JP2020176201A - 熱伝導性樹脂組成物及び熱伝導性樹脂硬化物 - Google Patents

熱伝導性樹脂組成物及び熱伝導性樹脂硬化物 Download PDF

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Publication number
JP2020176201A
JP2020176201A JP2019079153A JP2019079153A JP2020176201A JP 2020176201 A JP2020176201 A JP 2020176201A JP 2019079153 A JP2019079153 A JP 2019079153A JP 2019079153 A JP2019079153 A JP 2019079153A JP 2020176201 A JP2020176201 A JP 2020176201A
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Japan
Prior art keywords
heat
resin composition
boron nitride
specific gravity
cured product
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JP2019079153A
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English (en)
Japanese (ja)
Inventor
裕也 廣中
Hironari Hironaka
裕也 廣中
晃洋 遠藤
Akihiro Endo
晃洋 遠藤
靖久 石原
Yasuhisa Ishihara
靖久 石原
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shin Etsu Chemical Co Ltd
Original Assignee
Shin Etsu Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shin Etsu Chemical Co Ltd filed Critical Shin Etsu Chemical Co Ltd
Priority to JP2019079153A priority Critical patent/JP2020176201A/ja
Priority to PCT/JP2020/012697 priority patent/WO2020213348A1/fr
Priority to TW109111587A priority patent/TW202104403A/zh
Publication of JP2020176201A publication Critical patent/JP2020176201A/ja
Pending legal-status Critical Current

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/28—Nitrogen-containing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/38—Boron-containing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L101/00—Compositions of unspecified macromolecular compounds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K5/00—Heat-transfer, heat-exchange or heat-storage materials, e.g. refrigerants; Materials for the production of heat or cold by chemical reactions other than by combustion
    • C09K5/08—Materials not undergoing a change of physical state when used
    • C09K5/14—Solid materials, e.g. powdery or granular

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Combustion & Propulsion (AREA)
  • Thermal Sciences (AREA)
  • Materials Engineering (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
JP2019079153A 2019-04-18 2019-04-18 熱伝導性樹脂組成物及び熱伝導性樹脂硬化物 Pending JP2020176201A (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2019079153A JP2020176201A (ja) 2019-04-18 2019-04-18 熱伝導性樹脂組成物及び熱伝導性樹脂硬化物
PCT/JP2020/012697 WO2020213348A1 (fr) 2019-04-18 2020-03-23 Composition de résine thermoconductrice et produit durci en résine thermoconductrice
TW109111587A TW202104403A (zh) 2019-04-18 2020-04-07 導熱性樹脂組成物及導熱性樹脂硬化物

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2019079153A JP2020176201A (ja) 2019-04-18 2019-04-18 熱伝導性樹脂組成物及び熱伝導性樹脂硬化物

Publications (1)

Publication Number Publication Date
JP2020176201A true JP2020176201A (ja) 2020-10-29

Family

ID=72837201

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2019079153A Pending JP2020176201A (ja) 2019-04-18 2019-04-18 熱伝導性樹脂組成物及び熱伝導性樹脂硬化物

Country Status (3)

Country Link
JP (1) JP2020176201A (fr)
TW (1) TW202104403A (fr)
WO (1) WO2020213348A1 (fr)

