TW201814820A - 芯片鍵合裝置及鍵合方法 - Google Patents

芯片鍵合裝置及鍵合方法 Download PDF

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TW201814820A
TW201814820A TW106133486A TW106133486A TW201814820A TW 201814820 A TW201814820 A TW 201814820A TW 106133486 A TW106133486 A TW 106133486A TW 106133486 A TW106133486 A TW 106133486A TW 201814820 A TW201814820 A TW 201814820A
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chip
supply unit
pick
substrate
head
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TWI628735B (zh
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王天明
姜曉玉
夏海
陳飛彪
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上海微電子裝備（集團）股份有限公司
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Abstract

本發明有關於一種芯片鍵合裝置及鍵合方法，芯片鍵合裝置包括芯片供應單元；基底供應單元；第一拾取組件，設置於芯片供應單元與基底供應單元間，包括第一轉動部件和設置於第一轉動部件上的第一拾取頭；第二拾取組件，包括第二轉動部件和設置於第二轉動部件上的第二拾取頭，第一拾取組件從芯片供應單元或者第二拾取組件拾取芯片，並將芯片移送至基底供應單元的基底上完成鍵合；以及視覺單元，用於實現第一拾取組件上芯片與基底對準，芯片供應單元、基底供應單元、第二拾取組件及視覺單元分別位於第一拾取頭的四個工位上。本發明通過旋轉實現芯片傳送，提高芯片鍵合的產率；利用第二拾取組件實現芯片翻轉，兼容芯片上的標記面朝上和朝下兩種鍵合方式。

