CN111730498A - 测量治具 - Google Patents

测量治具 Download PDF

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Publication number
CN111730498A
CN111730498A CN202010077654.XA CN202010077654A CN111730498A CN 111730498 A CN111730498 A CN 111730498A CN 202010077654 A CN202010077654 A CN 202010077654A CN 111730498 A CN111730498 A CN 111730498A
Authority
CN
China
Prior art keywords
grinding
measuring
wheel
base
thread
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202010077654.XA
Other languages
English (en)
Chinese (zh)
Inventor
新居武典
田村正和
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Disco Corp
Original Assignee
Disco Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Disco Corp filed Critical Disco Corp
Publication of CN111730498A publication Critical patent/CN111730498A/zh
Pending legal-status Critical Current

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/02—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation according to the instantaneous size and required size of the workpiece acted upon, the measuring or gauging being continuous or intermittent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/005—Control means for lapping machines or devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B47/00—Drives or gearings; Equipment therefor
    • B24B47/22—Equipment for exact control of the position of the grinding tool or work at the start of the grinding operation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
  • Grinding Of Cylindrical And Plane Surfaces (AREA)
  • Grinding-Machine Dressing And Accessory Apparatuses (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
CN202010077654.XA 2019-02-01 2020-01-31 测量治具 Pending CN111730498A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2019-016824 2019-02-01
JP2019016824A JP2020124753A (ja) 2019-02-01 2019-02-01 測定治具

Publications (1)

Publication Number Publication Date
CN111730498A true CN111730498A (zh) 2020-10-02

Family

ID=72048163

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202010077654.XA Pending CN111730498A (zh) 2019-02-01 2020-01-31 测量治具

Country Status (4)

Country Link
JP (1) JP2020124753A (ko)
KR (1) KR20200096152A (ko)
CN (1) CN111730498A (ko)
TW (1) TW202030051A (ko)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115213814A (zh) * 2022-07-28 2022-10-21 宁波芯丰精密科技有限公司 一种磨削主轴

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2022135442A (ja) * 2021-03-05 2022-09-15 株式会社ディスコ 研削装置

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10315103A (ja) * 1997-05-16 1998-12-02 Okamoto Kosaku Kikai Seisakusho:Kk 研削／研磨方法およびその装置
US20070280802A1 (en) * 2004-03-22 2007-12-06 Universal Metal Products, Inc. Fastener assembly
JP2013141725A (ja) * 2012-01-11 2013-07-22 Disco Corp 研削装置
WO2014054460A1 (ja) * 2012-10-03 2014-04-10 住友電装株式会社 プリント基板の固定構造
US20170087603A1 (en) * 2015-09-25 2017-03-30 David Fleegle Thread Cleaner System
CN109108811A (zh) * 2017-06-23 2019-01-01 株式会社迪思科 磨削装置

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
AU532694B2 (en) * 1978-08-16 1983-10-13 A.F.A.Pty. Ltd. Chip catching washers
JPS6280009U (ko) * 1985-11-09 1987-05-22
JP4298948B2 (ja) * 2001-12-27 2009-07-22 日東精工株式会社 雌ねじ成形屑吸着タッピンねじ
KR20060134577A (ko) * 2005-06-23 2006-12-28 삼성전자주식회사 그라인딩 휠 기울기 측정용 도구
JP5606838B2 (ja) * 2010-09-07 2014-10-15 株式会社ディスコ 切削ブレードを装着する回転スピンドルの取り付け状態確認治具および取り付け状態確認方法
TWI495800B (zh) * 2013-03-06 2015-08-11 Kabo Tool Co A screw with a locking force
JP5878219B1 (ja) * 2014-10-09 2016-03-08 千住金属工業株式会社 はんだ付け装置

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10315103A (ja) * 1997-05-16 1998-12-02 Okamoto Kosaku Kikai Seisakusho:Kk 研削／研磨方法およびその装置
US20070280802A1 (en) * 2004-03-22 2007-12-06 Universal Metal Products, Inc. Fastener assembly
JP2013141725A (ja) * 2012-01-11 2013-07-22 Disco Corp 研削装置
WO2014054460A1 (ja) * 2012-10-03 2014-04-10 住友電装株式会社 プリント基板の固定構造
US20170087603A1 (en) * 2015-09-25 2017-03-30 David Fleegle Thread Cleaner System
CN109108811A (zh) * 2017-06-23 2019-01-01 株式会社迪思科 磨削装置

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115213814A (zh) * 2022-07-28 2022-10-21 宁波芯丰精密科技有限公司 一种磨削主轴
CN115213814B (zh) * 2022-07-28 2024-01-23 宁波芯丰精密科技有限公司 一种磨削主轴

Also Published As

Publication number Publication date
TW202030051A (zh) 2020-08-16
KR20200096152A (ko) 2020-08-11
JP2020124753A (ja) 2020-08-20

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Application publication date: 20201002