Citations (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS55102636A (en) * 1979-01-31 1980-08-06 Hitachi Cable Ltd Highly heat-conductive resin composition
JPH1126661A (ja) * 1997-07-01 1999-01-29 Denki Kagaku Kogyo Kk 放熱スペーサー
JP2001110963A (ja) * 1999-10-14 2001-04-20 Denki Kagaku Kogyo Kk 放熱スペーサーの製造方法
JP2002138205A (ja) * 2000-11-02 2002-05-14 Polymatech Co Ltd 熱伝導性成形体
JP2010155870A (ja) * 2007-04-20 2010-07-15 Denki Kagaku Kogyo Kk 熱伝導性コンパウンドおよびその製造方法
JP2011021069A (ja) * 2009-07-14 2011-02-03 Sakai Chem Ind Co Ltd 放熱性フィラー組成物、樹脂組成物、放熱性グリース及び放熱性塗料組成物
JP2013241321A (ja) * 2011-11-29 2013-12-05 Mitsubishi Chemicals Corp 窒化ホウ素凝集粒子、窒化ホウ素凝集粒子を含有する組成物、及び該組成物からなる層を有する三次元集積回路
WO2016103784A1 (fr) * 2014-12-26 2016-06-30 リンテック株式会社 Feuille adhésive thermoconductrice, son procédé de production et dispositif électronique l'utilisant
JP2017092322A (ja) * 2015-11-12 2017-05-25 デンカ株式会社 高熱伝導性、高絶縁性放熱シート
WO2018061447A1 (fr) * 2016-09-30 2018-04-05 デンカ株式会社 Feuille de dissipation de chaleur ayant une capacité de transport de charge élevée et une conductivité thermique élevée
JP2018159062A (ja) * 2017-03-22 2018-10-11 株式会社豊田中央研究所 熱伝導性複合材料、熱伝導性フィラー及びそれらの製造方法
JP2019029269A (ja) * 2017-08-01 2019-02-21 東洋インキＳｃホールディングス株式会社 熱伝導性絶縁シートおよび複合部材
JP2019172935A (ja) * 2018-03-29 2019-10-10 Jnc株式会社 ２成分型熱伝導樹脂組成物、熱伝導シート、金属製品、電子機器

Patent Citations (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS55102636A (en) * 1979-01-31 1980-08-06 Hitachi Cable Ltd Highly heat-conductive resin composition
JPH1126661A (ja) * 1997-07-01 1999-01-29 Denki Kagaku Kogyo Kk 放熱スペーサー
JP2001110963A (ja) * 1999-10-14 2001-04-20 Denki Kagaku Kogyo Kk 放熱スペーサーの製造方法
JP2002138205A (ja) * 2000-11-02 2002-05-14 Polymatech Co Ltd 熱伝導性成形体
JP2010155870A (ja) * 2007-04-20 2010-07-15 Denki Kagaku Kogyo Kk 熱伝導性コンパウンドおよびその製造方法
JP2011021069A (ja) * 2009-07-14 2011-02-03 Sakai Chem Ind Co Ltd 放熱性フィラー組成物、樹脂組成物、放熱性グリース及び放熱性塗料組成物
JP2013241321A (ja) * 2011-11-29 2013-12-05 Mitsubishi Chemicals Corp 窒化ホウ素凝集粒子、窒化ホウ素凝集粒子を含有する組成物、及び該組成物からなる層を有する三次元集積回路
WO2016103784A1 (fr) * 2014-12-26 2016-06-30 リンテック株式会社 Feuille adhésive thermoconductrice, son procédé de production et dispositif électronique l'utilisant
JP2017092322A (ja) * 2015-11-12 2017-05-25 デンカ株式会社 高熱伝導性、高絶縁性放熱シート
WO2018061447A1 (fr) * 2016-09-30 2018-04-05 デンカ株式会社 Feuille de dissipation de chaleur ayant une capacité de transport de charge élevée et une conductivité thermique élevée
JP2018159062A (ja) * 2017-03-22 2018-10-11 株式会社豊田中央研究所 熱伝導性複合材料、熱伝導性フィラー及びそれらの製造方法
JP2019029269A (ja) * 2017-08-01 2019-02-21 東洋インキＳｃホールディングス株式会社 熱伝導性絶縁シートおよび複合部材
JP2019172935A (ja) * 2018-03-29 2019-10-10 Jnc株式会社 ２成分型熱伝導樹脂組成物、熱伝導シート、金属製品、電子機器

Also Published As

Publication number Publication date
WO2020213348A1 (fr) 2020-10-22
TW202104403A (zh) 2021-02-01

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