WO2018059374A1 - 一种芯片键合装置及键合方法 - Google Patents

一种芯片键合装置及键合方法 Download PDF

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Publication number
WO2018059374A1
WO2018059374A1 PCT/CN2017/103331 CN2017103331W WO2018059374A1 WO 2018059374 A1 WO2018059374 A1 WO 2018059374A1 CN 2017103331 W CN2017103331 W CN 2017103331W WO 2018059374 A1 WO2018059374 A1 WO 2018059374A1
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Prior art keywords
chip
pick
supply unit
substrate
assembly
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PCT/CN2017/103331
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English (en)
French (fr)
Inventor
王天明
姜晓玉
夏海
陈飞彪
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上海微电子装备（集团）股份有限公司
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Application filed by 上海微电子装备（集团）股份有限公司 filed Critical 上海微电子装备（集团）股份有限公司
Priority to SG11201902829TA priority Critical patent/SG11201902829TA/en
Priority to JP2019517224A priority patent/JP2019530247A/ja
Priority to US16/338,260 priority patent/US10658327B1/en
Priority to KR1020197011896A priority patent/KR102192202B1/ko
Publication of WO2018059374A1 publication Critical patent/WO2018059374A1/zh

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    • H—ELECTRICITY
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    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
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    • H01L24/75—Apparatus for connecting with bump connectors or layer connectors
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    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/52—Mounting semiconductor bodies in containers
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    • H01L21/67242—Apparatus for monitoring, sorting or marking
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    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
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    • H01L21/67721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrates to be conveyed not being semiconductor wafers or large planar substrates, e.g. chips, lead frames
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    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H01L21/681—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment using optical controlling means
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    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
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    • H01L2224/757—Means for aligning
    • H01L2224/75743—Suction holding means
    • H01L2224/75745—Suction holding means in the upper part of the bonding apparatus, e.g. in the bonding head
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    • H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
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    • H01L2224/81121—Active alignment, i.e. by apparatus steering, e.g. optical alignment using marks or sensors
    • H01L2224/8113—Active alignment, i.e. by apparatus steering, e.g. optical alignment using marks or sensors using marks formed on the semiconductor or solid-state body
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Definitions

  • the present invention relates to the field of chip bonding, and in particular to a chip bonding device and a bonding method.
  • Chip bonding is an interconnection form formed by connecting a chip to a carrier.
  • the bonding chip is generally placed on the separation table with the mark side facing up, and the chip is bonded to the bonding table by the chip transfer hand.
  • the current chip bonding device needs to pick up the chip from the separation table, and after long-distance linear transmission, it can reach the bonding table, and the chip is bonded to the bonding table, which greatly affects the yield of the bonding; in addition, the chip and the key
  • the substrates on the mating are bonded, there is a requirement for the direction of the marking surface on the chip. Some of the markings are required to face down, and some of the markings are facing up, and the corresponding bonding device needs to be replaced to match the key. The requirement for the orientation of the marking surface at the same time further reduces the yield of the bonding.
  • the invention provides a chip bonding device and a bonding method to solve the problem that the existing chip bonding yield is low.
  • the present invention provides a chip bonding apparatus, including:
  • a chip supply unit for providing a chip to be bonded
  • a substrate supply unit for providing a substrate, the substrate supply unit being disposed opposite to the chip supply unit;
  • a first pick-up assembly disposed between the chip supply unit and the substrate supply unit, including a first rotating component and a first pick-up head disposed on the first rotating component;
  • a second pick-up assembly disposed between the chip supply unit and the substrate supply unit, including a second rotating member and a second pick-up head disposed on the second rotating member, the first picking a component for picking up a chip from the chip supply unit or the second pick-up component and transferring the chip to a substrate of the substrate supply unit to complete bonding;
  • a vision unit for implementing alignment of the chip on the first pick-up assembly with the substrate, the chip supply unit, the substrate supply unit, the second pick-up assembly, and the vision unit being respectively located at the first pick-up head At the workstation.
  • the first pick-up assembly includes a first pick-up head, and the first pick-up head is driven by the first rotating member at the chip supply unit, the substrate supply unit, the second pick-up assembly, and the visual unit The conversion between the four stations.
