TWI395832B - 增強表面可焊性的方法 - Google Patents

增強表面可焊性的方法 Download PDF

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TWI395832B
TWI395832B TW098133132A TW98133132A TWI395832B TW I395832 B TWI395832 B TW I395832B TW 098133132 A TW098133132 A TW 098133132A TW 98133132 A TW98133132 A TW 98133132A TW I395832 B TWI395832 B TW I395832B
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silver
plating
decane
silver plating
solderability
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TW201020341A (en
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Ernest Long
Lenora M Toscano
Paul Romaine
Colleen Mckirryher
Donna M Kologe
Steven A Castaldi
Carl P Steinecker
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Macdermid Inc
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/282—Applying non-metallic protective coatings for inhibiting the corrosion of the circuit, e.g. for preserving the solderability
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/30—Selection of soldering or welding materials proper with the principal constituent melting at less than 1550 degrees C
    • B23K35/3006—Ag as the principal constituent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
    • B23K35/3612—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/02—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition
    • C23C18/12—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition characterised by the deposition of inorganic material other than metallic material
    • C23C18/1204—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition characterised by the deposition of inorganic material other than metallic material inorganic material, e.g. non-oxide and non-metallic such as sulfides, nitrides based compounds
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1633—Process of electroless plating
    • C23C18/1689—After-treatment
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/1803—Pretreatment of the material to be coated of metallic material surfaces or of a non-specific material surfaces
    • C23C18/1824—Pretreatment of the material to be coated of metallic material surfaces or of a non-specific material surfaces by chemical pretreatment
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/42—Coating with noble metals
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/54—Contact plating, i.e. electroless electrochemical plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H05K3/244—Finish plating of conductors, especially of copper conductors, e.g. for pads or lands

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  • Chemical & Material Sciences (AREA)
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  • Manufacturing & Machinery (AREA)
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  • Chemically Coating (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Other Surface Treatments For Metallic Materials (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Preventing Corrosion Or Incrustation Of Metals (AREA)
  • Chemical Treatment Of Metals (AREA)

