TW202030051A - 測定治具 - Google Patents

測定治具 Download PDF

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Publication number
TW202030051A
TW202030051A TW109102290A TW109102290A TW202030051A TW 202030051 A TW202030051 A TW 202030051A TW 109102290 A TW109102290 A TW 109102290A TW 109102290 A TW109102290 A TW 109102290A TW 202030051 A TW202030051 A TW 202030051A
Authority
TW
Taiwan
Prior art keywords
grinding
female screw
measuring
jig
wheel
Prior art date
Application number
TW109102290A
Other languages
English (en)
Chinese (zh)
Inventor
新居武典
田村正和
Original Assignee
日商迪思科股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商迪思科股份有限公司 filed Critical 日商迪思科股份有限公司
Publication of TW202030051A publication Critical patent/TW202030051A/zh

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/02—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation according to the instantaneous size and required size of the workpiece acted upon, the measuring or gauging being continuous or intermittent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/005—Control means for lapping machines or devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B47/00—Drives or gearings; Equipment therefor
    • B24B47/22—Equipment for exact control of the position of the grinding tool or work at the start of the grinding operation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
  • Grinding Of Cylindrical And Plane Surfaces (AREA)
  • Grinding-Machine Dressing And Accessory Apparatuses (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
TW109102290A 2019-02-01 2020-01-21 測定治具 TW202030051A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2019-016824 2019-02-01
JP2019016824A JP2020124753A (ja) 2019-02-01 2019-02-01 測定治具

Publications (1)

Publication Number Publication Date
TW202030051A true TW202030051A (zh) 2020-08-16

Family

ID=72048163

Family Applications (1)

Application Number Title Priority Date Filing Date
TW109102290A TW202030051A (zh) 2019-02-01 2020-01-21 測定治具

Country Status (4)

Country Link
JP (1) JP2020124753A (ko)
KR (1) KR20200096152A (ko)
CN (1) CN111730498A (ko)
TW (1) TW202030051A (ko)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2022135442A (ja) * 2021-03-05 2022-09-15 株式会社ディスコ 研削装置
CN115213814B (zh) * 2022-07-28 2024-01-23 宁波芯丰精密科技有限公司 一种磨削主轴

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
AU532694B2 (en) * 1978-08-16 1983-10-13 A.F.A.Pty. Ltd. Chip catching washers
JPS6280009U (ko) * 1985-11-09 1987-05-22
JP3472784B2 (ja) * 1997-05-16 2003-12-02 株式会社岡本工作機械製作所 研削装置および研磨装置
JP4298948B2 (ja) * 2001-12-27 2009-07-22 日東精工株式会社 雌ねじ成形屑吸着タッピンねじ
US7955037B2 (en) * 2004-03-22 2011-06-07 Universal Metal Products, Inc. Fastener assembly
KR20060134577A (ko) * 2005-06-23 2006-12-28 삼성전자주식회사 그라인딩 휠 기울기 측정용 도구
JP5606838B2 (ja) * 2010-09-07 2014-10-15 株式会社ディスコ 切削ブレードを装着する回転スピンドルの取り付け状態確認治具および取り付け状態確認方法
JP5841846B2 (ja) * 2012-01-11 2016-01-13 株式会社ディスコ 研削装置
JP2014075448A (ja) * 2012-10-03 2014-04-24 Sumitomo Wiring Syst Ltd プリント基板の固定構造
TWI495800B (zh) * 2013-03-06 2015-08-11 Kabo Tool Co A screw with a locking force
JP5878219B1 (ja) * 2014-10-09 2016-03-08 千住金属工業株式会社 はんだ付け装置
US20170087603A1 (en) * 2015-09-25 2017-03-30 David Fleegle Thread Cleaner System
JP6912284B2 (ja) * 2017-06-23 2021-08-04 株式会社ディスコ 研削装置

Also Published As

Publication number Publication date
CN111730498A (zh) 2020-10-02
KR20200096152A (ko) 2020-08-11
JP2020124753A (ja) 2020-08-20

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