Description

芯片鍵合裝置及鍵合方法
本發明有關於芯片鍵合領域，特別是有關於一種芯片鍵合裝置及鍵合方法。
芯片鍵合是將芯片與載片連接形成的一種互連形式。鍵合芯片一般以標記面朝上的方式放置在分離臺上，通過芯片傳輸手將芯片鍵合到鍵合臺上。目前的芯片鍵合裝置需要從分離臺上拾取芯片，經過長距離的直線傳輸才能到達鍵合台，將芯片鍵合到鍵合臺上，大大影響了鍵合的產率；另外，芯片與鍵合臺上的基底進行鍵合時，會對芯片上的標記面方向有要求，一部分要求標記面朝下鍵合，一部分要求標記面朝上鍵合，需要更換對應的鍵合裝置，以符合鍵合時對標記面方向的要求，進一步降低了鍵合的產率。
本發明提供一種芯片鍵合裝置及鍵合方法，以解決習知的芯片鍵合產率低的問題。
為解決上述技術問題，本發明提供一種芯片鍵合裝置，包括：芯片供應單元，用於提供待鍵合的芯片；基底供應單元，用於提供基底，基底供應單元與芯片供應單元相對設置；第一拾取組件，設置於芯片供應單元與基底供應單元之間，包括第一轉動部件和設置於第一轉動部件上的第一拾取頭；第二拾取組件，設置於芯片供應單元與基底供應單元之間，包括第二轉動部件和設置於第二轉動部件上的第二拾取頭，第一拾取組件用於從芯片供應單元或者第二拾取組件拾取芯片，並將芯片移送至基底供應單元的基底上完成鍵合；以及視覺單元，用於實現第一拾取組件上的芯片與基底的對準，芯片供應單元、基底供應單元、第二拾取組件以及視覺單元分別位於第一拾取頭的四個工位上。
較佳地，第一拾取組件包括一個第一拾取頭，第一拾取頭由第一轉動部件驅動在芯片供應單元、基底供應單元、第二拾取組件以及視覺單元所在的四個工位之間轉換。
較佳地，第一拾取組件包括多個第一拾取頭，多個第一拾取頭均勻設置於第一轉動部件上，且呈周向間隔分佈，多個第一拾取頭中的每一個由第一轉動部件驅動在芯片供應單元、基底供應單元、第二拾取組件以及視覺單元所在的四個工位之間轉換。
較佳地，第一拾取組件包括四個第一拾取頭。
較佳地，第一轉動部件轉動一次的角度與相鄰兩個第一拾取頭之間的角度相同。
較佳地，第二拾取頭從芯片供應單元拾取芯片，由第二轉動部件帶動旋轉，將芯片交接至第一拾取頭。
較佳地，第二轉動部件的旋轉角度為90度。
較佳地，第一拾取頭與第二拾取頭均採用真空吸頭。
較佳地，真空吸頭可沿軸向做直線運動。
本發明更提供了一種芯片鍵合方法，應用於如上所述的芯片鍵合裝置，包括如下步驟：S1：將芯片以標記面朝上的方式上載至芯片供應單元，將基底上載至基底供應單元；S2：判斷要求的鍵合時芯片上標記面的方向；S3：若要求標記面朝下鍵合，則第一拾取組件從芯片供應單元拾取芯片後將芯片移送至基底供應單元的基底上並完成鍵合；S4：若要求標記面朝上鍵合，則由第二拾取組件從芯片供應單元拾取芯片，並交接至第一拾取組件，第一拾取組件將芯片移送至基底供應單元的基底上並完成鍵合。
較佳地，步驟S3及S4中均包括，由視覺單元掃描第一拾取組件上芯片的位置，實現芯片與基底的對準。
與習知技術相比，本發明提供的芯片鍵合裝置及鍵合方法，具有如下優點：
1.本發明中，基底供應單元與芯片供應單元相對設置，結合第一轉動部件的旋轉，實現芯片從芯片供應單元到基底供應單元的傳送，將芯片的長距離直線傳輸轉為垂向的翻轉傳輸，從而大大提高了芯片鍵合的產率；
2.要求芯片上的標記面朝下鍵合時，直接利用第一拾取組件實現芯片的拾取和鍵合；若要求芯片上的標記面朝上鍵合，則利用第二拾取組件先拾取芯片，再利用第一拾取組件與第二拾取組件的交接，實現芯片的翻轉，從而兼容芯片上的標記面朝上鍵合和朝下鍵合兩種情況。
為使本發明的上述目的、特徵和優點能夠更加明顯易懂，下面結合附圖對本發明的具體實施方式做詳細的說明。需說明的是，本發明附圖均採用簡化的形式且均使用非精准的比例，僅用以方便、明晰地輔助說明本發明實施例的目的。
本發明提供的芯片鍵合裝置，如第1圖至第3圖所示，包括：
芯片供應單元10，用於從晶片中分離出單個芯片60，並提供待鍵合的芯片60給下文描述的拾取組件；
基底供應單元20，用於提供基底，與芯片供應單元10相對設置，本實施例中，基底供應單元20倒置於芯片供應單元10上方；
第一拾取組件30，設置於芯片供應單元10與基底供應單元20之間，包括第一轉動部件31和設置於第一轉動部件31上的第一拾取頭32；
第二拾取組件40，同樣設置於芯片供應單元10與基底供應單元20之間，包括第二轉動部件41和設置於第二轉動部件41上的第二拾取頭42，第一拾取組件30從芯片供應單元10或者第二拾取組件40拾取芯片60，並將芯片60移送至基底供應單元20的基底上完成鍵合；以及
視覺單元50，用於實現第一拾取組件30上芯片60與基底的對準，芯片供應單元10、基底供應單元20、第二拾取組件40以及視覺單元50分別位於第一拾取頭32的四個工位上。
具體地，本發明中的基底供應單元20倒置於芯片供應單元10上方，結合第一轉動部件31的旋轉，實現芯片60從芯片供應單元10到基底供應單元20的傳送，將芯片60的長距離直線傳輸轉為垂向的翻轉傳輸，從而大大提高了芯片鍵合的產率。
