SG11201902829TA - Chip bonding apparatus and bonding method - Google Patents
Chip bonding apparatus and bonding methodInfo
- Publication number
- SG11201902829TA SG11201902829TA SG11201902829TA SG11201902829TA SG11201902829TA SG 11201902829T A SG11201902829T A SG 11201902829TA SG 11201902829T A SG11201902829T A SG 11201902829TA SG 11201902829T A SG11201902829T A SG 11201902829TA SG 11201902829T A SG11201902829T A SG 11201902829TA
- Authority
- SG
- Singapore
- Prior art keywords
- chip
- pick
- supply unit
- bonding
- assembly
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/75—Apparatus for connecting with bump connectors or layer connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/52—Mounting semiconductor bodies in containers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67121—Apparatus for making assemblies not otherwise provided for, e.g. package constructions
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67282—Marking devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67712—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrate being handled substantially vertically
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrates to be conveyed not being semiconductor wafers or large planar substrates, e.g. chips, lead frames
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
- H01L21/681—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment using optical controlling means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
- H01L2224/7565—Means for transporting the components to be connected
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
- H01L2224/757—Means for aligning
- H01L2224/75743—Suction holding means
- H01L2224/75745—Suction holding means in the upper part of the bonding apparatus, e.g. in the bonding head
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
- H01L2224/757—Means for aligning
- H01L2224/75753—Means for optical alignment, e.g. sensors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
- H01L2224/758—Means for moving parts
- H01L2224/75821—Upper part of the bonding apparatus, i.e. bonding head
- H01L2224/75822—Rotational mechanism
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
- H01L2224/758—Means for moving parts
- H01L2224/75841—Means for moving parts of the bonding head
- H01L2224/75842—Rotational mechanism
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
- H01L2224/8112—Aligning
- H01L2224/81121—Active alignment, i.e. by apparatus steering, e.g. optical alignment using marks or sensors
- H01L2224/8113—Active alignment, i.e. by apparatus steering, e.g. optical alignment using marks or sensors using marks formed on the semiconductor or solid-state body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
Abstract
Title: Chip Bonding Apparatus and Bonding Method Provided are a chip bonding apparatus and bonding method. The apparatus comprises: a chip supply unit (); a substrate supply unit (20); a first pick-up assembly (30) arranged between the chip supply unit (10) and the substrate supply unit (20), comprising a first rotating component and a first pick-up head arranged on the first rotating component; a second pick-up assembly (40) comprising a second rotating component and a second pick-up head arranged on the second rotating component, wherein the first pick-up assembly (30) picks up a chip (60) from the chip supply unit (10) or the second pick-up assembly (40), and delivers the chip (60) onto a substrate of the substrate supply unit (20) to complete the bonding; and a vision unit (50) for realizing the alignment of the chip (60) and the substrate on the first pick-up assembly (30), wherein the chip supply unit (10), the substrate supply unit (20), the second pick-up assembly (40) and the vision unit (50) are respectively located on four work positions of the first pick-up head. The chip (60) is transported through rotation, improving the productivity of chip (60) bonding; and the chip (60) is reversed by utilizing the second pick-up assembly (40), which is compatible with two ways of bonding, i.e. a mark face of the chip (60) facing upwards and downwards. Figure 1. 13
