图对本发明作进一步说明,本发明的较佳实施例为:本实施例所述的采用助导介质带动镍离子吸附的金属化磁芯及陶瓷芯,它包括有以下步骤:
第一步骤:选取烧附好的带有导电电极的工件;
第二步骤:对工件进行镀前清洗;清洗是在缸内按比例加入水和硫酸液,混合后将工件倒入缸内进行搅拌清洗,清洗时间不低于3秒,水和浓硫酸液的重量比为50:0.3-5;
第三步骤:将化学镍药液(A液、B液)与纯净水按比例混合后倒入器皿,A液、B液与纯净水的比例为1:1:5-10,加温至75℃以上,调整PH值在4.3-5.5之间,然后在药液内平铺纱网,倒入工件和助导介质倒入纱网并充分混合,工件和助导介质的比例为1:0.1-3,通过震荡搅动催化,助导介质为钢珠或锆珠,助导介质带动药水内的镍离子快速吸附在工件电极表面形成一层致密的镍层,电镀时间为10钟以内,镍层厚度不低于0.15um;
化学镍药液由A液和B液制成,其中,
A液组份质量份为:硫酸镍20-40份、柠檬酸钠0.5-5份、醋酸钠0.5-5份、乳酸1-6份、水30-60份、十二烷基磺酸钠4-12份;
B液组份质量份为:次亚磷酸钠20-40份、醋酸钠3-7份、柠檬酸钠3-10份、糖精钠0.1-3份、乳酸2-8份、水30-60份;
第四步骤:通过筛分使工件与介质分离;
第五步骤:将工件再次倒入筛网,放入原镀液继续进行化学镀镍,直至镍层厚度达到0.8um以上;
第六步骤:将工件取出,通过纯净水清洗干净,装入电镀滚筒,在电镀滚筒内加入适当比例的助导介质,助导介质为钢珠或锆珠,工件与助导介质的比例为1:0.1-3,将电镀滚筒放入电镀锡槽或电镀金槽,进行电镀作业,直至产品完成。
采用上述工艺制备的产品参数见附图1,通过对比本方案的工件要大大优于传统工艺制作的工件。
采用上述方案后的技术优势在于:
1.电镀新工艺生产的产品可以满足所有的产品基本特性要求(例如:镀层膜厚,附着性,可焊性,耐焊性,基板剥离强度,残留率,跌落试验)及可靠性要求(盐雾试验,高温高湿试验)。
2.电镀新工艺生产的产品解决了之前易扩散,易附锡不良的情况。
3.电镀新工艺生产的产品储存不易发生镀层氧化发黑现象。
4.电镀新工艺相比旧工艺制程总不良率下降1.96%。
5.电镀新工艺生产的产品试产电感成品无不良,且可靠性验证合格。
6.电镀新工艺所有电镀原材料经检测满足法律法规要求,属于环保物料。
按上述工艺制备的电感器完全符合重点行业市场应用。如智能手机、穿戴式设备、无人机、VR/AR设备;车规级传感器和电池等电子元器件;工业机器人以及工业级电子元器件;高铁列车、航空航天、海洋工程装备、高技术船舶、能源装备等高端装备制造领域,以及海底光电缆、水下连接器等电子元器件使用。
以上所述之实施例只为本发明之较佳实施例,并非以此限制本发明的实施范围,故凡依本发明之形状、原理所作的变化,均应涵盖在本发明的保护范围内。
Claims (6)
1.采用助导介质带动镍离子吸附的金属化磁芯及陶瓷芯,其特征在于:它包括有以下步骤:
第一步骤:选取烧附好的带有导电电极的工件;
第二步骤:对工件进行镀前清洗;
第三步骤:按比例将化学镍药液与纯净水混合,在器皿内加温后倒入工件和助导介质,通过助导介质带动药水内的镍离子吸附在电极表面形成镍层;
第四步骤:通过筛分使工件与介质分离;
第五步骤:将工件再次倒入筛网,放入原镀液继续进行化学镀镍;
第六步骤:镀镍后将工件取出清洗,装入电镀滚筒,加入适当比例的助导介质,将电镀滚筒放入电镀槽,完成电镀作业。
2.根据权利要求1所述的采用助导介质带动镍离子吸附的金属化磁芯及陶瓷芯,其特征在于:化学镍药液由A液和B液制成,其中,
A液组份质量份为:硫酸镍20-40份、柠檬酸钠0.5-5份、醋酸钠0.5-5份、乳酸1-6份、水30-60份、十二烷基磺酸钠4-12份;
B液组份质量份为:次亚磷酸钠20-40份、醋酸钠3-7份、柠檬酸钠3-10份、糖精钠0.1-3份、乳酸2-8份、水30-60份。
3.根据权利要求1所述的采用助导介质带动镍离子吸附的金属化磁芯及陶瓷芯,其特征在于:第二步骤的清洗是在缸内按比例加入水和硫酸液,混合后将工件倒入缸内进行搅拌清洗,清洗时间不低于3秒,水和浓硫酸液的重量比为50:0.3-5。
4.根据权利要求1所述的采用助导介质带动镍离子吸附的金属化磁芯及陶瓷芯,其特征在于:第三步骤是将A液、B液与纯净水按比例混合后,A液、B液与纯净水的比例为1:1:5-10,加温至75℃以上,调整PH值在4.3-5.5之间,然后在药液内平铺纱网,将工件和助导介质倒入纱网并充分混合,工件和助导介质的比例为1:0.1-3,通过震荡搅动催化,助导介质带动药水内的镍离子快速吸附在工件电极表面形成一层致密的镍层,电镀时间为10钟以内,镍层厚度不低于0.15um。