Description

增強表面可焊性的方法
本發明大致關於一種處理表面的方法，此處理增強表面可焊性。此方法對於印刷電路板之製造及組裝特別有用。
焊接通常用於完成各種物品之機械、電化學或電子連接。預期接合功能間之特異性為重要的，因為各應用對表面製備有其本身之特定要求。三種焊接應用中，完成電子連接最為嚴苛。
在製造利用印刷電路之電子設備時，電子組件對印刷電路之連接係藉由將組件之引線焊接穿孔、包圍墊、島狀物、及其他連接點(概括地為「連接區域」)而完成。一般而言，連接係藉各種焊接技術發生。
為了利於焊接操作，印刷電路製造者需要安排使穿孔、包圍墊、島狀物、及其他連接點為後續焊接程序可接受。因此這些表面必須易被焊錫濕潤且可與電子組件之引線或表面整體地導電性連接。因為這些需求，印刷電路製造者已設計各種保存及增強表面可焊性的方法。
一種安排良好之所要表面可焊性的手段為對表面提供前塗覆焊錫。其一般藉一種稱為熱氣焊錫調平之程序或經某些型式之鍍敷程序實行。然而在印刷電路製造中，此方法有嚴重之缺點。使用熱氣焊錫調平由於短路而可能造成無法接受之高缺陷比率，特別是在處置小電路時。如果使用電鍍，則由於不易對這些區域選擇性地提供焊錫，其必須將板之全部導電區域鍍焊錫而對後續焊錫遮罩應用造成嚴重之問題。此外以上程序無效率且相當昂貴。
另一種安排這些表面之良好可焊性的手段為將其鍍以貴重金屬(如金、鈀或銠)之最終清漆塗料。美國專利第5,235,139號(Bengston等人)，此教示在此併入作為參考，提議一種得到此貴重金屬最終清漆的方法。Bengston等人提議將欲焊接之銅區域無電極電鍍鎳-硼，繼而為如金之貴重金屬塗料。類似程序亦參見Juskey,Jr.等人之美國專利第4,940,181號，此教示在此併入作為參考，其教示無電鍍敷銅，繼而鎳，繼而金成為可焊接表面。這些程序表現良好但耗時且昂貴。
現已進行各種嚐試以僅對所需區域選擇性地塗佈焊錫。一種此方法涉及在連接之鍍焊錫區域上使用有機蝕刻光阻，繼而在塗佈焊錫遮罩前自銅殘跡選擇性汽提錫-鉛。參見Durnwith等人之美國專利第4,978,423號。其他已知之選擇性焊接程序亦參見Larson之美國專利第5,160,579號，此教示在此併入作為參考。
直接焊接銅表面為困難及不一致的。這些問題主要由於在全部焊接操作中將銅表面保持清潔及無氧化之不穩定性。現已發展各種有機處理以將銅表面保存在易焊接狀態。例如參見美國專利第5,173,130號(Kinoshita)，其教示使用特定2-烷基苯并咪唑作為銅之前助焊劑以保存銅表面之可焊性。如Kinoshita教示之處理已證明為成功的，但是其仍有改良程序之可靠性的需求。
在此提議之保存可焊性的方法為將欲焊接銅表面在焊接前塗以鍍銀。然而現已發現在使用以上方法時，鍍銀具有腐蝕之趨勢，特別是如果暴露於含硫成分之環境。即使是在焊接結束後，此腐蝕仍可在界面處持續，因而減弱焊錫連接。
本發明之一個目的為提議一種保存及增強銅表面之可焊性的方法，其係藉由將該銅表面鍍以浸漬鍍銀繼而後處理，因而使鍍銀較先行技藝浸漬銀沉積物抗腐蝕且確保堅固、長期之焊錫黏結。
本發明提議使用浸漬或無電極銀塗料作為各種表面(特別是銅表面)之改良可焊性保存劑。亦揭示用於沉積銀塗料之較佳組成物。提議之鍍銀程序製造較習知銀沉積物抗腐蝕及降解之鍍銀。提議之程序為有效地保存表面(特別是銅表面及印刷電路板上之連接區域)可焊性之多樣化、低成本方法。
本發明提議一種保存及增強金屬表面(特別是銅表面)之可焊性的程序。提議之程序包含以下步驟：
a)清潔金屬表面；
b)視情況地蝕刻金屬表面；
c)以浸漬或無電極鍍銀溶液處理金屬表面；
d)以包含巰或硫矽烷化合物之溶液處理鍍銀表面。
較佳為鍍銀溶液為浸漬或無電極鍍銀溶液。現已發現浸漬銀沉積物提供優良之可焊性保存劑，其對於製造印刷電路板特別有用。在印刷電路應用中以簡單浸漬或無電極銀沉積物可得之可焊性已意料外地發現超越以先行技藝鍍鎳-金法可得者(如美國專利第5,235,139號所述)，而且意料外地超越以其他浸漬沉積物可得者。如由以下實例可知，本發明之程序產生在負面條件下為高可焊性之表面。在印刷電路應用中，依照本發明製備之表面為電線黏結性。浸漬電鍍為一種由置換反應造成之程序，其中欲電鍍表面溶於溶液中同時欲電鍍金屬自電鍍液沉積在表面上。浸漬電鍍係無前表面活化而引發。欲電鍍金屬通常較表面金屬貴重。因此浸漬電鍍通常較無電鍍敷(其可能需要複雜之自動催化電鍍液及電鍍前之表面活化程序)易控制及節省成本。結果在本發明之程序中浸漬鍍銀較佳。
鍍銀液通常含銀離子於酸性水性基質中之可溶性來源。銀離子之可溶性來源可衍生自各種銀化合物。本發明人已發現硝酸銀最佳。電鍍液中之銀濃度通常可為每公升0.1至25克之範圍，但是最佳為以每公升0.5至2克之濃度存在。雖然各種酸均適用於此調配物，本發明人已發現甲烷磺酸或硝酸最佳。電鍍液中之酸濃度通常可為每公升1至150克之範圍，但是較佳為每公升5至50克之範圍。
本發明人已發現，包含下式之咪唑或咪唑衍生物對用於本發明之浸漬電鍍液(特別是浸漬銀電鍍液)產生之電鍍物具有顯著之正面影響：
其中R1 、R2 、R3 、與R4 獨立地選自經取代或未取代烷基、經取代或未取代芳基、鹵素、硝基、與氫。
包含上述咪唑使電鍍沉積物變亮且改良所得電鍍沉積物之整合性與物理性質。此外咪唑亦延長浸漬電鍍液之使用壽命。本發明人已發現，組胺酸為用於這些程序之特佳咪唑。