  • the first pick-up assembly includes a plurality of first pick-up heads, the plurality of first pick-up heads are evenly disposed on the first rotating member, and are circumferentially spaced, the plurality of first Each of the pick-up heads is driven by the first rotating member to switch between four stations in which the chip supply unit, the substrate supply unit, the second pick-up assembly, and the vision unit are located.
  • the first picking assembly comprises four first picking heads.
  • the angle at which the first rotating member rotates once is the same as the angle between the adjacent two first picking heads.
  • the second pick-up head picks up the chip from the chip supply unit, and the second rotating member drives the rotation to transfer the chip to the first pick-up head.
  • the second rotating member has a rotation angle of 90 degrees.
  • both the first pick-up head and the second pick-up head employ a vacuum nozzle.
  • the vacuum nozzle is linearly movable in the axial direction.
  • the present invention also provides a chip bonding method for the chip bonding apparatus as described above, comprising the steps of:
  • the position of the chip on the first pick-up component is scanned by the visual unit to achieve alignment of the chip with the substrate.
  • the chip bonding device and the bonding method provided by the invention have the following advantages:
  • the substrate supply unit is disposed opposite to the chip supply unit, and in combination with the rotation of the first rotating member, the transfer of the chip from the chip supply unit to the substrate supply unit is realized, and the long-distance linear transmission of the chip is converted into Vertical flip transfer, which greatly increases the yield of chip bonding;
  • the first picking component is directly used for picking and bonding of the chip; if the mark side of the chip is required to face up, the second picking component is used to pick up the chip first.
  • FIG. 1 is a schematic structural view of a chip bonding apparatus according to an embodiment of the present invention.
  • FIG. 2 is a schematic structural view of a chip according to an embodiment of the present invention.
  • FIG. 3 is a schematic structural view of a first pick-up assembly according to an embodiment of the present invention.
  • FIG. 4 is a first pick-up group when the mark face on the chip faces upward in an embodiment of the present invention. Schematic diagram of the process of handover of the piece to the second picking assembly.
  • 10-chip supply unit 20-substrate supply unit, 30-first pick-up assembly, 31-first rotating member, 32-first pick-up head, 40-second pick-up assembly, 41-second rotating member, 42-second pick-up head, 50-vision unit, 60-chip, 61-marked face.
  • the chip bonding device provided by the present invention includes:
  • a chip supply unit 10 for separating a single chip 60 from a wafer and providing a chip 60 to be bonded to the pickup assembly described below;
  • a substrate supply unit 20 for providing a substrate opposite to the chip supply unit 10 in this embodiment, the substrate supply unit 20 is placed above the chip supply unit 10;
  • the second pick-up assembly 40 is also disposed between the chip supply unit 10 and the substrate supply unit 20, and includes a second rotating member 41 and a second pick-up head 42 disposed on the second rotating member 41.
  • the first pick-up assembly 30 picks up the chip 60 from the chip supply unit 10 or the second pick-up assembly 40, and transfers the chip 60 to the substrate of the substrate supply unit 20 to complete bonding;
  • a visual unit 50 configured to implement a pair of the chip 60 and the substrate on the first pick-up assembly 30
  • the chip supply unit 10, the substrate supply unit 20, the second pickup assembly 40, and the vision unit 50 are respectively located at four stations of the first pickup head 30.
  • the substrate supply unit 20 in the present invention is placed upside down on the chip supply unit 10, and combined with the rotation of the first rotating member 31, the transfer of the chip 60 from the chip supply unit 10 to the substrate supply unit 20 is realized.
  • the long-distance linear transmission of 60 is turned into a vertical inversion transmission, thereby greatly increasing the yield of chip bonding.
  • the number of the first pick-up heads 32 may be one, and the first pick-up head 32 is driven by the first rotating member 31 at the chip supply unit 10, the substrate supply unit 20, and the second pick-up assembly. 40 and between four stations in which the vision unit 50 is located, in particular, the first pick-up head 32 picks up the chip 60 at a station corresponding to the chip supply unit 10 or the second pick-up assembly 40; corresponding to the visual unit
  • the station of 50 performs position scanning; bonding is performed at a station corresponding to the substrate supply unit 20.
  • the number of the first pick-up heads 32 is plural (in this embodiment, four are taken as an example), and the four first pick-up heads 32 are evenly disposed on the first rotation.