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201610877730.9A CN107887295B (en) | 2016-09-30 | 2016-09-30 | A kind of chip bonding device and bonding method |
PCT/CN2017/103331 WO2018059374A1 (en) | 2016-09-30 | 2017-09-26 | Chip bonding apparatus and bonding method |
Publications (1)
Publication Number | Publication Date |
---|---|
SG11201902829TA true SG11201902829TA (en) | 2019-05-30 |
Family
ID=61763126
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG11201902829TA SG11201902829TA (en) | 2016-09-30 | 2017-09-26 | Chip bonding apparatus and bonding method |
Country Status (7)
Country | Link |
---|---|
US (1) | US10658327B1 (en) |
JP (1) | JP2019530247A (en) |
KR (1) | KR102192202B1 (en) |
CN (1) | CN107887295B (en) |
SG (1) | SG11201902829TA (en) |
TW (1) | TWI628735B (en) |
WO (1) | WO2018059374A1 (en) |
Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI809155B (en) * | 2018-09-28 | 2023-07-21 | 日商三星鑽石工業股份有限公司 | Wafer breaking device, inverting device and handling system |
KR102145848B1 (en) * | 2018-11-02 | 2020-08-19 | 세메스 주식회사 | Die transfer module and die bonding apparatus having the same |
CN111380874B (en) * | 2018-12-28 | 2021-04-30 | 上海微电子装备(集团)股份有限公司 | Defect detection device, bonding apparatus, and bonding method |
CN111383972A (en) * | 2018-12-29 | 2020-07-07 | 上海微电子装备(集团)股份有限公司 | Bonding device and bonding method |
US11282722B2 (en) * | 2019-08-23 | 2022-03-22 | YunJun Tang | Chip front surface touchless pick and place tool or flip chip bonder |
US11887876B2 (en) | 2019-11-08 | 2024-01-30 | Semiconductor Technologies & Instruments Pte Ltd | Component handler |
KR102386337B1 (en) * | 2019-11-08 | 2022-04-13 | 세메스 주식회사 | Die transfer module and die bonding apparatus having the same |
KR102316940B1 (en) * | 2019-11-08 | 2021-10-25 | 세메스 주식회사 | Die transfer module and die bonding apparatus having the same |
US20220059406A1 (en) * | 2020-08-21 | 2022-02-24 | Advanced Semiconductor Engineering, Inc. | Method for manufacturing semiconductor package |
CN114284170A (en) * | 2020-09-28 | 2022-04-05 | Pyxis Cf私人有限公司 | Chip mounting device and method for mounting a plurality of chips on a carrier plate |
Family Cites Families (21)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3504166B2 (en) | 1998-11-25 | 2004-03-08 | 株式会社新川 | Flip chip bonding equipment |
JP3732082B2 (en) * | 2000-09-25 | 2006-01-05 | 株式会社新川 | Bonding apparatus and bonding method |
JP4394822B2 (en) * | 2000-12-05 | 2010-01-06 | パナソニック株式会社 | Component mounting equipment |
JP2002198398A (en) * | 2000-12-27 | 2002-07-12 | Shibuya Kogyo Co Ltd | Bonding apparatus |
SG104292A1 (en) * | 2002-01-07 | 2004-06-21 | Advance Systems Automation Ltd | Flip chip bonder and method therefor |
DE10203601A1 (en) * | 2002-01-30 | 2003-08-14 | Siemens Ag | Chip removal device, chip removal system, placement system and method for removing chips from a wafer |
JP3739752B2 (en) * | 2003-02-07 | 2006-01-25 | 株式会社 ハリーズ | Small-piece transfer device capable of random-cycle shifting |
JP4595740B2 (en) * | 2005-08-16 | 2010-12-08 | パナソニック株式会社 | Chip inversion device, chip inversion method, and chip mounting device |
CN101341587B (en) * | 2005-12-22 | 2010-10-27 | 芝浦机械电子株式会社 | Apparatus and method for mounting electronic component |
DE102006002367B3 (en) * | 2006-01-17 | 2007-10-04 | Mühlbauer Ag | Apparatus and method for transferring a plurality of chips from a wafer to a substrate |
CN100414679C (en) * | 2006-04-12 | 2008-08-27 | 中南大学 | Thermal ultrasonic reverse chip key binder |
JP2013143542A (en) * | 2012-01-12 | 2013-07-22 | Tokyo Electron Ltd | Semiconductor device manufacturing system and semiconductor device manufacturing method |
CN103489811A (en) * | 2012-06-11 | 2014-01-01 | 北京中电科电子装备有限公司 | Dual-path chip-pickup turning mechanism on bonding equipment |
