TW202104403A - 導熱性樹脂組成物及導熱性樹脂硬化物 - Google Patents

導熱性樹脂組成物及導熱性樹脂硬化物 Download PDF

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Publication number
TW202104403A
TW202104403A TW109111587A TW109111587A TW202104403A TW 202104403 A TW202104403 A TW 202104403A TW 109111587 A TW109111587 A TW 109111587A TW 109111587 A TW109111587 A TW 109111587A TW 202104403 A TW202104403 A TW 202104403A
Authority
TW
Taiwan
Prior art keywords
thermally conductive
conductive resin
resin composition
boron nitride
cured product
Prior art date
Application number
TW109111587A
Other languages
English (en)
Chinese (zh)
Inventor
廣中裕也
遠藤晃洋
石原靖久
Original Assignee
日商信越化學工業股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by 日商信越化學工業股份有限公司 filed Critical 日商信越化學工業股份有限公司
Publication of TW202104403A publication Critical patent/TW202104403A/zh

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/28—Nitrogen-containing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/38—Boron-containing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L101/00—Compositions of unspecified macromolecular compounds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K5/00—Heat-transfer, heat-exchange or heat-storage materials, e.g. refrigerants; Materials for the production of heat or cold by chemical reactions other than by combustion
    • C09K5/08—Materials not undergoing a change of physical state when used
    • C09K5/14—Solid materials, e.g. powdery or granular

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Combustion & Propulsion (AREA)
  • Thermal Sciences (AREA)
  • Materials Engineering (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
TW109111587A 2019-04-18 2020-04-07 導熱性樹脂組成物及導熱性樹脂硬化物 TW202104403A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2019-079153 2019-04-18
JP2019079153A JP2020176201A (ja) 2019-04-18 2019-04-18 熱伝導性樹脂組成物及び熱伝導性樹脂硬化物

Publications (1)

Publication Number Publication Date
TW202104403A true TW202104403A (zh) 2021-02-01

Family

ID=72837201

Family Applications (1)

Application Number Title Priority Date Filing Date
TW109111587A TW202104403A (zh) 2019-04-18 2020-04-07 導熱性樹脂組成物及導熱性樹脂硬化物

Country Status (3)

Country Link
JP (1) JP2020176201A (fr)
TW (1) TW202104403A (fr)
WO (1) WO2020213348A1 (fr)

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS55102636A (en) * 1979-01-31 1980-08-06 Hitachi Cable Ltd Highly heat-conductive resin composition
JP3654743B2 (ja) * 1997-07-01 2005-06-02 電気化学工業株式会社 放熱スペーサー
JP2001110963A (ja) * 1999-10-14 2001-04-20 Denki Kagaku Kogyo Kk 放熱スペーサーの製造方法
JP2002138205A (ja) * 2000-11-02 2002-05-14 Polymatech Co Ltd 熱伝導性成形体
JP2010155870A (ja) * 2007-04-20 2010-07-15 Denki Kagaku Kogyo Kk 熱伝導性コンパウンドおよびその製造方法
JP2011021069A (ja) * 2009-07-14 2011-02-03 Sakai Chem Ind Co Ltd 放熱性フィラー組成物、樹脂組成物、放熱性グリース及び放熱性塗料組成物
TWI547436B (zh) * 2011-11-29 2016-09-01 Mitsubishi Chem Corp 氮化硼凝集粒子、含有該粒子之組成物、以及具有由該組成物所構成的層之三維積體電路
CN107109151B (zh) * 2014-12-26 2020-07-28 琳得科株式会社 导热性粘接片、其制造方法、以及使用其的电子器件
JP6650736B2 (ja) * 2015-11-12 2020-02-19 デンカ株式会社 高熱伝導性、高絶縁性放熱シート
CN109997423B (zh) * 2016-09-30 2021-02-02 电化株式会社 具有高耐负荷性及高导热性的散热片
JP6826065B2 (ja) * 2017-03-22 2021-02-03 株式会社豊田中央研究所 熱伝導性複合材料、熱伝導性フィラー及びそれらの製造方法
JP6866799B2 (ja) * 2017-08-01 2021-04-28 東洋インキＳｃホールディングス株式会社 熱伝導性絶縁シートおよび複合部材
JP2019172935A (ja) * 2018-03-29 2019-10-10 Jnc株式会社 ２成分型熱伝導樹脂組成物、熱伝導シート、金属製品、電子機器

Also Published As

Publication number Publication date
WO2020213348A1 (fr) 2020-10-22
JP2020176201A (ja) 2020-10-29

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