WO2011152958A3 - Tuning of polishing process in multi-carrier head per platen polishing station - Google Patents

Tuning of polishing process in multi-carrier head per platen polishing station Download PDF

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Publication number
WO2011152958A3
WO2011152958A3 PCT/US2011/035631 US2011035631W WO2011152958A3 WO 2011152958 A3 WO2011152958 A3 WO 2011152958A3 US 2011035631 W US2011035631 W US 2011035631W WO 2011152958 A3 WO2011152958 A3 WO 2011152958A3
Authority
WO
WIPO (PCT)
Prior art keywords
carrier head
polishing
substrate
tuning
station
Prior art date
Application number
PCT/US2011/035631
Other languages
French (fr)
Other versions
WO2011152958A2 (en
Inventor
David H. Mai
Stephen Jew
Xiaoyuan Hu
Original Assignee
Applied Materials, Inc.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Applied Materials, Inc. filed Critical Applied Materials, Inc.
Priority to CN2011800073558A priority Critical patent/CN102725827A/en
Priority to KR1020127021064A priority patent/KR20130066562A/en
Publication of WO2011152958A2 publication Critical patent/WO2011152958A2/en
Publication of WO2011152958A3 publication Critical patent/WO2011152958A3/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/042—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor

Abstract

An apparatus and method for simulating a substrate being polished in a multiple carrier head per platen station when no substrate is provided in one or more of the multiple carrier heads is described. In one embodiment, a method for processing a substrate includes providing a single substrate to a polishing station adapted to process a plurality of substrates on a single polishing pad using at least a first carrier head and a second carrier head, retaining the single substrate in the first carrier head while the second carrier head remains substrate-free, urging the first carrier head and the second carrier head toward a polishing surface of the polishing pad; and providing relative movement between the polishing pad and the first carrier head.
PCT/US2011/035631 2010-06-03 2011-05-06 Tuning of polishing process in multi-carrier head per platen polishing station WO2011152958A2 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
CN2011800073558A CN102725827A (en) 2010-06-03 2011-05-06 Tuning of polishing process in multi-carrier head per platen polishing station
KR1020127021064A KR20130066562A (en) 2010-06-03 2011-05-06 Tuning of polishing process in multi-carrier head per platen polishing station

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US12/793,389 2010-06-03
US12/793,389 US20110300776A1 (en) 2010-06-03 2010-06-03 Tuning of polishing process in multi-carrier head per platen polishing station

Publications (2)

Publication Number Publication Date
WO2011152958A2 WO2011152958A2 (en) 2011-12-08
WO2011152958A3 true WO2011152958A3 (en) 2012-03-08

Family

ID=45064809

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2011/035631 WO2011152958A2 (en) 2010-06-03 2011-05-06 Tuning of polishing process in multi-carrier head per platen polishing station

Country Status (5)

Country Link
US (1) US20110300776A1 (en)
KR (1) KR20130066562A (en)
CN (1) CN102725827A (en)
TW (1) TW201203343A (en)
WO (1) WO2011152958A2 (en)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9102033B2 (en) * 2010-11-24 2015-08-11 Taiwan Semiconductor Manufacturing Company, Ltd. Apparatus and method for target thickness and surface profile uniformity control of multi-head chemical mechanical polishing process
JP6046933B2 (en) 2012-07-10 2016-12-21 株式会社荏原製作所 Polishing method
US20140020830A1 (en) * 2012-07-19 2014-01-23 Applied Materials, Inc. Carrier Head Sweep Motor Current for In-Situ Monitoring
US9227293B2 (en) 2012-11-21 2016-01-05 Applied Materials, Inc. Multi-platen multi-head polishing architecture
US20140141694A1 (en) * 2012-11-21 2014-05-22 Applied Materials, Inc. In-Sequence Spectrographic Sensor
US9056383B2 (en) * 2013-02-26 2015-06-16 Applied Materials, Inc. Path for probe of spectrographic metrology system
US20140242877A1 (en) * 2013-02-26 2014-08-28 Applied Materials, Inc. Spectrographic metrology with multiple measurements
JP6340205B2 (en) * 2014-02-20 2018-06-06 株式会社荏原製作所 Polishing pad conditioning method and apparatus
JP6311446B2 (en) * 2014-05-19 2018-04-18 株式会社Sumco Silicon wafer manufacturing method
US10864612B2 (en) * 2016-12-14 2020-12-15 Taiwan Semiconductor Manufacturing Company, Ltd. Polishing pad and method of using