包含咪唑通常對浸漬電鍍液提供顯著之優點，但是對浸漬鍍銀特別有用及有利。本發明人已發現，由含咪唑之電鍍浴生成之浸漬銀沉積物比由不具有咪唑之浴電鍍生成之浸漬銀沉積物較亮、較光滑及較具內聚性。此外具咪唑之浸漬電鍍浴具有較無咪唑之相似浴長之有效壽命。
關於可用於本發明之浸漬銀組成物，電鍍液可視情況地有利地亦含氧化劑。本發明人已發現，關於此點較佳為硝基芳族化合物，最佳為二硝基化合物，如3,5-二硝基羥基苯甲酸。溶液中之此氧化劑濃度可為每公升0.1至25克之範圍，但是較佳為每公升0.5至2克。
浸漬銀溶液可在範圍為室溫至200℉之溫度用於本發明之程序，但是較佳為在80至120℉使用。在電鍍液中之浸漬時間可為1至30分鐘之範圍，但是較佳為1至5分鐘。
本發明之浸漬銀溶液因此用於將薄銀層鍍在欲焊接表面上。為了表面可焊性之有效增強及保存，據信所得銀塗層應為1至100微英吋厚，較佳為10至60微英吋厚。雖然此方法對於焊接許多表面為有效的，但其對焊接銅表面(如印刷電路板上之連接區域)特別有用。
在將連接區域鍍銀後，其應以一種包含巰或硫矽烷化合物之溶液處理(接觸)。本發明之經巰或硫取代矽烷較佳
為以下化學式之多官能基經巰或硫取代有機矽烷：其中R1 、R2 、R3 、與R4 獨立地選自烷氧基(例如甲氧基、乙氧基、或類似烷氧基)、烷基、芳基、與氫基，及其中n為1至5之整數，但是較佳為2至3之整數。特佳之經巰取代矽烷為3-巰丙基三甲氧基矽烷：
本發明人已發現，3-巰丙基三甲氧基矽烷或3-辛醯基硫-1-丙基三乙氧基矽烷為用於本發明之最佳經巰或硫取代矽烷。這些矽烷係各以商標名SILQUESTA-189矽烷與SIQUESTA599得自康乃狄克州Wilton之G.E. Silicones。其他可用之經巰或硫取代矽烷包括得自瑞士Buchs之Fluka Chemie AG的(3-巰丙基)甲基二甲氧基矽烷。本發明人意外地已發現，這些經巰或硫取代矽烷上之巰基提供比不具有經巰或硫取代基之其他矽烷所提供顯著較佳之腐蝕保護。因此本發明人相信矽烷上之巰或硫取代相對非巰或硫取代矽烷對腐蝕保護與黏附性促進提供顯著及意料外之改良。
經巰或硫取代矽烷較佳為以合適溶劑溶解成為處理溶液。處理溶液中之經巰或硫取代矽烷濃度可為0.5至10重量%，但是較佳為2至4重量%。經巰取代矽烷(如-巰丙基三甲氧基矽烷)單獨可能無法以有效地實行本發明所需程度溶於水。本發明人已發現，將這些經巰取代矽烷有效地溶於水基質中可能需要水於合適溶劑之組合。用於此目的之合適溶劑包括N-甲基-2-吡咯啶酮、丁內酯、二乙二醇丁醚、己二醇、乙二醇一丁醚、與醇類。經巰取代矽烷之最佳溶解基質為乙二醇一丁醚或二醇單醚，如得自Dow Chemical Company之DOWANOLDPM，其各可用於水或單獨作為溶解基質。較佳為將經巰取代矽烷加入溶劑(例如乙二醇一丁醚)，然後如果需要水則將基質攪拌加入水以形成處理溶液。本發明人已發現，乙二醇一丁醚之水溶液優良地溶解經巰取代矽烷且在自經處理表面蒸發時留下無斑點清漆。此外亦可接受僅將矽烷溶於一或多種所列有機溶劑中而無水地製備後處理溶液。如果使用水，則必須調整水中之溶劑濃度以將經巰取代矽烷適當地溶解及/或維持在溶液中。本發明人已發現，按體積百分比計為65/35至94/6之水對乙二醇一丁醚濃度比例適用於體積百分比為5至0.5經巰取代矽烷濃度。經巰取代矽烷之水溶液將矽烷水解且改良其處理金屬表面之效果。處理溶液之pH應小於7，而且較佳為約3至5之間。本發明人已發現，使用以上溶劑與經巰取代矽烷之水溶液，則處理溶液自然地組成約4之pH。乙酸可用以完成任何所需之pH調整。經巰或硫取代矽烷之濃度可為0.5至10體積%之範圍，但是較佳為處理溶液之2至5體積%。最佳為將經巰或硫取代矽烷無水地溶於一或多種所列有機溶劑，而且在此情形不必考慮pH。
在應用本發明之矽烷後處理後，經處理表面較佳為以水洗滌然後在約100℃至150℃烘乾1至30分鐘，較佳為在130℃至150℃經約10分鐘。
雖然此技術可有利地用於幾乎任何表面，其對於製造印刷電路板(特別是裸銅上焊錫遮罩(SMOBC)板)最有用。因此在製造SMOBC板時，其將板表面塗佈焊錫遮罩，然後曝光及顯影以顯現連接區域。然後這些連接區域實際上僅為板上銅之曝光區域，其餘實際上被焊錫遮罩覆蓋。在製造循環中稍後將電子組件置於板上時，這些連接區域因此被定義為附著點(在大部分之情形係藉焊接)。因此這些暴露點(通常為銅)之可焊性必須增強及保存。
因此依照本發明，然後較佳為使用酸清潔劑將這些區域清潔，繼而微蝕刻以製備可接受浸漬電鍍用表面。在此較佳製備後將板浸於浸漬鍍銀液，使得得到合適厚度之銀沉積物，然後以本發明教示之後處理處理。
本發明進一步在以下實例中僅為了例證目的而敘述，其絕非限制本發明。
實例I
按以下步驟處理電路板：
a)酸清潔劑，5分鐘，120℉
b)水洗滌
c)過硫酸鈉/硫酸微蝕刻，1分鐘，95℉
d)水洗滌
e)使用以下組成物之鍍銀：
羥基乙二胺四乙酸　10克/公升
硝酸銀　2.4克/公升
IGEPALCo730　5.0克/公升
咪唑　10克/公升
硝酸　32.0毫升/公升
f)水洗滌。
實例II
如實例1所示而處理電路板，除了在此情形在步驟(f)後如下進一步處理電路板：
g)以含以下之水溶液處理：
h)水洗滌
i)在140℃烘烤10分鐘。
然後測試實例I及II之電路板在含硫大氣中之可焊性及腐蝕抗性。經實例II之後處理處理之零件顯示較實例I少約80%之腐蝕。相較於實例I，實例II之零件亦顯示改良之可焊性。