  • each of the first pick-up heads 32 is driven by the first rotating member 31 at the chip supply unit 10, the substrate supply unit 20, the second pick-up assembly 40, and the visual unit Conversion between the four stations where 50 is located.
  • the substrate supply unit 20, the chip supply unit 10, the second pick-up assembly 40, and the visual unit 50 are respectively disposed in four directions of up, down, left, and right of the first pick-up assembly 30, respectively.
  • the four first picking heads 32 are in one-to-one correspondence with the substrate supply unit 20, the chip supply unit 10, the second pick-up assembly 40, and the visual unit 50, respectively. In this way, each of the first pick-up heads 32 can perform different actions at different stations, further improving the bonding efficiency.
  • the angle at which the first rotating member 31 rotates is the same as the angle between the adjacent two first picking heads 32.
  • the four first picking heads 32 are taken as an example, and the first rotating member 31 is rotated.
  • the secondary angle is 90°.
  • the second pick-up head 42 picks up the chip 60 from the chip supply unit 10, and the second rotating member 41 drives the rotation to transfer the chip 60 to the
  • the first pick-up head 32 preferably, the second rotating member 41 has a rotation angle of 90 degrees.
  • the present invention utilizes the second pick-up head 42 to pick up the chip 60 first, and the chip 60 is moved to a certain first pick-up head 32 by the rotation of the second rotating member 41, and then the first pick-up head 32 and the second pick-up head 42 are handed over. , the flipping of the chip 60 is achieved.
  • the first pick-up head 32 and the second pick-up head 42 both adopt vacuum suction heads, and the vacuum suction heads can linearly move in the axial direction to facilitate the pick-up and pickup of the chip 60.
  • the present invention further provides a chip bonding method applied to the chip bonding apparatus as described above, comprising the following steps:
  • the first picking assembly 30 picks up the chip 60 from the chip supplying unit 10, transfers the chip 60 to the substrate of the substrate supplying unit 20, and completes the key.
  • the second picking assembly 40 remains in the initial position;
  • the marking surface 61 is required to be upwardly bonded
  • the chip 60 is picked up from the chip supply unit 10 by the second picking assembly 40 and handed over to the first picking assembly 30, and the entire handover process is as shown in FIG.
  • the second pick-up head 42 adsorbs the chip 60 and turns to the transfer position.
  • a certain first pick-up head 32 extends and delivers the chip 60, and then retracts with the chip 60. Then, the second pick-up head 42 is lowered.
  • the rotation returns to the initial position, while the rotating member 31 drives the first pick-up head 32 to rotate to the bonding position, and the first pick-up head 32 rises to perform bonding of the chip 60; of course, the first pick-up head 32 and the second pick-up head 42 are handed over Upon completion, the first pick-up assembly transfers the chip 60 to the substrate supply Bonding is completed on the substrate of unit 20.
  • each of the steps S3 and S4 includes setting a visual unit 50 to scan the position of the chip 60 on the first pick-up assembly to realize alignment of the chip 60 with the substrate.
  • the present invention provides a chip bonding apparatus and a bonding method, the chip bonding apparatus including a chip supply unit 10 for providing a chip 60 to be bonded, and a substrate supply unit 20 for providing a substrate.
  • the first pick-up assembly 30 is disposed between the chip supply unit 10 and the substrate supply unit 20, and includes a first rotating member 31 and a first rotating member 31.
  • a first pick-up head 32 a second pick-up assembly 40 disposed between the chip supply unit 10 and the substrate supply unit 20, including a second rotating member 41 and a second rotating member 41 a second pick-up head 42 that picks up the chip 60 from the chip supply unit 10 or the second pick-up assembly 40 and transfers the chip 60 onto the substrate of the substrate supply unit 20 Bonding; and a visual unit 50 for implementing alignment of the chip 60 on the first pick-up assembly 30 with the substrate, the chip supply unit 10, the substrate supply unit 20, the second pick-up assembly 40, and the visual unit 50 respectively Bit At the four stations of the first pick-up head 42.