較佳地，第一拾取頭32的數量可以為一個，第一拾取頭32由第一轉動部件31驅動在芯片供應單元10、基底供應單元20、第二拾取組件40以及視覺單元50所在的四個工位之間轉換，具體地，第一拾取頭32在對應於芯片供應單元10或第二拾取組件40的工位拾取芯片60；在對應於視覺單元50的工位進行位置掃描；在對應於基底供應單元20的工位進行鍵合。
較佳地，請重點參考第3圖，第一拾取頭32的數量為多個（本實施例以4個為例），4個第一拾取頭32均勻設置於第一轉動部件31上，且呈周向間隔分佈，每個第一拾取頭32由第一轉動部件31驅動在芯片供應單元10、基底供應單元20、第二拾取組件40以及視覺單元50所在的四個工位之間轉換。較佳地，請結合第1圖，基底供應單元20、芯片供應單元10、第二拾取組件40以及視覺單元50分別對應設置於第一拾取組件30的上下左右四個方向上，第一轉動部件31轉動停止時，四個第一拾取頭32分別與基底供應單元20、芯片供應單元10、第二拾取組件40以及視覺單元50一一對應。這樣，每個第一拾取頭32可在不同的工位處做不同的動作，進一步提高鍵合效率。
較佳地，第一轉動部件31轉動一次的角度與相鄰兩個第一拾取頭32之間的角度相同，同樣以四個第一拾取頭32為例，第一轉動部件31轉動一次的角度為90°。
較佳地，請重點參考第1圖和第4圖，第二拾取頭42從芯片供應單元10拾取芯片60，由第二轉動部件41帶動旋轉，將芯片60交接至第一拾取頭32，較佳地，第二轉動部件41的旋轉角度為90度。本發明利用第二拾取頭42先拾取芯片60，通過第二轉動部件41的旋轉將芯片60移至某一個第一拾取頭32處，再利用第一拾取頭32與第二拾取頭42的交接，實現芯片60的翻轉。
較佳地，本實施例中，第一拾取頭32與第二拾取頭42均採用真空吸頭，真空吸頭可沿軸向做直線運動，便於芯片60的吸附拾取。
請重點參考第4圖，本發明更提供了一種芯片鍵合方法，應用於如上所述的芯片鍵合裝置，包括如下步驟：
S1：將帶有芯片60的晶片上載至芯片供應單元10，其中芯片60上的標記面61朝上，將基底上載至基底供應單元20；
S2：判斷基底要求的鍵合時芯片60上標記面61的方向；
S3：若要求標記面61朝下鍵合，則第一拾取組件30從芯片供應單元10拾取芯片60後將芯片60移送至基底供應單元20的基底上並完成鍵合，在該過程中，第二拾取組件40保持初始位置不動；
S4：若要求標記面61朝上鍵合，則由第二拾取組件40從芯片供應單元10拾取芯片60，並交接至第一拾取組件30，整個交接過程如第4圖所示，首先，第二拾取頭42吸附芯片60並轉至交接位，某個第一拾取頭32伸出並交接芯片60，然後帶著芯片60縮回，再然後，第二拾取頭42向下旋轉恢復至初始位置，同時轉動部件31帶動該第一拾取頭32旋轉至鍵合位，第一拾取頭32上升進行芯片60的鍵合；當然，第一拾取頭32與第二拾取頭42交接完成後，第一拾取組件將芯片60移送至基底供應單元20的基底上並完成鍵合。
較佳地，步驟S3及S4中均包括，設置一視覺單元50掃描第一拾取組件上芯片60的位置，實現芯片60與基底對準。
綜上所述，本發明提供的芯片鍵合裝置及鍵合方法，芯片鍵合裝置包括芯片供應單元10，用於提供待鍵合的芯片60；基底供應單元20，用於提供基底，與芯片供應單元10相對設置；第一拾取組件30，設置於芯片供應單元10與基底供應單元20之間，包括第一轉動部件31和設置於第一轉動部件31上的第一拾取頭32；第二拾取組件40，設置於芯片供應單元10與基底供應單元20之間，包括第二轉動部件41和設置於第二轉動部件41上的第二拾取頭42，第一拾取組件30從芯片供應單元10或者第二拾取組件40拾取芯片60，並將芯片60移送至基底供應單元20的基底上完成鍵合；以及視覺單元50，用於實現第一拾取組件30上芯片60與基底對準，芯片供應單元10、基底供應單元20、第二拾取組件40以及視覺單元50分別位於第一拾取頭32的四個工位上。本發明利用基底供應單元20與芯片供應單元10的位置關係，結合第一轉動部件31的旋轉，實現芯片60的傳送，將芯片60的長距離直線傳輸轉為垂向的翻轉傳輸，從而大大提高了芯片鍵合的產率；另外，當要求芯片60上的標記面61朝下鍵合時，直接利用第一拾取組件30實現芯片60的拾取和鍵合；若要求芯片60上的標記面61朝上鍵合，則利用第二拾取組件40先拾取芯片60，再利用第一拾取組件30與第二拾取組件40的交接，實現芯片60的翻轉，從而兼容芯片60上的標記面61朝上和朝下兩種鍵合情況。
顯然，本領域的具通常知識者可以對發明進行各種改動和變型而不脫離本發明的精神和範圍。這樣，倘若本發明的這些修改和變型屬於本發明申請專利範圍及其等同技術的範圍之內，則本發明也意圖包括這些改動和變型在內。
10‧‧‧芯片供應單元
20‧‧‧基底供應單元
30‧‧‧第一拾取組件
31‧‧‧第一轉動部件
32‧‧‧第一拾取頭
40‧‧‧第二拾取組件
41‧‧‧第二轉動部件
42‧‧‧第二拾取頭
50‧‧‧視覺單元
60‧‧‧芯片
61‧‧‧標記面
第1圖為本發明一具體實施方式中芯片鍵合裝置的結構示意圖。 第2圖為本發明一具體實施方式中芯片的結構示意圖。 第3圖為本發明一具體實施方式中第一拾取組件的結構示意圖。 第4圖為本發明一具體實施方式中當芯片上的標記面朝上時，第一拾取組件與第二拾取組件的交接流程示意圖。