Citations (4)

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Publication number Priority date Publication date Assignee Title
US6203408B1 (en) * 1999-08-26 2001-03-20 Chartered Semiconductor Manufacturing Ltd. Variable pressure plate CMP carrier
JP2003249467A (en) * 2002-02-26 2003-09-05 Matsushita Electric Ind Co Ltd Substrate polishing method
US6623329B1 (en) * 2000-08-31 2003-09-23 Micron Technology, Inc. Method and apparatus for supporting a microelectronic substrate relative to a planarization pad
US20100041316A1 (en) * 2008-08-14 2010-02-18 Yulin Wang Method for an improved chemical mechanical polishing system

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US5649854A (en) * 1994-05-04 1997-07-22 Gill, Jr.; Gerald L. Polishing apparatus with indexing wafer processing stations
JP3594357B2 (en) * 1995-04-10 2004-11-24 株式会社荏原製作所 Polishing method and apparatus
JPH09174430A (en) * 1995-12-27 1997-07-08 Komatsu Electron Metals Co Ltd Polishing device for semiconductor wafer
US6190243B1 (en) * 1998-05-07 2001-02-20 Ebara Corporation Polishing apparatus
US6113465A (en) * 1998-06-16 2000-09-05 Speedfam-Ipec Corporation Method and apparatus for improving die planarity and global uniformity of semiconductor wafers in a chemical mechanical polishing context
US6271140B1 (en) * 1998-10-01 2001-08-07 Vanguard International Semiconductor Corporation Coaxial dressing for chemical mechanical polishing
JP2001018169A (en) * 1999-07-07 2001-01-23 Ebara Corp Polishing device
US6293845B1 (en) * 1999-09-04 2001-09-25 Mitsubishi Materials Corporation System and method for end-point detection in a multi-head CMP tool using real-time monitoring of motor current
US6413152B1 (en) * 1999-12-22 2002-07-02 Philips Electronics North American Corporation Apparatus for performing chemical-mechanical planarization with improved process window, process flexibility and cost
US6533645B2 (en) * 2000-01-18 2003-03-18 Applied Materials, Inc. Substrate polishing article
US6942545B2 (en) * 2001-04-20 2005-09-13 Oriol, Inc. Apparatus and method for sequentially polishing and loading/unloading semiconductor wafers
US6390902B1 (en) * 2001-06-06 2002-05-21 United Microelectronics Corp. Multi-conditioner arrangement of a CMP system
US6575818B2 (en) * 2001-06-27 2003-06-10 Oriol Inc. Apparatus and method for polishing multiple semiconductor wafers in parallel
US6780083B2 (en) * 2002-04-19 2004-08-24 Peter Wolters Cmp-Systeme Gmbh & Co. Kg Apparatus and method for the chemical mechanical polishing of the surface of circular flat workpieces, in particular semi-conductor wafers
KR20060017591A (en) * 2003-04-21 2006-02-24 이노플라 아엔씨 Apparatus and method for polishing semiconductor wafers using one or more polishing surfaces
US7040955B1 (en) * 2005-01-28 2006-05-09 Strasbaugh Chemical-mechanical planarization tool force calibration method and system
JP2007237313A (en) * 2006-03-07 2007-09-20 Matsushita Electric Ind Co Ltd Method for polishing substrate, and method for manufacturing semi-conductor apparatus

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6203408B1 (en) * 1999-08-26 2001-03-20 Chartered Semiconductor Manufacturing Ltd. Variable pressure plate CMP carrier
US6623329B1 (en) * 2000-08-31 2003-09-23 Micron Technology, Inc. Method and apparatus for supporting a microelectronic substrate relative to a planarization pad
JP2003249467A (en) * 2002-02-26 2003-09-05 Matsushita Electric Ind Co Ltd Substrate polishing method
US20100041316A1 (en) * 2008-08-14 2010-02-18 Yulin Wang Method for an improved chemical mechanical polishing system

Also Published As

Publication number Publication date
CN102725827A (en) 2012-10-10
WO2011152958A2 (en) 2011-12-08
KR20130066562A (en) 2013-06-20
US20110300776A1 (en) 2011-12-08
TW201203343A (en) 2012-01-16

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