TW202217067A - 印刷配線基板之表面處理方法、及印刷配線基板之製造方法 - Google Patents

印刷配線基板之表面處理方法、及印刷配線基板之製造方法 Download PDF

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Publication number
TW202217067A
TW202217067A TW110134003A TW110134003A TW202217067A TW 202217067 A TW202217067 A TW 202217067A TW 110134003 A TW110134003 A TW 110134003A TW 110134003 A TW110134003 A TW 110134003A TW 202217067 A TW202217067 A TW 202217067A
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TW
Taiwan
Prior art keywords
printed wiring
wiring board
flux
mass
water
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Application number
TW110134003A
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English (en)
Chinese (zh)
Inventor
小川泰貴
中波一貴
Original Assignee
日商田村製作所股份有限公司
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Publication date
Application filed by 日商田村製作所股份有限公司 filed Critical 日商田村製作所股份有限公司
Publication of TW202217067A publication Critical patent/TW202217067A/zh

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/26—Cleaning or polishing of the conductive pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3431—Leadless components
    • H05K3/3436—Leadless components having an array of bottom contacts, e.g. pad grid array or ball grid array components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3494—Heating methods for reflowing of solder

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
TW110134003A 2020-09-25 2021-09-13 印刷配線基板之表面處理方法、及印刷配線基板之製造方法 TW202217067A (zh)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2020161091 2020-09-25
JP2020-161091 2020-09-25
JP2021-141054 2021-08-31
JP2021141054A JP7336491B2 (ja) 2020-09-25 2021-08-31 プリント配線基板の表面処理方法、およびプリント配線基板の製造方法

Publications (1)

Publication Number Publication Date
TW202217067A true TW202217067A (zh) 2022-05-01

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Application Number Title Priority Date Filing Date
TW110134003A TW202217067A (zh) 2020-09-25 2021-09-13 印刷配線基板之表面處理方法、及印刷配線基板之製造方法

Country Status (3)

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JP (1) JP7336491B2 (ja)
KR (1) KR20220041741A (ja)
TW (1) TW202217067A (ja)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7377323B2 (ja) * 2021-09-29 2023-11-09 株式会社タムラ製作所 水溶性プリフラックス、および表面処理方法

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09176871A (ja) * 1995-12-25 1997-07-08 Tamura Kaken Kk 水溶性プリフラックス、プリント回路基板及びプリント回路基板の金属の表面処理方法
US6524644B1 (en) * 1999-08-26 2003-02-25 Enthone Inc. Process for selective deposition of OSP coating on copper, excluding deposition on gold
JP2004172292A (ja) * 2002-11-19 2004-06-17 Sony Corp 半田バンプを具備する電子部品、配線基板及びその電子部品の配線基板への実装方法
JP2007059451A (ja) * 2005-08-22 2007-03-08 Tamura Kaken Co Ltd プリント回路基板およびプリント回路基板の金属の表面処理方法
JP6243792B2 (ja) * 2014-05-12 2017-12-06 花王株式会社 はんだが固化された回路基板の製造方法、電子部品が搭載された回路基板の製造方法、及び、フラックス用洗浄剤組成物
JP6682593B2 (ja) * 2018-09-27 2020-04-15 株式会社Adeka 自動食器洗浄機用濃縮液体洗浄剤組成物及び自動食器洗浄機による食器類の洗浄方法

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Publication number Publication date
JP2022054426A (ja) 2022-04-06
KR20220041741A (ko) 2022-04-01
JP7336491B2 (ja) 2023-08-31

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