  • the present invention utilizes the positional relationship between the substrate supply unit 20 and the chip supply unit 10, in combination with the rotation of the first rotating member 31, to realize the transfer of the chip 60, and converts the long-distance linear transmission of the chip 60 into a vertical reverse transmission, thereby greatly improving The yield of chip bonding; in addition, when the marking surface 61 on the chip 60 is required to be bonded downward, the picking and bonding of the chip 60 is directly performed by the first picking assembly 30; if the marking surface 61 on the chip 60 is required When the bonding is up, the chip 60 is picked up by the second picking component 40, and the chip 60 is turned over by the first picking component 30 and the second picking component 40, so that the marking surface 61 on the compatible chip 60 faces upward. And the two bonding situations.

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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Wire Bonding (AREA)
  • Die Bonding (AREA)

Abstract

提供一种芯片键合装置及键合方法，该装置包括芯片供应单元（10）；基底供应单元（20）；第一拾取组件（30），设置于芯片供应单元（10）与基底供应单元（20）间，包括第一转动部件和设置于第一转动部件上的第一拾取头；第二拾取组件（40），包括第二转动部件和设置于第二转动部件上的第二拾取头，第一拾取组件（30）从芯片供应单元（10）或者第二拾取组件（40）拾取芯片（60），并将芯片（60）移送至基底供应单元（20）的基底上完成键合；以及视觉单元（50），用于实现第一拾取组件（30）上芯片（60）与基底对准，所述芯片供应单元（10）、基底供应单元（20）、第二拾取组件（40）及视觉单元（50）分别位于第一拾取头的四个工位上。通过旋转实现芯片（60）传送，提高芯片（60）键合的产率；利用第二拾取组件（40）实现芯片（60）翻转，兼容芯片（60）上的标记面朝上和朝下两种键合方式。

Description

一种芯片键合装置及键合方法 技术领域
本发明涉及芯片键合领域，特别涉及一种芯片键合装置及键合方法。
背景技术
芯片键合是将芯片与载片连接形成的一种互连形式。键合芯片一般以标记面朝上的方式放置在分离台上，通过芯片传输手将芯片键合到键合台上。目前的芯片键合装置需要从分离台上拾取芯片，经过长距离的直线传输才能到达键合台，将芯片键合到键合台上，大大影响了键合的产率；另外，芯片与键合台上的基底进行键合时，会对芯片上的标记面方向有要求，一部分要求标记面朝下键合，一部分要求标记面朝上键合，需要更换对应的键合装置，以符合键合时对标记面方向的要求，进一步降低了键合的产率。
发明内容
本发明提供一种芯片键合装置及键合方法，以解决现有的芯片键合产率低的问题。
为解决上述技术问题，本发明提供一种芯片键合装置，包括：
芯片供应单元，用于提供待键合的芯片；