5.根据权利要求1所述的采用助导介质带动镍离子吸附的金属化磁芯及陶瓷芯,其特征在于:第五步骤是将工件再次倒入筛网,放入原镀液继续进行化学镀镍,直至镍层厚度达到0.8um以上。
6.根据权利要求1所述的采用助导介质带动镍离子吸附的金属化磁芯及陶瓷芯,其特征在于:第六步骤是将工件取出,通过纯净水清洗干净,装入电镀滚筒,在电镀滚筒内加入适当比例的助导介质,工件与助导介质的比例为1:0.1-3,将电镀滚筒放入电镀槽,进行电镀作业,直至产品完成。
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Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4935305A (en) * | 1988-08-17 | 1990-06-19 | Takashi Kanehiro | Method of forming a plating layer on ceramic chip surfaces and electronic parts thereby manufactured |
US20160284451A1 (en) * | 2015-03-24 | 2016-09-29 | International Business Machines Corporation | High resistivity soft magnetic material for miniaturized power converter |
CN108251825A (zh) * | 2018-04-12 | 2018-07-06 | 朱玉兰 | 一种镀速快的铁氧磁芯化学镀镍溶液 |
CN108447661A (zh) * | 2018-05-14 | 2018-08-24 | 中山市科旗金属表面处理设备有限公司 | 一种电感磁芯及其制造工艺 |
CN110706879A (zh) * | 2019-11-05 | 2020-01-17 | 湖南创一电子科技股份有限公司 | 一种高性能锰锌smd贴片电感及其生产工艺 |
CN112164570A (zh) * | 2020-10-19 | 2021-01-01 | 湖南创一电子科技股份有限公司 | 金属磁粉芯一体式芯片电感的制备方法 |
-
2021
- 2021-02-02 CN CN202110139473.XA patent/CN113737161A/zh active Pending
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4935305A (en) * | 1988-08-17 | 1990-06-19 | Takashi Kanehiro | Method of forming a plating layer on ceramic chip surfaces and electronic parts thereby manufactured |
US20160284451A1 (en) * | 2015-03-24 | 2016-09-29 | International Business Machines Corporation | High resistivity soft magnetic material for miniaturized power converter |
CN108251825A (zh) * | 2018-04-12 | 2018-07-06 | 朱玉兰 | 一种镀速快的铁氧磁芯化学镀镍溶液 |
CN108447661A (zh) * | 2018-05-14 | 2018-08-24 | 中山市科旗金属表面处理设备有限公司 | 一种电感磁芯及其制造工艺 |
CN110706879A (zh) * | 2019-11-05 | 2020-01-17 | 湖南创一电子科技股份有限公司 | 一种高性能锰锌smd贴片电感及其生产工艺 |
CN112164570A (zh) * | 2020-10-19 | 2021-01-01 | 湖南创一电子科技股份有限公司 | 金属磁粉芯一体式芯片电感的制备方法 |
Non-Patent Citations (1)
Title |
---|
刘仁志: "《整机电镀》", 国防工业出版社 * |
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