TW202124528A - 樹脂組成物、樹脂薄片、硬化膜、硬化膜之製造方法、半導體裝置、有機el顯示裝置及顯示裝置 - Google Patents

樹脂組成物、樹脂薄片、硬化膜、硬化膜之製造方法、半導體裝置、有機el顯示裝置及顯示裝置 Download PDF

Info

Publication number
TW202124528A
TW202124528A TW109137387A TW109137387A TW202124528A TW 202124528 A TW202124528 A TW 202124528A TW 109137387 A TW109137387 A TW 109137387A TW 109137387 A TW109137387 A TW 109137387A TW 202124528 A TW202124528 A TW 202124528A
Authority
TW
Taiwan
Prior art keywords
mass
parts
general formula
resin
resin composition
Prior art date
Application number
TW109137387A
Other languages
English (en)
Chinese (zh)
Inventor
橋本啟華
增田有希
富川真佐夫
Original Assignee
日商東麗股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商東麗股份有限公司 filed Critical 日商東麗股份有限公司
Publication of TW202124528A publication Critical patent/TW202124528A/zh

Links

Images

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
    • C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08L79/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/04—Oxygen-containing compounds
    • C08K5/06—Ethers; Acetals; Ketals; Ortho-esters
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/04—Oxygen-containing compounds
    • C08K5/13—Phenols; Phenolates
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/36—Sulfur-, selenium-, or tellurium-containing compounds
    • C08K5/41—Compounds containing sulfur bound to oxygen
    • C08K5/42—Sulfonic acids; Derivatives thereof
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L61/00—Compositions of condensation polymers of aldehydes or ketones; Compositions of derivatives of such polymers
    • C08L61/04—Condensation polymers of aldehydes or ketones with phenols only
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/022—Quinonediazides
    • G03F7/023—Macromolecular quinonediazides; Macromolecular additives, e.g. binders
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00—Electroluminescent light sources
    • H05B33/02—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00—Electroluminescent light sources
    • H05B33/12—Light sources with substantially two-dimensional radiating surfaces
    • H05B33/22—Light sources with substantially two-dimensional radiating surfaces characterised by the chemical or physical composition or the arrangement of auxiliary dielectric or reflective layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/124—Insulating layers formed between TFT elements and OLED elements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/131—Interconnections, e.g. wiring lines or terminals
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass

Landscapes

  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Polymers & Plastics (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Organic Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Materials For Photolithography (AREA)
TW109137387A 2019-10-29 2020-10-28 樹脂組成物、樹脂薄片、硬化膜、硬化膜之製造方法、半導體裝置、有機el顯示裝置及顯示裝置 TW202124528A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2019195997 2019-10-29
JP2019-195997 2019-10-29

Publications (1)

Publication Number Publication Date
TW202124528A true TW202124528A (zh) 2021-07-01

Family

ID=75715160

Family Applications (1)

Application Number Title Priority Date Filing Date
TW109137387A TW202124528A (zh) 2019-10-29 2020-10-28 樹脂組成物、樹脂薄片、硬化膜、硬化膜之製造方法、半導體裝置、有機el顯示裝置及顯示裝置

Country Status (5)

Country Link
JP (1) JPWO2021085321A1 (ja)
KR (1) KR20220092851A (ja)
CN (1) CN114502659A (ja)
TW (1) TW202124528A (ja)
WO (1) WO2021085321A1 (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI842970B (zh) * 2019-12-25 2024-05-21 日商Ｄｉｃ股份有限公司 正型感光性樹脂組成物、硬化膜、及光阻膜

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7201024B2 (ja) * 2021-06-15 2023-01-10 Dic株式会社 ネガ型感光性樹脂組成物
JP7556419B2 (ja) 2022-05-16 2024-09-26 Dic株式会社 ネガ型感光性樹脂組成物

