WO2012018425A3 - Real-time monitoring of retaining ring thickness and lifetime - Google Patents

Real-time monitoring of retaining ring thickness and lifetime Download PDF

Info

Publication number
WO2012018425A3
WO2012018425A3 PCT/US2011/036731 US2011036731W WO2012018425A3 WO 2012018425 A3 WO2012018425 A3 WO 2012018425A3 US 2011036731 W US2011036731 W US 2011036731W WO 2012018425 A3 WO2012018425 A3 WO 2012018425A3
Authority
WO
WIPO (PCT)
Prior art keywords
retaining ring
carrier head
lifetime
real
time monitoring
Prior art date
Application number
PCT/US2011/036731
Other languages
French (fr)
Other versions
WO2012018425A2 (en
Inventor
Peter Mcreynolds
Eric S. Rondum
Garlen C. Leung
Adam H. Zhong
Gregory E. Menk
Gopalakrishna B. Prabhu
Thomas H. Osterheld
Original Assignee
Applied Materials, Inc.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Applied Materials, Inc. filed Critical Applied Materials, Inc.
Priority to CN201180007401.4A priority Critical patent/CN102725830B/en
Priority to JP2013521776A priority patent/JP2013532588A/en
Priority to KR1020127020850A priority patent/KR101754855B1/en
Publication of WO2012018425A2 publication Critical patent/WO2012018425A2/en
Publication of WO2012018425A3 publication Critical patent/WO2012018425A3/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/005—Control means for lapping machines or devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/042—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
    • B24B37/30—Work carriers for single side lapping of plane surfaces
    • B24B37/32—Retaining rings
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/12—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving optical means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)

Abstract

A method and apparatus for monitoring the condition of a surface of a retaining ring disposed on a carrier head in a polishing module is described. In one embodiment, an apparatus is provided. The apparatus includes a carrier head movable in a travel path between at least one polishing station for polishing a substrate as the substrate is retained in the carrier head, and a transfer station for transferring the substrate to and from the carrier head, the carrier head having a retaining ring, and a sensor disposed in the travel path of the carrier head, the sensor operable to provide a metric indicative of a condition of the retaining ring.
PCT/US2011/036731 2010-07-26 2011-05-17 Real-time monitoring of retaining ring thickness and lifetime WO2012018425A2 (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
CN201180007401.4A CN102725830B (en) 2010-07-26 2011-05-17 The thickness of retainer ring and the immediately monitoring method and apparatus of useful life
JP2013521776A JP2013532588A (en) 2010-07-26 2011-05-17 Real-time monitoring of retaining ring thickness and life
KR1020127020850A KR101754855B1 (en) 2010-07-26 2011-05-17 Real-time monitoring of retaining ring thickness and lifetime

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US12/843,793 US20120021671A1 (en) 2010-07-26 2010-07-26 Real-time monitoring of retaining ring thickness and lifetime
US12/843,793 2010-07-26

Publications (2)

Publication Number Publication Date
WO2012018425A2 WO2012018425A2 (en) 2012-02-09
WO2012018425A3 true WO2012018425A3 (en) 2012-05-18

Family

ID=45494015

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2011/036731 WO2012018425A2 (en) 2010-07-26 2011-05-17 Real-time monitoring of retaining ring thickness and lifetime

Country Status (6)

Country Link
US (1) US20120021671A1 (en)
JP (1) JP2013532588A (en)
KR (1) KR101754855B1 (en)
CN (1) CN102725830B (en)
TW (1) TWI530359B (en)
WO (1) WO2012018425A2 (en)