JP2014075531A (en) * | 2012-10-05 | 2014-04-24 | Samsung Techwin Co Ltd | Component mounting apparatus |
WO2014087491A1 (en) * | 2012-12-04 | 2014-06-12 | 上野精機株式会社 | Transfer device |
US20140341691A1 (en) * | 2013-05-14 | 2014-11-20 | Kui Kam Lam | Bonding apparatus having a plurality of rotary transfer arms for transferring electronic devices for bonding |
JP2015204420A (en) | 2014-04-15 | 2015-11-16 | 株式会社ディスコ | Conveying device for tabular object, and cutting device |
KR101614204B1 (en) * | 2014-04-29 | 2016-04-20 | 세메스 주식회사 | Unit for picking up a die, apparatus and method for bonding the same and |
KR102295986B1 (en) * | 2014-12-01 | 2021-08-31 | 삼성디스플레이 주식회사 | Chip bonding apparatus and chip bonding method |
CN104701199B (en) * | 2015-03-20 | 2018-03-13 | 北京中电科电子装备有限公司 | A kind of flip-chip bonding apparatus |
DE102016117815B4 (en) * | 2016-09-21 | 2018-04-12 | Asm Assembly Systems Gmbh & Co. Kg | Caching of FCOB chips in a chip transfer device |
-
2016
- 2016-09-30 CN CN201610877730.9A patent/CN107887295B/en active Active
-
2017
- 2017-09-26 SG SG11201902829TA patent/SG11201902829TA/en unknown
- 2017-09-26 KR KR1020197011896A patent/KR102192202B1/en active IP Right Grant
- 2017-09-26 US US16/338,260 patent/US10658327B1/en active Active
- 2017-09-26 WO PCT/CN2017/103331 patent/WO2018059374A1/en active Application Filing
- 2017-09-26 JP JP2019517224A patent/JP2019530247A/en active Pending
- 2017-09-29 TW TW106133486A patent/TWI628735B/en active
Also Published As
Publication number | Publication date |
---|---|
US20200144218A1 (en) | 2020-05-07 |
KR20190053259A (en) | 2019-05-17 |
TWI628735B (en) | 2018-07-01 |
JP2019530247A (en) | 2019-10-17 |
WO2018059374A1 (en) | 2018-04-05 |
KR102192202B1 (en) | 2020-12-16 |
CN107887295A (en) | 2018-04-06 |
TW201814820A (en) | 2018-04-16 |
US10658327B1 (en) | 2020-05-19 |
CN107887295B (en) | 2019-07-23 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
SG11201902829TA (en) | Chip bonding apparatus and bonding method | |
SG11201806511XA (en) | Device and method for bonding substrates | |
MY185883A (en) | Perovskite material layer processing | |
SG10201802976SA (en) | Apparatus and method for mounting components on a substrate | |
MY141317A (en) | Method of mounting a flip chip on a substrate | |
SG11201906510PA (en) | Method and device for bonding chips | |
PH12014000029A1 (en) | Polishing apparatus, and method for polishing and manufacturing glass substrate | |
TW201614783A (en) | Power module | |
WO2012012335A3 (en) | Ultrasonic bonding systems including workholder and ribbon feeding system | |
WO2012166770A3 (en) | Heated wafer carrier profiling | |
SG11201902878VA (en) | Batch bonding apparatus and bonding method | |
TW200705281A (en) | IC chip mounting method | |
NZ727729A (en) | Roller transfer application method and application device for hot-melt adhesive | |
WO2012167027A3 (en) | Protective layer for protecting tsv tips during thermo-compressive bonding | |
SG11201909992QA (en) | Device and method for bonding substrates | |
TW200507232A (en) | Bonding method and bonding device | |
SG11201907047SA (en) | Method for bonding at least three substrates | |
MY198186A (en) | Chip packaging apparatus and method thereof | |
WO2011152958A3 (en) | Tuning of polishing process in multi-carrier head per platen polishing station | |
MY160071A (en) | Apparatus for Mounting Semiconductor Chips | |
WO2015107290A3 (en) | Process for placing and bonding chips on a receiving substrate using a pad, by means of a magnetic, electrostatic or electromagnetic force | |
WO2018101743A3 (en) | Laminate | |
MY172714A (en) | Method and apparatus for mounting electronic or optical components on a substrate | |
SG11201909803PA (en) | Electronic component mounting apparatus | |
AU2015243021A1 (en) | Process and formulation to join ceramic forms while maintaining structural and physical characteristics across the bond surface |