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0737895B1 (en) * 1995-04-10 1999-09-08 Shipley Company LLC Photoresist with photoactive compound mixtures
US7348373B2 (en) * 2004-01-09 2008-03-25 E.I. Du Pont De Nemours And Company Polyimide compositions having resistance to water sorption, and methods relating thereto
JP4548001B2 (ja) 2004-06-09 2010-09-22 東レ株式会社 ポジ型感光性樹脂前駆体組成物
JP5486201B2 (ja) * 2009-02-25 2014-05-07 旭化成イーマテリアルズ株式会社 感光性樹脂組成物
KR101781702B1 (ko) 2012-09-18 2017-09-25 아사히 가세이 이-매터리얼즈 가부시키가이샤 감광성 수지 조성물
JPWO2014069091A1 (ja) * 2012-10-30 2016-09-08 住友ベークライト株式会社 感光性樹脂組成物、硬化膜、保護膜、絶縁膜および電子装置
JP6291718B2 (ja) * 2013-04-18 2018-03-14 住友ベークライト株式会社 ポジ型感光性樹脂組成物、硬化膜、保護膜、絶縁膜、半導体装置、および表示体装置
JP6155842B2 (ja) * 2013-05-22 2017-07-05 Dic株式会社 ノボラック型フェノール樹脂の製造方法及びフォトレジスト組成物。
WO2017188153A1 (ja) * 2016-04-25 2017-11-02 東レ株式会社 樹脂組成物
JP7013872B2 (ja) * 2016-10-05 2022-02-15 東レ株式会社 樹脂組成物、硬化膜、半導体装置およびそれらの製造方法
JP6523419B2 (ja) 2017-12-07 2019-05-29 旭化成株式会社 感光性樹脂組成物

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI842970B (zh) * 2019-12-25 2024-05-21 日商Ｄｉｃ股份有限公司 正型感光性樹脂組成物、硬化膜、及光阻膜

Also Published As

Publication number Publication date
JPWO2021085321A1 (ja) 2021-05-06
KR20220092851A (ko) 2022-07-04
WO2021085321A1 (ja) 2021-05-06
CN114502659A (zh) 2022-05-13

Similar Documents

Publication Publication Date Title
TWI746650B (zh) 樹脂組成物、硬化膜、半導體裝置及其等之製造方法
TWI396043B (zh) A positive-type photosensitive resin composition, a manufacturing method of a photoresist pattern, a semiconductor device, and an electronic device
TWI460543B (zh) 正型感光性樹脂組成物、光阻圖案的製造方法以及電子零件
TWI461851B (zh) 正型感光性樹脂組成物、光阻圖案的製造方法、半導體裝置以及電子元件
TW202124528A (zh) 樹脂組成物、樹脂薄片、硬化膜、硬化膜之製造方法、半導體裝置、有機el顯示裝置及顯示裝置
JP7003659B2 (ja) 樹脂組成物
TWI670298B (zh) 樹脂、感光性樹脂組成物、耐熱性樹脂被膜之製造方法、層間絕緣膜、多層配線結構用層間絕緣膜、表面保護膜、電子零件、及有機電場發光元件的絕緣層
JP5381491B2 (ja) 樹脂およびポジ型感光性樹脂組成物
TWI472875B (zh) 感光性樹脂組成物、圖案硬化膜的製造方法以及電子零件
TW201339753A (zh) 感光性樹脂組成物、圖案硬化膜的製造方法以及電子零件
JP7547727B2 (ja) 樹脂組成物、樹脂シート、硬化膜、硬化膜の製造方法、半導体装置および表示装置
TWI413863B (zh) 正型感光性樹脂組成物
JP6939553B2 (ja) 樹脂組成物
JP2019183122A (ja) 感光性樹脂組成物
TW201727370A (zh) 半導體裝置及其製造方法
TWI398725B (zh) A photosensitive resin composition and a photosensitive resin laminate using the same
JP7210999B2 (ja) 樹脂組成物、樹脂シート、硬化膜、硬化膜の製造方法、半導体装置および表示装置
JP5176600B2 (ja) ポジ型感光性樹脂組成物
TW200905397A (en) Method for film formation, resin composition for use in the method, structure having insulating film, process for producing the structure, and electronic component
KR102344939B1 (ko) 에칭용 마스크 레지스트 조성물, 이를 이용한 기판의 제조 방법 및 발광 소자의 제조 방법
JP2013152353A (ja) 感光性樹脂組成物、パターン硬化膜の製造方法、半導体装置及び電子デバイス
JP2014157297A (ja) ポジ型感光性樹脂組成物
JP2021096311A (ja) 感光性樹脂組成物、硬化膜、電子部品および半導体装置
TW202208516A (zh) 感光性樹脂組成物、硬化物、顯示裝置、半導體裝置及硬化物的製造方法
JP2015176962A (ja) 樹脂膜の製造方法