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI381904B (en) * 2009-12-03 2013-01-11 Nat Univ Chung Cheng The method of detecting the grinding characteristics and service life of the polishing pad
KR101902049B1 (en) * 2012-01-25 2018-09-27 어플라이드 머티어리얼스, 인코포레이티드 Retaining ring monitoring and control of pressure
US9067295B2 (en) * 2012-07-25 2015-06-30 Applied Materials, Inc. Monitoring retaining ring thickness and pressure control
US9242338B2 (en) * 2013-10-22 2016-01-26 Globalfoundries Singapore Pte. Ltd. CMP head structure
US9227294B2 (en) * 2013-12-31 2016-01-05 Taiwan Semiconductor Manufacturing Company Ltd. Apparatus and method for chemical mechanical polishing
JP2015188955A (en) 2014-03-27 2015-11-02 株式会社荏原製作所 Polishing device
TWI658899B (en) * 2014-03-31 2019-05-11 日商荏原製作所股份有限公司 Polishing apparatus and polishing method
JP6344950B2 (en) * 2014-03-31 2018-06-20 株式会社荏原製作所 Polishing apparatus and polishing method
US9878421B2 (en) * 2014-06-16 2018-01-30 Applied Materials, Inc. Chemical mechanical polishing retaining ring with integrated sensor
US10441881B2 (en) * 2015-01-09 2019-10-15 Ironburg Inventions Limited Controller for a games console
CN105397618B (en) * 2015-10-20 2018-03-06 上海华力微电子有限公司 Retainer ring for work-table of chemicomechanical grinding mill
KR102461598B1 (en) * 2015-12-18 2022-11-01 주식회사 케이씨텍 Apparatus of loading substrate in chemical mechanical polishing system
JP6577385B2 (en) * 2016-02-12 2019-09-18 株式会社荏原製作所 Substrate holding module, substrate processing apparatus, and substrate processing method
JP7356996B2 (en) * 2018-03-13 2023-10-05 アプライド マテリアルズ インコーポレイテッド Consumable parts monitoring in chemical mechanical polishing equipment
CN108716899B (en) * 2018-06-27 2020-04-10 山东天厚石油科技有限责任公司 Non-contact ultrasonic thickness gauge with high detection precision
JP7220648B2 (en) * 2019-12-20 2023-02-10 株式会社荏原製作所 SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD
US11705354B2 (en) 2020-07-10 2023-07-18 Applied Materials, Inc. Substrate handling systems
US20220184771A1 (en) * 2020-12-14 2022-06-16 Applied Materials, Inc. Polishing system apparatus and methods for defect reduction at a substrate edge
WO2023023444A1 (en) * 2021-08-17 2023-02-23 Tokyo Electron Limited Optical sensors for measuring properties of consumable parts in a semiconductor plasma processing chamber

Citations (4)

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JP2002367941A (en) * 2001-06-08 2002-12-20 Hitachi Ltd Method for manufacturing semiconductor integrated circuit device
US6579151B2 (en) * 2001-08-02 2003-06-17 Taiwan Semiconductor Manufacturing Co., Ltd Retaining ring with active edge-profile control by piezoelectric actuator/sensors
US20070232193A1 (en) * 2006-03-31 2007-10-04 Hozumi Yasuda Substrate holding apparatus, polishing apparatus, and polishing method
JP2009260142A (en) * 2008-04-18 2009-11-05 Panasonic Corp Wafer-polishing apparatus and wafer-polishing method

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US4056970A (en) * 1975-10-30 1977-11-08 Yeda Research And Development Co., Ltd. Ultrasonic velocity and thickness gage
EP0049956A1 (en) * 1980-10-10 1982-04-21 Imperial Chemical Industries Plc Ultrasonic identification of damage in lined structures
US5343750A (en) * 1991-11-25 1994-09-06 General Electric Company Manual ultrasonic scanner for complex surfaces
US5738574A (en) * 1995-10-27 1998-04-14 Applied Materials, Inc. Continuous processing system for chemical mechanical polishing
US6110025A (en) * 1997-05-07 2000-08-29 Obsidian, Inc. Containment ring for substrate carrier apparatus
JP2000153445A (en) * 1998-11-19 2000-06-06 Seiko Epson Corp Dresser for polishing device
US6390908B1 (en) * 1999-07-01 2002-05-21 Applied Materials, Inc. Determining when to replace a retaining ring used in substrate polishing operations
JP2001223190A (en) * 2000-02-08 2001-08-17 Hitachi Ltd Method and device for evaluating surface state of polishing pad, and method and device for manufacturing thin-film device
US6354928B1 (en) * 2000-04-21 2002-03-12 Agere Systems Guardian Corp. Polishing apparatus with carrier ring and carrier head employing like polarities
TW545580U (en) * 2002-06-07 2003-08-01 Nanya Technology Corp CMP device of measuring apparatus with a notched size for measuring the guide ring of wafer edge
US6964597B2 (en) * 2003-06-27 2005-11-15 Khuu's Inc. Retaining ring with trigger for chemical mechanical polishing apparatus
KR101186239B1 (en) * 2004-11-01 2012-09-27 가부시키가이샤 에바라 세이사꾸쇼 Polishing apparatus
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Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002367941A (en) * 2001-06-08 2002-12-20 Hitachi Ltd Method for manufacturing semiconductor integrated circuit device
US6579151B2 (en) * 2001-08-02 2003-06-17 Taiwan Semiconductor Manufacturing Co., Ltd Retaining ring with active edge-profile control by piezoelectric actuator/sensors
US20070232193A1 (en) * 2006-03-31 2007-10-04 Hozumi Yasuda Substrate holding apparatus, polishing apparatus, and polishing method
JP2009260142A (en) * 2008-04-18 2009-11-05 Panasonic Corp Wafer-polishing apparatus and wafer-polishing method

Also Published As

Publication number Publication date
JP2013532588A (en) 2013-08-19
CN102725830B (en) 2016-03-16
KR101754855B1 (en) 2017-07-06
TWI530359B (en) 2016-04-21
TW201204509A (en) 2012-02-01
WO2012018425A2 (en) 2012-02-09
KR20130088738A (en) 2013-08-08
CN102725830A (en) 2012-10-10
US20120021671A1 (en) 2012-01-26

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