JP2020124753A - 測定治具 - Google Patents

測定治具 Download PDF

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Publication number
JP2020124753A
JP2020124753A JP2019016824A JP2019016824A JP2020124753A JP 2020124753 A JP2020124753 A JP 2020124753A JP 2019016824 A JP2019016824 A JP 2019016824A JP 2019016824 A JP2019016824 A JP 2019016824A JP 2020124753 A JP2020124753 A JP 2020124753A
Authority
JP
Japan
Prior art keywords
grinding
wheel
screw
mount
female screw
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2019016824A
Other languages
English (en)
Japanese (ja)
Inventor
武典 新居
Takenori Arai
武典 新居
正和 田村
Masakazu Tamura
正和 田村
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Disco Corp
Original Assignee
Disco Abrasive Systems Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Disco Abrasive Systems Ltd filed Critical Disco Abrasive Systems Ltd
Priority to JP2019016824A priority Critical patent/JP2020124753A/ja
Priority to TW109102290A priority patent/TW202030051A/zh
Priority to KR1020200011168A priority patent/KR20200096152A/ko
Priority to CN202010077654.XA priority patent/CN111730498A/zh
Publication of JP2020124753A publication Critical patent/JP2020124753A/ja
Pending legal-status Critical Current

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/02—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation according to the instantaneous size and required size of the workpiece acted upon, the measuring or gauging being continuous or intermittent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/005—Control means for lapping machines or devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B47/00—Drives or gearings; Equipment therefor
    • B24B47/22—Equipment for exact control of the position of the grinding tool or work at the start of the grinding operation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
  • Grinding Of Cylindrical And Plane Surfaces (AREA)
  • Grinding-Machine Dressing And Accessory Apparatuses (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
JP2019016824A 2019-02-01 2019-02-01 測定治具 Pending JP2020124753A (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2019016824A JP2020124753A (ja) 2019-02-01 2019-02-01 測定治具
TW109102290A TW202030051A (zh) 2019-02-01 2020-01-21 測定治具
KR1020200011168A KR20200096152A (ko) 2019-02-01 2020-01-30 측정 지그
CN202010077654.XA CN111730498A (zh) 2019-02-01 2020-01-31 测量治具

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2019016824A JP2020124753A (ja) 2019-02-01 2019-02-01 測定治具

Publications (1)

Publication Number Publication Date
JP2020124753A true JP2020124753A (ja) 2020-08-20

Family

ID=72048163

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2019016824A Pending JP2020124753A (ja) 2019-02-01 2019-02-01 測定治具

Country Status (4)

Country Link
JP (1) JP2020124753A (ko)
KR (1) KR20200096152A (ko)
CN (1) CN111730498A (ko)
TW (1) TW202030051A (ko)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20220281063A1 (en) * 2021-03-05 2022-09-08 Disco Corporation Grinding apparatus

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115213814B (zh) * 2022-07-28 2024-01-23 宁波芯丰精密科技有限公司 一种磨削主轴

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5530586A (en) * 1978-08-16 1980-03-04 Mcphersons Ltd Chip accommodatable washer
JPS6280009U (ko) * 1985-11-09 1987-05-22
JPH10315103A (ja) * 1997-05-16 1998-12-02 Okamoto Kosaku Kikai Seisakusho:Kk 研削／研磨方法およびその装置
JP2002257120A (ja) * 2001-12-27 2002-09-11 Nitto Seiko Co Ltd 雌ねじ成形屑吸着ねじ
KR20060134577A (ko) * 2005-06-23 2006-12-28 삼성전자주식회사 그라인딩 휠 기울기 측정용 도구
JP2012055998A (ja) * 2010-09-07 2012-03-22 Disco Corp 切削ブレードを装着する回転スピンドルの取り付け状態確認治具および取り付け状態確認方法
JP2013141725A (ja) * 2012-01-11 2013-07-22 Disco Corp 研削装置
JP3189990U (ja) * 2013-03-06 2014-04-10 優鋼機械股▲ふん▼有限公司 締結力測定機能付き締結具
JP2016079994A (ja) * 2014-10-09 2016-05-16 千住金属工業株式会社 はんだ付け装置

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7955037B2 (en) * 2004-03-22 2011-06-07 Universal Metal Products, Inc. Fastener assembly
JP2014075448A (ja) * 2012-10-03 2014-04-24 Sumitomo Wiring Syst Ltd プリント基板の固定構造
US20170087603A1 (en) * 2015-09-25 2017-03-30 David Fleegle Thread Cleaner System
JP6912284B2 (ja) * 2017-06-23 2021-08-04 株式会社ディスコ 研削装置

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5530586A (en) * 1978-08-16 1980-03-04 Mcphersons Ltd Chip accommodatable washer
JPS6280009U (ko) * 1985-11-09 1987-05-22
JPH10315103A (ja) * 1997-05-16 1998-12-02 Okamoto Kosaku Kikai Seisakusho:Kk 研削／研磨方法およびその装置
JP2002257120A (ja) * 2001-12-27 2002-09-11 Nitto Seiko Co Ltd 雌ねじ成形屑吸着ねじ
KR20060134577A (ko) * 2005-06-23 2006-12-28 삼성전자주식회사 그라인딩 휠 기울기 측정용 도구
JP2012055998A (ja) * 2010-09-07 2012-03-22 Disco Corp 切削ブレードを装着する回転スピンドルの取り付け状態確認治具および取り付け状態確認方法
JP2013141725A (ja) * 2012-01-11 2013-07-22 Disco Corp 研削装置
JP3189990U (ja) * 2013-03-06 2014-04-10 優鋼機械股▲ふん▼有限公司 締結力測定機能付き締結具
JP2016079994A (ja) * 2014-10-09 2016-05-16 千住金属工業株式会社 はんだ付け装置

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20220281063A1 (en) * 2021-03-05 2022-09-08 Disco Corporation Grinding apparatus
US11858087B2 (en) * 2021-03-05 2024-01-02 Disco Corporation Grinding apparatus

Also Published As

Publication number Publication date
CN111730498A (zh) 2020-10-02
TW202030051A (zh) 2020-08-16
KR20200096152A (ko) 2020-08-11

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