基底供应单元，用于提供基底，所述基底供应单元与所述芯片供应单元相对设置；
第一拾取组件，设置于所述芯片供应单元与所述基底供应单元之间，包括第一转动部件和设置于所述第一转动部件上的第一拾取头；
第二拾取组件，设置于所述芯片供应单元与所述基底供应单元之间，包括第二转动部件和设置于所述第二转动部件上的第二拾取头，所述第一拾取 组件用于从所述芯片供应单元或者所述第二拾取组件拾取芯片，并将所述芯片移送至所述基底供应单元的基底上完成键合；以及
视觉单元，用于实现所述第一拾取组件上的芯片与所述基底的对准，所述芯片供应单元、基底供应单元、第二拾取组件以及视觉单元分别位于所述第一拾取头的四个工位上。
较佳地，所述第一拾取组件包括一个第一拾取头，所述第一拾取头由所述第一转动部件驱动在所述芯片供应单元、基底供应单元、第二拾取组件以及视觉单元所在的四个工位之间转换。
较佳地，所述第一拾取组件包括多个第一拾取头，所述多个第一拾取头均匀设置于所述第一转动部件上，且呈周向间隔分布，所述多个第一拾取头中的每一个由所述第一转动部件驱动在所述芯片供应单元、基底供应单元、第二拾取组件以及视觉单元所在的四个工位之间转换。
较佳地，所述第一拾取组件包括四个第一拾取头。
较佳地，所述第一转动部件转动一次的角度与相邻两个第一拾取头之间的角度相同。
较佳地，所述第二拾取头从所述芯片供应单元拾取芯片，由所述第二转动部件带动旋转，将所述芯片交接至所述第一拾取头。
较佳地，所述第二转动部件的旋转角度为90度。
较佳地，所述第一拾取头与第二拾取头均采用真空吸头。
较佳地，所述真空吸头可沿轴向做直线运动。
本发明还提供了一种芯片键合方法，应用于如上所述的芯片键合装置，包括如下步骤：
S1：将芯片以标记面朝上的方式上载至所述芯片供应单元，将基底上载至所述基底供应单元；
S2：判断要求的键合时芯片上标记面的方向；
S3：若要求标记面朝下键合，则所述第一拾取组件从所述芯片供应单元拾取芯片后将所述芯片移送至所述基底供应单元的基底上并完成键合；
S4：若要求标记面朝上键合，则由所述第二拾取组件从所述芯片供应单元拾取芯片，并交接至所述第一拾取组件，所述第一拾取组件将所述芯片移送至所述基底供应单元的基底上并完成键合。
较佳地，所述步骤S3及S4中均包括，由视觉单元扫描所述第一拾取组件上芯片的位置，实现所述芯片与所述基底的对准。
与现有技术相比，本发明提供的芯片键合装置及键合方法，具有如下优点：
1.本发明中，所述基底供应单元与所述芯片供应单元相对设置，结合第一转动部件的旋转，实现芯片从芯片供应单元到基底供应单元的传送，将芯片的长距离直线传输转为垂向的翻转传输，从而大大提高了芯片键合的产率；
2.要求芯片上的标记面朝下键合时，直接利用第一拾取组件实现芯片的拾取和键合；若要求芯片上的标记面朝上键合，则利用第二拾取组件先拾取芯片，再利用第一拾取组件与第二拾取组件的交接，实现芯片的翻转，从而兼容芯片上的标记面朝上键合和朝下键合两种情况。
附图说明
图1为本发明一具体实施方式中芯片键合装置的结构示意图；
图2为本发明一具体实施方式中芯片的结构示意图；
图3为本发明一具体实施方式中第一拾取组件的结构示意图；
图4为本发明一具体实施方式中当芯片上的标记面朝上时，第一拾取组 件与第二拾取组件的交接流程示意图。
图中：10-芯片供应单元、20-基底供应单元、30-第一拾取组件、31-第一转动部件、32-第一拾取头、40-第二拾取组件、41-第二转动部件、42-第二拾取头、50-视觉单元、60-芯片、61-标记面。
具体实施方式
为使本发明的上述目的、特征和优点能够更加明显易懂，下面结合附图对本发明的具体实施方式做详细的说明。需说明的是，本发明附图均采用简化的形式且均使用非精准的比例，仅用以方便、明晰地辅助说明本发明实施例的目的。
本发明提供的芯片键合装置，如图1至图3所示，包括：
芯片供应单元10，用于从晶片中分离出单个芯片60，并提供待键合的芯片60给下文描述的拾取组件；
基底供应单元20，用于提供基底，与所述芯片供应单元10相对设置，本实施例中，所述基底供应单元20倒置于所述芯片供应单元10上方；
第一拾取组件30，设置于所述芯片供应单元10与所述基底供应单元20之间，包括第一转动部件31和设置于所述第一转动部件31上的第一拾取头32；
第二拾取组件40，同样设置于所述芯片供应单元10与所述基底供应单元20之间，包括第二转动部件41和设置于所述第二转动部件41上的第二拾取头42，所述第一拾取组件30从所述芯片供应单元10或者所述第二拾取组件40拾取芯片60，并将所述芯片60移送至所述基底供应单元20的基底上完成键合；以及