Claims (9)

  1. 一種改良金屬表面可焊性之方法，該方法包含：a)使金屬表面接觸鍍銀液，因而在金屬表面上製造鍍銀；然後b)以一種包含經巰或硫取代矽烷之添加劑處理鍍銀金屬表面。
  2. 如申請專利範圍第1項之方法，其中鍍銀液包含一種選自咪唑、苯并咪唑、咪唑衍生物、與苯并咪唑衍生物所構成之群組之材料。
  3. 如申請專利範圍第1項之方法，其中鍍銀液亦包含氧化劑。
  4. 如申請專利範圍第1項之方法，其中金屬表面包含銅。
  5. 如申請專利範圍第1項之方法，其中添加劑係選自3-巰丙基三甲氧基矽烷與3-辛醯基硫-1-丙基三乙氧基矽烷所構成之群組。
  6. 如申請專利範圍第4項之方法，其中鍍銀液包含一種選自咪唑、苯并咪唑、咪唑衍生物、與苯并咪唑衍生物所構成之群組之材料。
  7. 如申請專利範圍第6項之方法，其中鍍銀液亦包含氧化劑。
  8. 如申請專利範圍第7項之方法，其中添加劑係選自3-巰丙基三甲氧基矽烷與3-辛醯基硫-1-丙基三乙氧基矽烷所構成之群組。
  9. 如申請專利範圍第5項之方法，其中溶液包含二醇單醚。
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