Claims (11)

  1. 一種芯片鍵合裝置，其包括： 芯片供應單元，用於提供待鍵合的芯片； 基底供應單元，用於提供基底，該基底供應單元與該芯片供應單元相對設置； 第一拾取組件，設置於該芯片供應單元與該基底供應單元之間，包括第一轉動部件和設置於該第一轉動部件上的第一拾取頭； 第二拾取組件，設置於該芯片供應單元與該基底供應單元之間，包括第二轉動部件和設置於該第二轉動部件上的第二拾取頭，該第一拾取組件用於從該芯片供應單元或者該第二拾取組件拾取該芯片，並將該芯片移送至該基底供應單元的該基底上完成鍵合；以及 視覺單元，用於實現該第一拾取組件上的該芯片與該基底的對準，該芯片供應單元、該基底供應單元、該第二拾取組件以及該視覺單元分別位於該第一拾取頭的四個工位上。
  2. 如申請專利範圍第1項所述之芯片鍵合裝置，其中該第一拾取組件包括一個該第一拾取頭，該第一拾取頭由該第一轉動部件驅動在該芯片供應單元、該基底供應單元、該第二拾取組件以及該視覺單元所在的四個工位之間轉換。
  3. 如申請專利範圍第1項所述之芯片鍵合裝置，其中該第一拾取組件包括多個該第一拾取頭，該多個第一拾取頭均勻設置於該第一轉動部件上，且呈周向間隔分佈，該多個第一拾取頭中的每一個由該第一轉動部件驅動在該芯片供應單元、該基底供應單元、該第二拾取組件以及該視覺單元所在的四個工位之間轉換。
  4. 如申請專利範圍第3項所述之芯片鍵合裝置，其中該第一拾取組件包括四個該第一拾取頭。
  5. 如申請專利範圍第3項所述之芯片鍵合裝置，其中該第一轉動部件轉動一次的角度與相鄰兩個該第一拾取頭之間的角度相同。
  6. 如申請專利範圍第1項所述之芯片鍵合裝置，其中該第二拾取頭從該芯片供應單元拾取該芯片，由該第二轉動部件帶動旋轉，將該芯片交接至該第一拾取頭。
  7. 如申請專利範圍第6項所述之芯片鍵合裝置，其中該第二轉動部件的旋轉角度為90度。
  8. 如申請專利範圍第6項所述之芯片鍵合裝置，其中該第一拾取頭與該第二拾取頭均採用真空吸頭。
  9. 如申請專利範圍第8項所述之芯片鍵合裝置，其中該真空吸頭可沿軸向做直線運動。
  10. 一種芯片鍵合方法，應用於如申請專利範圍第1項所述之芯片鍵合裝置，其包括如下步驟： S1：將該芯片以標記面朝上的方式上載至該芯片供應單元，將該基底上載至該基底供應單元； S2：判斷要求的鍵合時該芯片上標記面的方向； S3：若要求標記面朝下鍵合，則該第一拾取組件從該芯片供應單元拾取該芯片後，將該芯片移送至該基底供應單元的該基底上並完成鍵合；以及 S4：若要求標記面朝上鍵合，則由該第二拾取組件從該芯片供應單元拾取該芯片，並交接至該第一拾取組件，該第一拾取組件將該芯片移送至該基底供應單元的該基底上並完成鍵合。
  11. 如申請專利範圍第10項所述之芯片鍵合方法，其中該步驟S3及該步驟S4中均包括，由該視覺單元掃描該第一拾取組件上該芯片的位置，實現該芯片與該基底的對準。
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