视觉单元50，用于实现所述第一拾取组件30上芯片60与所述基底的对 准，所述芯片供应单元10、基底供应单元20、第二拾取组件40以及视觉单元50分别位于所述第一拾取头30的四个工位上。
具体地，本发明中的所述基底供应单元20倒置于所述芯片供应单元10上方，结合第一转动部件31的旋转，实现芯片60从芯片供应单元10到基底供应单元20的传送，将芯片60的长距离直线传输转为垂向的翻转传输，从而大大提高了芯片键合的产率。
较佳地，所述第一拾取头32的数量可以为一个，所述第一拾取头32由所述第一转动部件31驱动在所述芯片供应单元10、基底供应单元20、第二拾取组件40以及视觉单元50所在的四个工位之间转换，具体地，所述第一拾取头32在对应于芯片供应单元10或第二拾取组件40的工位拾取芯片60；在对应于视觉单元50的工位进行位置扫描；在对应于基底供应单元20的工位进行键合。
较佳地，请重点参考图3，所述第一拾取头32的数量为多个(本实施例以4个为例)，4个所述第一拾取头32均匀设置于所述第一转动部件31上，且呈周向间隔分布，每个所述第一拾取头32由所述第一转动部件31驱动在所述芯片供应单元10、基底供应单元20、第二拾取组件40以及视觉单元50所在的四个工位之间转换。较佳地，请结合图1，所述基底供应单元20、芯片供应单元10、第二拾取组件40以及视觉单元50分别对应设置于所述第一拾取组件30的上下左右四个方向上，所述第一转动部件31转动停止时，四个第一拾取头32分别与所述基底供应单元20、芯片供应单元10、第二拾取组件40以及视觉单元50一一对应。这样，每个第一拾取头32可在不同的工位处做不同的动作，进一步提高键合效率。
较佳地，所述第一转动部件31转动一次的角度与相邻两个第一拾取头32之间的角度相同，同样以四个第一拾取头32为例，第一转动部件31转动一 次的角度为90°。
较佳地，请重点参考图1和图4，所述第二拾取头42从所述芯片供应单元10拾取芯片60，由所述第二转动部件41带动旋转，将所述芯片60交接至所述第一拾取头32，较佳地，所述第二转动部件41的旋转角度为90度。本发明利用第二拾取头42先拾取芯片60，通过第二转动部件41的旋转将芯片60移至某一个第一拾取头32处，再利用第一拾取头32与第二拾取头42的交接，实现芯片60的翻转。
较佳地，本实施例中，所述第一拾取头32与第二拾取头42均采用真空吸头，所述真空吸头可沿轴向做直线运动，便于芯片60的吸附拾取。
请重点参考图4，本发明还提供了一种芯片键合方法，应用于如上所述的芯片键合装置，包括如下步骤：
S1：将带有芯片60的晶片上载至所述芯片供应单元10，其中芯片60上的标记面61朝上，将基底上载至所述基底供应单元20；
S2：判断基底要求的键合时芯片60上标记面61的方向；
S3：若要求标记面61朝下键合，则所述第一拾取组件30从所述芯片供应单元10拾取芯片60后将所述芯片60移送至所述基底供应单元20的基底上并完成键合，在该过程中，第二拾取组件40保持初始位置不动；
S4：若要求标记面61朝上键合，则由所述第二拾取组件40从所述芯片供应单元10拾取芯片60，并交接至所述第一拾取组件30，整个交接过程如图4所示，首先，第二拾取头42吸附芯片60并转至交接位，某个第一拾取头32伸出并交接芯片60，然后带着芯片60缩回，再然后，第二拾取头42向下旋转恢复至初始位置，同时转动部件31带动该第一拾取头32旋转至键合位，第一拾取头32上升进行芯片60的键合；当然，第一拾取头32与第二拾取头42交接完成后，所述第一拾取组件将所述芯片60移送至所述基底供应 单元20的基底上并完成键合。
较佳地，所述步骤S3及S4中均包括，设置一视觉单元50扫描所述第一拾取组件上芯片60的位置，实现所述芯片60与所述基底对准。
综上所述，本发明提供的芯片键合装置及键合方法，所述芯片键合装置包括芯片供应单元10，用于提供待键合的芯片60；基底供应单元20，用于提供基底，与所述芯片供应单元10相对设置；第一拾取组件30，设置于所述芯片供应单元10与所述基底供应单元20之间，包括第一转动部件31和设置于所述第一转动部件31上的第一拾取头32；第二拾取组件40，设置于所述芯片供应单元10与所述基底供应单元20之间，包括第二转动部件41和设置于所述第二转动部件41上的第二拾取头42，所述第一拾取组件30从所述芯片供应单元10或者所述第二拾取组件40拾取芯片60，并将所述芯片60移送至所述基底供应单元20的基底上完成键合；以及视觉单元50，用于实现所述第一拾取组件30上芯片60与所述基底对准，所述芯片供应单元10、基底供应单元20、第二拾取组件40以及视觉单元50分别位于所述第一拾取头42的四个工位上。本发明利用基底供应单元20与芯片供应单元10的位置关系，结合第一转动部件31的旋转，实现芯片60的传送，将芯片60的长距离直线传输转为垂向的翻转传输，从而大大提高了芯片键合的产率；另外，当要求芯片60上的标记面61朝下键合时，直接利用第一拾取组件30实现芯片60的拾取和键合；若要求芯片60上的标记面61朝上键合，则利用第二拾取组件40先拾取芯片60，再利用第一拾取组件30与第二拾取组件40的交接，实现芯片60的翻转，从而兼容芯片60上的标记面61朝上和朝下两种键合情况。
显然，本领域的技术人员可以对发明进行各种改动和变型而不脱离本发明的精神和范围。这样，倘若本发明的这些修改和变型属于本发明权利要求及其等同技术的范围之内，则本发明也意图包括这些改动和变型在内。

Claims (11)

  1. 一种芯片键合装置，其特征在于，包括：
    芯片供应单元，用于提供待键合的芯片；
    基底供应单元，用于提供基底，所述基底供应单元与所述芯片供应单元相对设置；
    第一拾取组件，设置于所述芯片供应单元与所述基底供应单元之间，包括第一转动部件和设置于所述第一转动部件上的第一拾取头；
    第二拾取组件，设置于所述芯片供应单元与所述基底供应单元之间，包括第二转动部件和设置于所述第二转动部件上的第二拾取头，所述第一拾取组件用于从所述芯片供应单元或者所述第二拾取组件拾取芯片，并将所述芯片移送至所述基底供应单元的基底上完成键合；以及
    视觉单元，用于实现所述第一拾取组件上的芯片与所述基底的对准，所述芯片供应单元、基底供应单元、第二拾取组件以及视觉单元分别位于所述第一拾取头的四个工位上。
  2. 如权利要求1所述的芯片键合装置，其特征在于，所述第一拾取组件包括一个第一拾取头，所述第一拾取头由所述第一转动部件驱动在所述芯片供应单元、基底供应单元、第二拾取组件以及视觉单元所在的四个工位之间转换。
  3. 如权利要求1所述的芯片键合装置，其特征在于，所述第一拾取组件包括多个第一拾取头，所述多个第一拾取头均匀设置于所述第一转动部件上，且呈周向间隔分布，所述多个第一拾取头中的每一个由所述第一转动部件驱动在所述芯片供应单元、基底供应单元、第二拾取组件以及视觉单元所在的四个工位之间转换。
  4. 如权利要求3所述的芯片键合装置，其特征在于，所述第一拾取组件包括四个第一拾取头。
  5. 如权利要求3所述的芯片键合装置，其特征在于，所述第一转动部件转动一次的角度与相邻两个第一拾取头之间的角度相同。
  6. 如权利要求1所述的芯片键合装置，其特征在于，所述第二拾取头从所述芯片供应单元拾取芯片，由所述第二转动部件带动旋转，将所述芯片交接至所述第一拾取头。
  7. 如权利要求6所述的芯片键合装置，其特征在于，所述第二转动部件的旋转角度为90度。
  8. 如权利要求6所述的芯片键合装置，其特征在于，所述第一拾取头与第二拾取头均采用真空吸头。
  9. 如权利要求8所述的芯片键合装置，其特征在于，所述真空吸头可沿轴向做直线运动。
  10. 一种芯片键合方法，应用于如权利要求1所述的芯片键合装置，其特征在于，包括如下步骤：
    S1：将芯片以标记面朝上的方式上载至所述芯片供应单元，将基底上载至所述基底供应单元；
    S2：判断要求的键合时芯片上标记面的方向；
    S3：若要求标记面朝下键合，则所述第一拾取组件从所述芯片供应单元拾取芯片后，将所述芯片移送至所述基底供应单元的基底上并完成键合；
    S4：若要求标记面朝上键合，则由所述第二拾取组件从所述芯片供应单元拾取芯片，并交接至所述第一拾取组件，所述第一拾取组件将所述芯片移送至所述基底供应单元的基底上并完成键合。
  11. 如权利要求10所述的芯片键合方法，其特征在于，所述步骤S3及S4中均包括，由视觉单元扫描所述第一拾取组件上芯片的位置，实现所述芯片与所述基底的对准。
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